Disco Corporation

Kazuki Sugiura

Yoshinori Kakinuma

Yoshikuni Migiyama

Mitsuru Ikushima

Makoto Saito

Takashi Mori

Emiko Kawamura

Shinichi Namioka

Yohei Masuda

Yuta Taniyama

A tape is stuck to the front surface of a workpiece in such a manner that the direction in which the stretch rate becomes the lowest when a predetermined force is applied to the tape is non-parallel to each of multiple planned dividing lines extending in a lattice manner. In this case, each of the multiple planned dividing lines does not extend along the direction perpendicular to this direction. This can reduce the ratio of the region to which the tape does not stick in the front surface of the workpiece in the vicinity of the boundary between each of the multiple planned dividing lines and a region in which a device is formed and suppress deterioration of the processing quality when the workpiece is divided from the back surface side by a cutting blade.

Dividing method of workpiece

A resin applying machine includes a processing chamber, a temperature measuring unit, and a controller. The processing chamber houses therein a holder for holding the wafer, a table that faces the holder, a resin supply unit for supplying a liquid resin to the table, a moving unit for relatively moving the holder and the table closely to each other, and a hardening unit for hardening the liquid resin that has coated the wafer. The temperature measuring unit measures a temperature in the processing chamber. The controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature.

Resin applying machine

There is provided a processing method including the steps of measuring a thickness of the wafer, holding the wafer on a holder, supplying a liquid resin to a table that faces the holder, relatively moving the holder and the table closely to each other to coat the wafer with the liquid resin, and hardening the liquid resin that has coated the wafer. In the resin applying step, a distance by which the holder and the table are to be relatively moved closely to each other to coat the wafer with the liquid resin is determined depending on the measured thickness of the wafer.

Processing method and resin applying machine

A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

Protective sheet disposing method

Apparatus for forming a protective member on a wafer includes a stage for mounting a sheet, the stage having a frame and a chuck table supported to and surrounded by the frame, the frame having a plurality of air supply holes opening to the upper surface of the frame. A holding unit is adapted to be moved to a position opposed to the stage for holding the wafer, and a resin supply unit supplies a liquid resin to the upper surface of the sheet placed on the stage. The liquid resin is formed into the protective member. A sheet pressing pad vertically movably supported so as to be opposed to the sheet is placed on the stage. The sheet pressing pad comes into contact with a part of the sheet placed on the stage in an area inside the air supply holes, thereby pressing the sheet.

Growing community of inventors

Tokyo, Japan

Kazuki Sugiura