3m Innovative Properties Company

Hitachi High-tech Corporation

Tanaka Kikinzoku Kogyo K.k.

3m Innovatives Properties

Noda, Kazuki

Kazuki Noda

Masaru Iwasawa

Richard John Pokorny

Raghunath Padiyath

Takeshi Ooura

Jeffrey C Chang

John S Staral

Kazuhiko Mizuno

Thomas A Isberg

Katsuhiro Aritome

Hideyuki Okada

Shunichi Kariya

Paul F Guehler

Kikuo Shoji

Kenji Tamaru

An electrophoresis device of the present disclosure includes: a capillary filled with a phoresis medium; a buffer container accommodating a buffer solution; a storage portion storing a sample container accommodating a sample; at least one autosampler transporting each of the sample container and the buffer container; and a control unit controlling driving of the autosampler, in which the control unit drives the autosampler such that, while the buffer container is disposed at a capillary position where one end portion of the capillary is positioned, the sample container is transported from the storage portion to a standby position near the capillary position, and, when the buffer container has been transported from the capillary position to the standby position, the sample container is transported from the standby position to the capillary position.

Electrophoresis device

The present invention provides an electrophoresis device with improved abnormality detection capability. The electrophoresis device according to the present invention includes a flow passage with which a phoresis medium is filled, a first and second electrodes disposed at respectively a cathode side and an anode side of the flow passage, a power supply for applying voltage across the first and second electrodes, a pump for feeding the phoresis medium to the flow passage, and a control section. The control section executes operations including filling the flow passage with the phoresis medium, executing electrophoresis of a sample, and applying voltage to the first and second electrodes prior to the sample electrophoresis to determine a state of a current path based on a value of current flowing through the current path. The control section applies voltage to the current path for 20 seconds or longer in the determine step.

A membrane electrode assembly is provided that includes a nanostructured thin film catalyst as the anode electrode catalyst, the membrane electrode assembly having robustness to humidity variation. Additionally, a solid polymer fuel cell including this membrane electrode assembly is provided. A membrane electrode assembly of an embodiment of the present disclosure includes an electrolyte membrane; an anode electrode catalyst layer in contact with the electrolyte membrane; an anode gas diffusion layer; and a fluorinated polymer layer in contact with the anode electrode catalyst layer between the anode electrode catalyst layer and the anode gas diffusion layer. The anode electrode catalyst layer includes a plurality of nanostructure elements including acicular microstructured support whiskers supporting nanoscopic catalyst particles; and the fluorinated polymer layer includes one of fully-fluorinated or partially-fluorinated polymer particles that have been dispersed in a network form.

Membrane electrode assembly and solid polymer fuel cell

Membrane electrode assembly is provided that includes an electrolyte membrane; an electrode catalytic layer including nanostructured elements having acicular micro structured support whiskers bearing acicular nanoscopic catalyst particles; and a gas diffusion layer including a nitrogen-containing compound that includes an anionic ion-exchange group. A method of regenerating the membrane electrode assembly is also provided.

Gas diffusion layer and membrane electrode assembly including gas diffusion layer, and method of regenerating membrane electrode assembly

Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body

Apparatus for manufacturing ultrathin substrate using a laminate body

Provided are a semiconductor surface protecting method and surface protecting sheet employing a material having adequate conformability for irregularities on semiconductor wafer circuit sides and sufficient rigidity as a support during grinding, and which does not become fluid with repeated temperature increases. Also provided is a surface protecting sheet for protection of the circuit side in the step of back side grinding of a semiconductor wafer, the surface protecting sheet having a polymeric film material with a surface protecting layer thereon that may become fluid upon heating and which hardens upon exposure to radiation or upon heating.

Semiconductor surface protecting method

Provided is a laminated body () comprising a substrate () to be ground and a support (), where the substrate () is ground to a very small thickness and can then be separated from the support () without damaging the substrate (). One embodiment of the present invention is a laminated body () comprising a substrate () to be ground, a joining layer () in contact with the substrate () to be ground, a photothermal conversion layer () comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support (). After grinding the substrate surface which is opposite that in contact with the joining layer (), the laminated body () is irradiated through the light transmitting support () and the photothermal conversion layer () decomposes to separate the substrate () and the light transmitting support ().

Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support through a photocurable adhesive by placing the circuit face and the photothermal conversion layer to face each other, thereby forming a laminated body having a non-circuit face on the outside; grinding the non-circuit face of the semiconductor wafer until the semiconductor wafer reaches a desired thickness; dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips; irradiating radiation energy from the light-transmitting support side to decompose the photothermal conversion layer, thereby causing separation into a semiconductor chips having the adhesive layer and a light-transmitting support; and optionally removing the adhesive layer from the semiconductor chips.

Production method of semiconductor chip

A black matrix can be formed by thermal transfer on a receptor substrate for use, for example, in a display application. This black matrix can be used, for example, as a color filter black matrix or a TFT (thin film transistor) black matrix to provide contrast and/or to separate adjacent electrically-conducting components.

Thermal transfer of a black matrix containing carbon black

An improved electronic display that includes components selected to enhance display performance. The improved display includes an active substrate that has a plurality of thin film transistors and a plurality of thermally transferred color filters that include a colorant in a crosslinked binder. The active substrate can also include a black matrix. Other components in the improved display such as a liquid crystal material, spacers, and bottom polarizer, can be selected to enhance display performance characteristics such as brightness, power consumption, response time, weight, and thickness. The invention also provides a method of forming a color filter substrate for displays including the steps of thermally mass transferring a plurality of color filters and crosslinking the plurality of color filters after transfer. Before the crosslinking step, the plurality of color filters can be inspected and removed for reworking of the substrate.

Growing community of inventors

Tokyo, Japan

Kazuki Noda