Mitsubishi Gas Chemical Company, Inc.

Kazuki Kouno

Kousuke Ikeuchi

Ryoma Hashimoto

Yuma Ohno

Hisayuki Kuwahara

Eiichi Honda

Emi Ota

Aoi Yokoo

Yuiga Asai

Tomotaka Wada

Takuma Hanaoka

Saeko Sato

Kazunori Taniguchi

Yuka Akai

Natsumi Nishimoto

Yasuo Kusube

Shohei Nishida

Naoko Kobayashi

An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having from 14 to 24 carbons, a gas barrier laminate and a retort food packaging material using the epoxy resin composition, an odor-proofing or aroma-retaining packaging material, an odor-proofing or aroma-retaining method of sealing an article containing an odorous component or an aromatic component in the packaging material, a heat-shrinkable label, the production method of the heat-shrinkable label, a heat-shrunken label and a bottle having the heat-shrunken label, and a COtransmission prevention method.

Epoxy resin composition, gas barrier multilayer body, retort food packaging material, packaging material for deodorization or aroma retention, heat shrinkable label and method for producing same, heat shrunk label and bottle having same

An epoxy resin composition containing an epoxy resin (A), an epoxy resin curing agent (B), a solvent (C), and an aromatic hydrocarbon formaldehyde resin (D), wherein a mass ratio of a total content of component (C) and component (D) to a total content of components (B), (C), and (D), [(C+D)/(B+C+D)], is from 0.42 to 0.57, and the mass ratio of component (C) to component (D), C/D, is 1.00 or more, and a cured product thereof.

Epoxy resin composition and cured product of same

Provided is an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0. Also provided are a gas barrier film and a laminate in which the epoxy resin composition is used.

Epoxy resin composition, gas barrier film, and laminate

A polyurethane chain extender includes an amine compound (X) represented by Formula (1) with a trans-isomer proportion in (X) of 50 mol % or more; a composition for forming a polyurethane-based resin including the polyurethane chain extender; a polyurethane-based resin formed by the composition for forming the polyurethane-based resin; a polyurethane-based resin obtained by reacting a polyisocyanate compound (A), a polyol compound (B) and the polyurethane chain extender; a polyurethane-based resin composition including the polyurethane-based resin; a molded body obtained by molding the polyurethane-based resin composition; and an article including the polyurethane-based resin composition or the molded body: where Rto Reach independently represent a hydrogen atom or a hydrocarbon group having 1 or more and 4 or less of carbon atoms, p and q each independently represent an integer of 0 or more and 4 or less, and at least one of p and q is 1 or more.

Polyurethane chain extender, composition for forming polyurethane resin, polyurethane resin, polyurethane resin composition, molded body, and article

Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 0.01 to 2.0 parts by mass, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent, wherein Rrepresents an alkyl group having 1 to 6 carbon atoms, and p is a number of 1 to 3.

Epoxy resin curing agent, epoxy resin composition, and use of amine composition

Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A), a compound (B) represented by the specific formula (1), and a compound (C) represented by the specific formula (2), and wherein a mass ratio of the component (B) to the component (C) [(B)/(C)] is from 0.01 to 5.0, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent.

Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 1.5 to 20.0 parts by mass, an epoxy resin composition, and an epoxy resin curing agent for an amine composition. In the formula (1), Ris an alkyl group having 1 to 6 carbon atoms optionally having a hydroxy group, RNHCH—, where Rrepresents an alkyl group having 1 to 6 carbon atoms, or a group represented by the following formula (1A), and p is a number of 0 to 2. In the formula (1A), Rrepresents a hydrogen atom or NH—.

Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.

Gas barrier packaging material

An active energy ray-curable resin composition containing: 

Actinic-ray-curable resin composition, gas-barrier film, and multilayer structure

The present invention provides: a composition which has a low viscosity, a high refractive index when being cured, and in which the precipitation of crystals is suppressed for a long time when stored at a low temperature; and a paint comprising the same. According to one embodiment of the present invention, provided is a composition which includes: a (meth)acrylate represented by general formula (1); and a compound represented by general formula (2), wherein the mass percentage of the content of the (meth)acrylate to the content of the compound represented by general formula (2) is 60:40 to 90:10 (exclusive of 60:40 and 90:10).

(meth)acrylic composition, paint and curing agent comprising same

Provided is a resin composition which is capable of forming a molded body that has excellent surface hardness, transparency, hue and weather resistance, while exhibiting excellent wet heat resistance. A resin composition which contains a (meth)acrylic copolymer (A) and a polycarbonate-based resin (B), and wherein: the (meth)acrylic copolymer (A) contains an aromatic (meth)acrylate unit (a1), a methyl (meth)acrylate unit (a2) and a (meth)acrylate unit (a3) represented by formula (1); the mass ratio (a1)/(a2) is from 5/95 to 85/15; the content of the unit (a3) is 0.1-10 parts by mass relative to 100 parts by mass of the total of the units (a1) and (a2); and the unit (a1) is different from the unit (a3). 

(Meth)acrylic copolymer, resin composition, molded body of same, and method for producing molded body

The present invention provides: a light diffusing agent which enables the achievement of a resin molded body having excellent light diffusibility, light transmission properties, surface hardness and the like; a resin composition which contains this light diffusing agent; and a molded body. One embodiment of the present invention provides a light diffusing agent which contains a copolymer that contains a (meth)acrylate constituent unit (A) represented by general formula (1) and a polyvalent vinyl constituent unit (B) that is copolymerizable with the constituent unit (A). 

Light diffusing agent, light diffusing resin composition and molded body

A coating film formed by curing of an epoxy resin composition containing at least an epoxy resin, an epoxy resin curing agent and a solvent, wherein the coating film contains the solvent in a ratio of 1% by mass or more and 20% by mass or less, and the epoxy resin curing agent is a reaction product of the following (A) and (B). (A) At least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine. (B) At least one selected from the group consisting of an unsaturated carboxylic acid represented by the following formula (1) and a derivative thereof: wherein Rand Reach independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms, or an aryl group.

Coating film having chemical resistance

A resin composition according to the present invention comprises: (A) a (meth)acrylic copolymer containing 5 to 85% by mass of a (meth)acrylate unit (a) represented by general formula (1) and 15 to 95% by mass of a methyl (meth)acrylate unit (b); and (B) a polycarbonate-type resin. 

(Meth)acrylic copolymer, resin composition, and molded product of said resin composition

According to one embodiment, the present invention provides a resin composition, which comprises a polymer (A) containing 45% by mass or more of a (meth)acrylate unit (a) represented by the following formula (1), a polymer (B) containing 60% by mass or more of a methyl (meth)acrylate unit (b) and having a mass average molecular weight of 5,000 to 20,000, and a polycarbonate-based resin (C). 

Growing community of inventors

Kanagawa, Japan

Kazuki Kouno