Denso Corporation

Kazuki Koda

Wataru Kobayashi

Takumi Nomura

Kazuaki Mawatari

Hodaka Mori

A server including a storage and a controller is communicably connected with a communication terminal. The storage is configured to store a processing data and an analysis data for each of a plurality of analysis targets. The processing data relates to a processing condition for forming a concavo-convex structure on a detection substrate to be used in performing a spectroscopic analysis. The analysis data is used to analyze the analysis target from a spectroscopic spectrum of the analysis target obtained by the spectroscopy analysis. Upon receiving a signal requesting the processing data, the controller is configured to select the processing data corresponding to the analysis target and transmit the selected processing data to the communication terminal. Upon receiving a spectroscopic spectrum, the controller is configured to use the analysis data to analyze the spectroscopic spectrum.

Sensing system and storage medium storing data structure used in sensing system

An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

Electronic device and method for manufacturing same

A base material includes one surface, and a side surface continuous with the one surface. Each of the one surface and the side surface has a sealed region to be sealed with mold resin. The one surface has a one surface rough region in the sealed region thereof. The side surface has a side surface rough region in the sealed region thereof.

Base material, mold package, base material manufacturing method, and mold package manufacturing method

A metal member includes a metal substrate and a porous metal layer. A composite includes the metal member and a resin member. The metal substrate has one surface, is made of a metal material, and has a region formed as an uneven layer having an uneven shape with respect to the one surface. The porous metal layer has a mesh-like shape and is formed on the uneven layer. The uneven layer includes a plurality of protrusions protruding in a direction normal to the one surface.

Growing community of inventors

Kariya, Japan

Kazuki Koda