Towa Corporation

Kazuki Kawakubo

Shinji Takase

Yohei Onishi

Yoshito Okunishi

A resin-molding device capable of preventing a resin-molded product from being non-uniform in thickness. A resin-molding device includes: a first and second platen (outside-loaded platen) which are two plate-shaped members arranged parallel to each other to allow a molding die to be arranged in a die arrangement section which is a central region between the platens; a force applier (toggle link and tie bars) for applying a force to the platens from loading points located outside the die arrangement section; a heating mechanism (lower and upper heater plates) provided between the outside-loaded platen and the molding die; and a heat-insulating member (lower and upper heat-insulating members) formed by a plurality of elastic pillar members arranged between the outside-loaded platen and the heating mechanism, the pillar members configured so that the amount of deformation of each pillar member increases from the center of the die arrangement section toward the loading point.

Resin-molding device and method for producing resin-molded product

There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Manufacturing method of optical electronic components and optical electronic components manufactured using the same

There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Growing community of inventors

Kyoto, Japan

Kazuki Kawakubo