Jsr Corporation

Cornell University

Kazuki Kasahara

Hiromitsu Nakashima

Masafumi Hori

Takanori Kawakami

Yasuhiko Matsuda

Kazuo Nakahara

Masafumi Yoshida

Yuusuke Asano

Yoshifumi Oizumi

Toru Kimura

Ken Maruyama

Reiko Kimura

Mitsuo Satou

Christopher Kemper Ober

Emmanuel P Giannelis

Hirokazu Sakakibara

Hiroki Nakagawa

Norihiko Ikeda

Yusuke Asano

Mitsuo Sato

Motohiro Shiratani

Katsuaki Nishikori

Hiromu Miyata

Miki Tamada

Sosuke Osawa

Takuma Ebata

Kaori Sakai

Kota Nishino

Vasiliki Kosma

Jeremy Odent

Hong Xu

Mufei Yu

Kenji Hoshiko

Saki Harada

Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in which a content of a radiation-sensitive acid generator (C) is 0.1% by mass or less, step (2) of exposing the resist film to EUV or an electron beam (EB), and step (3) of developing the resist film exposed in the step (2).

Method for forming resist pattern and radiation-sensitive resin composition

A radiation-sensitive composition includes particles including a metal oxide as a principal component, and an organic solvent. A metal atom constituting the metal oxide includes a first metal atom that is a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, a tellurium atom, or a combination thereof. A percentage content of the first metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %. A pattern-forming method includes applying the radiation-sensitive composition to form a film on a substrate, exposing the film, and developing the film exposed.

Radiation-sensitive composition and pattern-forming method

A radiation-sensitive composition includes particles including a metal oxide as a principal component, a radiation-sensitive acid generator, and an organic solvent. A metal atom constituting the metal oxide includes a first metal atom that is a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, a tellurium atom, or a combination thereof. A van der Waals volume of an acid generated from the radiation-sensitive acid generator is no less than 2.0&#xd7;10m. A percentage content of the first metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %.

A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. Rrepresents an alkali-labile group. A represents an oxygen atom, &#x2014;NR'&#x2014;, &#x2014;CO&#x2014;O&#x2014;or &#x2014;SO&#x2014;O&#x2014;, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R&#x2032; represents a hydrogen atom or an alkali-labile group, and '#' and '##' each indicate a bonding hand bonded to R.-A-R&#x2003;&#x2003;(x).

Radiation-sensitive resin composition, method for forming resist pattern, polymer and polymerizable compound

A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. Rrepresents an alkali-labile group. A represents an oxygen atom, &#x2014;NR'&#x2014;, &#x2014;CO&#x2014;O&#x2014;or &#x2014;SO&#x2014;O&#x2014;, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R&#x2032; represents a hydrogen atom or an alkali-labile group, and '#' and '##' each indicate a bonding hand bonded to R. 

A photoresist composition includes a polymer component that includes a first structural unit represented by the formula (1) and a second structural unit represented by the formula (2), an acid generator, and a compound represented by the formula (3). The first structural unit and the second structural unit are included in an identical polymer, or different polymers. Ris hydrogen atom, fluorine atom, etc., Rand Rare independently hydrogen atom, fluorine atom, etc., a is an integer from 1 to 6, Rand Rindependently hydrogen atom, fluorine atom, etc., Ris hydrogen atom, fluorine atom, etc., Rand Rare each independently alkyl group having 1 to 4 carbon atoms, etc., Ris alkyl group having 1 to 4 carbon atoms, etc., Ris hydrogen atom, etc., Ais &#x2014;N&#x2014;SO&#x2014;R, etc., and Xis onium cation. 

Photoresist composition and resist pattern-forming method

A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. Rrepresents a hydrogen atom or a methyl group. Q represents a divalent linking group having 1 to 4 carbon atoms. X represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by X are not substituted or substituted. Rrepresents a hydrogen atom or a methyl group. Y represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by Y are not substituted or substituted. 

Radiation-sensitive resin composition and pattern-forming method

A radiation-sensitive resin composition includes a compound represented by a following formula (1), and a first polymer that serves as a base resin. Rrepresents a monovalent alicyclic hydrocarbon group having 3 to 20 carbon atoms, or the like. The Mrepresents a monovalent cation. The first polymer (B) is preferably insoluble or hardly soluble in alkali, the polymer including a structure unit represented by a formula (5) or a structure unit represented by a formula (6), and a structure unit represented by a formula (7). 

Radiation-sensitive resin composition

A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed. It is preferable that the exposing of the resist film includes exposing the resist film via an immersion liquid that is provided over the resist film.

Resist pattern-forming method, resist pattern-forming radiation-sensitive resin composition, and resist film

A radiation-sensitive resin composition includes an acid-dissociable group-containing resin, and a compound shown by the following general formula (1). wherein Zrepresents a monovalent anion shown by a general formula (2), Mrepresents a monovalent onium cation, Rrepresents a linear or branched alkyl group having 1 to 12 carbon atoms substituted or unsubstantiated with a fluorine atom, or a linear or branched alkoxy group having 1 to 12 carbon atoms, and n is 1 or 2.

Radiation-sensitive resin composition and compound

A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. Rrepresents an alkali-labile group. A represents an oxygen atom, &#x2014;NR'&#x2014;, &#x2014;CO&#x2014;O&#x2014;or &#x2014;SO&#x2014;O&#x2014;, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R&#x2032; represents a hydrogen atom or an alkali-labile group, and '#' and '##' indicates a bonding hand bonded to R.-A-R&#x2003;&#x2003;(x)

A radiation-sensitive resin composition that includes (A) a polymer that includes a repeating unit (a1) and a fluorine atom, the repeating unit (a1) including a group shown by the following formula (1) or (2), the radiation-sensitive resin composition including the polymer (A) in an amount of 0.1 mass % or more and less than 20 mass % based on the total amount of polymers included in the radiation-sensitive resin composition. 

Growing community of inventors

Tokyo, Japan

Kazuki Kasahara