Screen Holdings Co., Ltd.

Kazuki Inoue

Hiroaki Ishii

Masaki Iwami

Daichi Yoshitomi

Takeshi Yoshida

Hiroaki Takahashi

Noriyuki Kikumoto

Kunio Yamada

Tetsuo Ito

A substrate processing device includes a holding member for holding a substrate, and an opposed member having a body portion and an extended portion extending from at least a part of a peripheral edge part of the body portion. A protrusion is provided on one part of a tip side part of the extended portion and a side surface part of the holding member, and the other part is provided with a restricting structure disposed opposite to the protrusion and restricting relative motion of the protrusion. The relative motion between the holding member and the opposed member is restricted, and the substrate processing device further includes a rotating mechanism, and a nozzle for discharging a processing solution and the protrusion and the restricting structure are disposed below an upper surface of the holding member.

Substrate processing device and substrate processing method

In a substrate processing apparatus, a transport robot which transports a substrate between an indexer part and a substrate processing part is installed in a substrate transport part. The transport fan filter unit is provided in an upper part of the substrate transport part. An exhaust port is provided in the substrate transport part. The circulation piping allows the exhaust port of the substrate transport part and the transport fan filter unit to communicate with each other. The exhaust pipe is connected to the circulation piping. The inert gas supply part supplies an inert gas to the circulation piping. The circulation fan filter unit is disposed downstream of a connecting portion of the circulation piping with the exhaust pipe to be parallel to a flow path of the circulation piping.

Substrate processing apparatus

A substrate processing device is provided. A chamber has a side wall part and a top wall part and contains a substrate holding part. A first gas supply part is disposed in the top wall part and supplies a first gas toward a side on which the substrate holding part is positioned. A second gas supply part is contained in the chamber and supplies a second gas to an inside of the chamber. A control unit controls the first and second gas supply part. The second gas is a gas different from oxygen and an allotrope of oxygen. The second gas supply part has an air feeding port part which is positioned on an upward side of a holding position of a substrate by the substrate holding part in a vertical direction and is positioned on an outward side of the substrate holding part in a horizontal direction.

A substrate processing apparatus with efficient drying includes a chamber body having an upper opening, a chamber cover having a lower opening, and a shield plate disposed in a cover internal space of the chamber cover. With the upper opening of the chamber body covered by the chamber cover, a chamber is formed. In the cover internal space, a scanning nozzle for discharging a processing liquid toward a substrate is disposed and an inert gas is supplied and a gas is exhausted from the inside. When the processing liquid is supplied onto the substrate, the discharge part is disposed at a discharge position, and when the discharge part is dried while no processing liquid is supplied onto the substrate, the discharge part is disposed at a waiting position and the lower opening is closed by the shield plate.

A substrate processing apparatus with efficient drying includes a chamber body having an upper opening, a chamber cover having a lower opening, and a shield plate disposed in a cover internal space of the chamber cover. With the upper opening of the chamber body covered by the chamber cover, a chamber is formed. In the cover internal space, a scanning nozzle for discharging a processing liquid toward a substrate () is disposed and an inert gas is supplied and a gas is exhausted from the inside. When the processing liquid is supplied onto the substrate, the discharge part is disposed at a discharge position, and when the discharge part is dried while no processing liquid is supplied onto the substrate, the discharge part is disposed at a waiting position and the lower opening is closed by the shield plate.

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Kyoto, Japan

Kazuki Inoue