Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Kazuki Fukada

Hidehiro Yoshida

Keisei Yamamuro

Naoto Hosotani

Tohru Nakagawa

Kenichi Yamamoto

Hiroshi Yamauchi

Katsuhiko Watanabe

Takeshi Kita

Yoshihiko Yagi

Daido Komyoji

Tatsuo Sasaoka

Isamu Aokura

Hiroshi Hayata

Satoshi Horie

Kazunobu Irie

Teiichi Kimura

Keiichi Iwata

An inkjet head or the like that is capable of efficiently applying a pressure required for discharging a liquid material includes: a nozzle hole; a pressure chamber; a liquid material supply flow path; a liquid material recovery flow path; a diaphragm; a piezoelectric element; and orifice structures that are respectively disposed between the liquid material supply flow path and the pressure chamber, and between the liquid material recovery flow path and the pressure chamber, and that are narrower than the pressure chamber in a plan view as viewed from a discharge direction of the liquid material.

Inkjet head, inkjet coating device, and inkjet coating method

A liquid-coating apparatus includes: (a) a nozzle hole from which a liquid material is to be discharged; (b) a supply flow channel configured to supply the liquid material to the nozzle hole; (c) a plunger configured to reciprocate in contact with the liquid material inside the supply flow channel; (d) a displacement-expansion mechanism configured to displace the plunger; and (e) an actuator configured to displace the displacement-expansion mechanism, wherein at least one of a contact part of the displacement-expansion mechanism and a contact part of the actuator has a curved surface.

Coating nozzle head, and liquid-applying apparatus including the same

In a common chamber () for distributing, to respective pressure chambers (), an ink supplied from the ink inlet (), resistant walls () are provided in areas that are located ahead and behind of the flow of the ink, i.e., areas around inlets of flow channels () that lead to respective pressure chambers (), and any resistance against the flow of the ink is generated according to the heights of the resistant walls (), thereby capturing a solid ingredient () included in the ink. In this case, by adjusting the heights of the resistant walls () to control capabilities of introducing the solid ingredient (), it becomes possible to dispense desired amounts of the solid ingredient () to the respective pressure chamber ().

Inkjet head and coating apparatus using same

An inkjet head, includes: a pressure chamber communicating with an ink flow channel; a diaphragm linked to the pressure chamber; a piezoelectric element linked to the diaphragm; a nozzle communicating with the pressure chamber; and a vibrating mechanism placed in the ink flow channel and vibrates a supplied ink. Further provided is an inkjet device, including: the above inkjet head; a holding unit that holds a coating object; a moving mechanism that causes relative movement between the inkjet head and the holding unit; and a control unit that controls the inkjet head, the holding unit, and the moving mechanism.

Inkjet head and inkjet device

A wiping device has a wiping section that relatively moves along the nozzle surface, and the wiping section has: a curved surface in which a bulge is continuously formed along the identification line; a guiding section disposed such that the bulge faces the nozzle surface; a gas jetting port that applies gas to the curved surface; and a gas suction port that sucks the gas ejected from the gas jetting port and guided along the curved surface, wherein, as viewed from the direction perpendicular to the nozzle surface, the identification line which is the set of upper end points on the bulge on the curved surface intersects with the edges of the nozzle surface at an oblique angle.

Wiping device, ink-jet device, and wiping method

An ink-jet head comprising: a supply channel configured to allow ink to flow; ink chamber groups, each having two or more ink chambers that are alternately provided on either side of the supply channel, along a direction of the ink, the ink chambers each having nozzles for discharging ink; wherein: each of the ink chamber groups has two or more ink chamber sequences in parallel with the direction, and two or more nozzle sequences in parallel with the direction, in each of the ink chamber groups, when the ink chamber sequence closest to the supply channel is a first ink chamber sequence, and the ink chamber sequence furthest away from the supply channel is an n-th ink chamber sequence, the number of the ink chambers in the first ink chamber sequence is greater than the number of the ink chambers in the n-th ink chamber sequence.

Ink-jet head and ink-jet apparatus

Provided is an ink-jet apparatus that: has a wide control range of the direction for ink ejection; can correct a variation in the direction for ink ejection; and can improve the yield of a product when used for manufacture of electronic devices. The ink-jet apparatus includes: pressure chamberconfigured with a pair of partition walls; nozzle platehaving nozzle; diaphragmsupported by partition walls; piezoelectric elementsandthat are in contact with diaphragmfor pressurizing pressure chamber; and piezoelectric elementsandsupporting partition walls. A voltage can be applied individually to piezoelectric elements, andto. The widths of part A and part B of diaphragm, part A being in contact with a piezoelectric element, and part B being in contact with partition wallsatisfy a particular relationship.

Ink-jet apparatus

Disclosed is an ink-jet head that can suppress occurrence of the crosstalk and facilitate a smooth ink circulation in pressure chambers. The ink jet head includes two or more pressure chambersconfigured to be supplied with ink and each having a nozzle; ink supply channelcommunicating with each of pressure chambersand configured to allow the ink to flow to each of pressure chambers; ink discharge channelcommunicating with each of pressure chambersand configured to allow the ink discharged from each of pressure chambersto flow; ink inlet channelconnecting each of pressure chambersto ink supply channel; ink outlet channelconnecting each of pressure chambersto ink discharge channel. An inner surface of ink outlet channelincludes unevenness

Ink-jet head

An ink jet head and an ink jet device having the same are provided, which include an ink supply path supplied with ink from an ink inlet port, an ink discharge path configured to discharge the ink to an ink discharge port, an ink chamber provided to communicate with the ink supply path and the ink discharge path and having a nozzle configured to discharge the ink, and a piezoelectric actuator operable to apply pressure to the ink within the ink chamber by displacement of a vibrating plate of the ink chamber, wherein the piezoelectric actuator is arranged through the vibrating plate of the ink chamber and an island member, the island member is disposed to extend between the ink supply path and the ink discharge path, and a length Wof a side of the island member on the ink supply path side and a length L that extends from the ink supply path side to the ink discharge path side are different from each other.

Ink jet head and ink jet device having the same

An ink-jet apparatus comprising: an ink supply channel through which ink flows; an ink chamber that communicates with the ink supply channel via an ink inlet channel, holds the ink supplied from the ink supply channel, and has a nozzle that discharges the ink; an ink evacuation channel that communicates with the ink chamber via an ink outlet channel, and through which the ink evacuated from the ink chamber flows; an ink circulating section that applies pressure to the ink so that the ink flows into the ink evacuation channel from the ink supply channel via the ink chamber; a first actuator that vibrates a wall of the ink chamber; and a second actuator that changes an area of a cross-section of the ink outlet channel.

An ink-jet apparatus includes an ink supply flow path, an ink discharge flow path, and an ink flow path connecting them, in which piezoelectric elements are provided in the ink flow path having at least one turn part, the piezoelectric elements are arranged to be opposed to the ink flow path and are provided upstream of the turn part in the ink flow path and downstream of the turn part in the ink flow path, and a nozzle is provided between the piezoelectric element and the turn part in the ink flow path.

The present invention provides an ink-jet head which comprises an ink supply channel configured to allow ink to flow, two or more ink chambers each having a bottom surface with a nozzle and an upper surface constituting of a vibrating plate, the two or more ink chambers being arranged in a row along a direction in which the ink flows in the ink supply channel, a partition wall partitioning the ink chambers. and a piezo-mounting plate having two or more multilayer piezoelectric elements and two or more columns fixed thereto. The two or more multilayer piezoelectric elements are arranged in a row, and the two or more columns are arranged between the multilayer piezoelectric elements. And also, the piezo-mounting plate is arranged on the upper surface of the ink chambers. In the ink-jet head, the vibrating plate constituting the upper surface of the ink chamber is held between the partition wall and the column. A large gap and a small gap are arranged between the two multilayer piezoelectric elements adjacent to each other, and the column is arranged at only the portion with a large gap.

Ink-jet head, ink-jet apparatus, and method of manufacturing the same

An ink-jet head includes an ink chamber; an ink supply channel through which ink to be supplied to the ink chamber flows; an ink discharge channel through which the ink discharged from the ink chamber flows; a partition wall constituting a side surface of the ink chamber; an ink inlet opening formed in the partition wall, the ink inlet opening communicating with the ink supply channel; an ink outlet opening formed in the partition wall, the ink outlet opening communicating with the ink discharge channel; a piezo-mounting plate constituting a top surface of the ink chamber; an expandable multilayer piezoelectric element placed inside the ink chamber, the multilayer piezoelectric element having a fixed end secured to the piezo-mounting plate and a movable end directing to the expanding direction of the multilayer piezoelectric element; a nozzle plate constituting a bottom surface of the ink chamber; and a nozzle formed in the nozzle plate, the nozzle communicating with the ink chamber, wherein the multilayer piezoelectric element is separated from the partition wall, and the ink inlet opening is positioned closer to the fixed end of the multilayer piezoelectric element than to the movable end thereof.

A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects () to be bonded together are cleaned in an initial cleaning step (S) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one () of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S); a surface treatment step (S) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces () again; and the uneven bonding surface () is pressed against the other bonding surface () to bond them together.

Bonding method and apparatus

When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Growing community of inventors

Osaka, Japan

Kazuki Fukada