Hitachi, Ltd.

Other

Hitachi Haramachi Electronics Co., Ltd.

Hitachi Instrument Engineering Co., Ltd.

Kazuji Yamada

Satoshi Shimada

Motohisa Nishihara

Hideo Sato

Akira Tanaka

Toshio Ogawa

Ryuichi Saito

Kazuhiro Suzuki

Kanji Kawakami

Akihiro Tamba

Hirokazu Inoue

Shigeyuki Kobori

Yasumasa Matsuda

Yasutoshi Kurihara

Kazuo Kato

Ryoichi Kobayashi

Seikou Suzuki

Jin Onuki

Isao Kobayashi

Masaaki Takahashi

Tadao Kushima

Yukio Takahashi

Takao Sasayama

Tadahiko Miyoshi

Tasao Soga

Nobuya Koike

Masahiro Koizumi

Kunio Miyazaki

Yoshihiko Koike

Hideo Arakawa

Mamoru Sawahata

Hiroichi Shinohara

Yoshitaka Matsuoka

Yutaka Higashimura

Takashi Haramaki

Michitaka Shimazoe

Shigeki Sekine

Hideo Suzuki

Hisanori Okamura

Satoru Ogihara

Isao Shimizu

Seiko Suzuki

Takayoshi Nakamura

Shunichi Numata

Shigeki Tsuchitani

Atsushi Morihara

Masanori Tanabe

Osamu Miura

Hideki Miyazaki

Yutaka Kobayashi

Hiroshi Fujii

Kinya Nakatsu

Mutsuhiro Mori

Yukio Ito

Takashi Yokoyama

Akio Takahashi

Yasushi Sasaki

Yutaka Sugita

Akio Mukoh

Akira Yamagiwa

Ken Takahashi

Akira Kato

Minoru Takahashi

Junichi Saeki

Kanji Otsuka

Atsushi Miyazaki

Fumiyuki Kobayashi

Toshio Hatada

Shigeru Oho

Masahiro Nagasu

Noboru Baba

Shin Kimura

Shigeta Ueda

Hiroshi Yokoyama

Masahide Okamoto

Yukio Hishinuma

Naohiro Momma

Munehisa Kishimoto

Shunsuke Nogita

Mitugu Shirai

Yuji Shirai

Kousuke Nakamura

Masataka Sasaki

Yasushi Shimizu

Keiichirou Nakanishi

Ko Soeno

Yasuo Matsushita

Michiharu Honda

Yasuo Osone

Shuntaro Koyama

Makoto Ishii

Hiromi Kagohara

Hironori Kodama

Masatoshi Tsuchiya

Takeo Nagata

Tatsuya Shigemura

Hitoshi Minorikawa

Takao Ohba

Yutaka Maeno

Toshiaki Kaminaga

A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

Circuit board

An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of the electronic circuit chip. Air trapped in a space between the electronic circuit chip and the wiring board is collected in the recess or through-hole to form a void separated from the electronic circuit chip.

Electronic device and method of fabricating the same

A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Liquid cooled circuit device

Liquid cooled circuit device and a manufacturing method thereof

Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control electrode wirings from main electrode wirings are also given function of positioning of the respective semiconductor chips in the flat package. Further, a one-piece control electrode wiring net is housed in the common electrodes of the package and the electrodes which are led out from the control electrodes of the respective semiconductor chips are connected to the net to simplify the processing of a large number of gate signal wirings.

Flat semiconductor device and power converter employing the same

A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

Semiconductor device

A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.

Semiconductor module

A power semiconductor module comprising a power semiconductor element included in a power circuit portion and mounted on a metal base, a first resin molded to the power semiconductor element, a control circuit element disposed on the first resin and included at least in a portion of the control circuit, and a control terminal connected to the power circuit portion and having an exposed portion thereof in the surface of the first resin, in which a portion of the control circuit is connected with the power circuit portion at the exposed portion of the control terminal. Accordingly, a resin mold type power semiconductor module capable of realizing a high performance of the control circuit portion at low cost can be realized.

Power semiconductor module and motor drive system

A semiconductor device includes a main circuit part having a semiconductor device formed on an electrode plate of a lead frame and a control circuit part having protective functions, which is integrally molded by a resin mold part into an integral mold structure.

Semiconductor device including an integrally molded lead frame

In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost. In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized.

Semiconductor module, power converter using the same and manufacturing

Semiconductor device having power semiconductor elements

A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.

Power semiconductor module employing metal based molded case and screw

An input-output wiring for the power circuit and a ground layer are formed on a metal substrate of a power hybrid integrated circuit apparatus. A plurality of windows are opened at predetermined positions of a circuit substrate to which electronic parts such as an IC driver, a chip resistor etc. are connected. Ceramic chips are soldered on the exposed surface of the metal substrate in the windows, and the power semiconductor elements are connected through metal bridges on the ceramic chips. Connection between lower electrode of adjoining power semiconductor elements or between lower part of the power semiconductor element and an input/output wiring is made by means of a part of the metal bridge.

Power hybrid integrated circuit apparatus

An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

Mounting substrate

A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

Semiconductor apparatus of module installing type

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Hitachi, Japan

Kazuji Yamada