Ibiden Company Limited

Kazuhito Yamada

Hiroaki Kodama

Motoo Asai

Yoshinori Wakihara

Yasuji Hiramatsu

Toyoaki Tanaka

Tomohiro Nishikawa

Motoo Ibiden Co Ltd 1-1 Kitakata Asai

A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.

Multilayer printed circuit board

A multilayer printed circuit board including insulating layers, conductor circuits formed between the insulating layers, and optical circuits formed between the insulating layers and including a first optical circuit. The first optical circuit is positioned on a first outermost insulating layer of the insulating layers, and the insulating layers, conductor circuits and optical circuits are layered to form a multilayer structure having a first surface and a second surface on an opposite side of the first surface such that the multilayer structure is structured to mount optical elements on the first surface and second surface of the multilayer structure, respectively.

A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

Printed wiring board and method for manufacturing the same

A device for optical communication including a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal, and an optical element or a package substrate on which an optical element is mounted. An optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit. The optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface. The lens is provided at either the entrance surface or the exit surface on the side facing the optical circuit.

Optical path converting member, multilayer print circuit board, and device for optical communication

A package substrate includes a laminated body having a conductor circuit and an insulating layer formed and laminated, solder resist layers formed and laminated on both sides of the laminated body, respectively, an optical element, and an optical path for transmitting an optical signal. One or more of the solder resist layers formed and laminated on the laminated body is an outermost layer which has a transmittance for light having a wavelength for communication of about 60% or more at a thickness of 30 &#x3bc;m.

Package substrate and device for optical communication

A device for optical communication comprising;

The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.

Substrate for mounting IC chip and device for optical communication

A device for optical communication includes at least a conductor circuit and an insulating layer formed and laminated. An optical circuit and an optical path are transmitting an optical signal, and an optical element or a package substrate on which an optical element is mounted. An optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit the optical signal between the optical element and the optical circuit. The optical path converting member includes a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface, and the lens is provided at least one position selected from the entrance surface, the exit surface, and inside of the optical path conversion mirror.

The photoelectric circuit board according to the present invention is a photoelectric circuit board, wherein a rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated, external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed in above-described rigid portion, and an optical circuit is formed in at least one of above-described flex portions.

Photoelectric circuit board and device for optical communication

The optical/electrical composite wiring board comprises a lower insulating layer that also serves as a lower clad; a upper insulating layer that also serves as an upper clad; a core that is placed between the lower insulating layer and the upper insulating layer and has a predetermined optical wiring pattern; and a conductor layer that is placed along with the core between the lower insulating layer and the upper insulating layer and has a predetermined electrical wiring pattern. Herein, the core and the conductor layer are formed via a short manufacturing method, whereby the concave portion for optical wiring and the concave portion for electrical wiring are formed on the lower insulating layer by press process, and a core material and conductor material are filled into each of the concave portions, and afterward, the core material and conductor material are ground until they are flush with the upper surface of the lower insulating layer.

Optical/electrical composite wiring board and a manufacturing method thereof

A device for optical communication including a multilayer print circuit board in which a conductor circuit, an insulating layer, an optical circuit and an optical path for transmitting an optical signal are formed, and a package substrate having an optical element or an insulating layer and mounted on the multilayer print circuit board. An optical path converting member is disposed at the optical path to transmit an optical signal between the optical element and the optical circuit. The optical path converting member includes a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface. The lens is provided at the entrance surface, the exit surface, or inside of the optical path conversion mirror.

The multilayer printed circuit board according to the present invention is a multilayer printed circuit board, in which conductor circuits and insulating layers are formed and layered, an optical path for transmitting an optical signal comprising a resin composite is formed, and conductor circuits are formed on an outermost insulating layer. Herein, an end portion of the above described optical path for transmitting an optical signal protrudes from the surface of the outermost insulating layer.

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Ibi-gun, Japan

Kazuhito Yamada