Anelva Corporation

Canon Anelva Corporation

M. Soft Co., Ltd.

Toyo Kanetsu Solutions K.k.

Kazuhito Watanabe

Nobuyuki Takahashi

Shigeru Mizuno

Toshiaki Koguchi

Yukihito Tashiro

Naoyuki Nozawa

Takanori Yoshimura

Daisuke Kobinata

Masahito Ishihara

Shinya Hasegawa

Manabu Tagami

Yoshihiro Katsumata

Hajime Sahase

Hideo Mano

Toshiaki Sasaki

Yasuhide Matsumoto

Michio Yokoyama

Juji Yokoya

Hideaki Yonaga

Kazunari Aoki

Norio Yagishita

Rokuro Iwase

Hironari Shimizu

Norihiro Wada

Tadao Ito

Yuka Tsushima

Satoshi Nakamura

Some embodiments are directed to a device that supports work of picking or sorting an article from a warehouse and the like, which allows the picking work to be carried out accurately and quickly. The device includes: a camera that photographs an automatically-readable identifier that is attached to a storage location of an article; an information processing unit that detects the identifier from an image photographed by the camera and processes the image of the identifier; and a display that displays information such as image information and text information. The information processing unit processes, based on the detected identifier and picking work order information, image on a specific identifier, and the processed image is displayed on the display at a location related to the identifier.

Support device and system for article picking or sorting work

A substrate transport apparatus including a first substrate holder and a second substrate holder capable of respectively holding substrates includes a first drive arm which has first and second end portions, and is rotatable with rotation of a first drive shaft, a second drive arm which has a third end portion spaced apart from the first end portion by a first distance, and a fourth end portion spaced apart from the second end portion by a second distance, and is rotatable with rotation of a second drive shaft coaxial with the first drive shaft, two first driven arms coupled to the first substrate holder, and two second driven arms coupled to the second substrate holder.

Substrate transport apparatus, and system and method for manufacturing electronic device

A vacuum actuator includes a vacuum partition wall, the interior of which can be evacuated to a vacuum, a rotor supported by the vacuum partition wall to be free to rotate, a permanent magnet provided on the outer peripheral surface of the rotor, a coil opposed to the permanent magnet, and a stator provided with the coil. The stator and the vacuum partition wall are formed integrally with each other.

Vacuum actuator including a stator forming a part of a vacuum partition wall

An apparatus includes a chamber configured to form a reduced-pressure space, a carrier which holds a substrate, and a conveyer which conveys the carrier in the chamber. The chamber includes a side wall including an opening portion, and a partition wall arranged in the opening portion, the conveyer includes a permanent magnet provided on the carrier, and a driving magnet arranged outside the partition wall so as to drive the carrier, and the partition wall includes a first portion arranged between the driving magnet and a path through which the carrier passes, and a second portion arranged to connect the first portion to the side wall, the first portion having a smooth surface in a portion in which the first portion faces the path, and the first portion including a plurality of ribs arranged on a surface thereof on a side on which the driving magnet is arranged.

Substrate conveyer and vacuum processing apparatus

A substrate heating chamber and a substrate cooling chamber each capable of simultaneously holding a plurality of substrates are provided in a thermally separated state in a heating and cooling apparatus with a single vacuum processing chamber. The substrate heating chamber is equipped with a plurality of communicating or non-communicating substrate holding spaces. The substrate cooling chamber is also equipped with a plurality of communicating or non-communicating substrate holding spaces. The communicating substrate holding spaces allow the batch heat treatment of substrates, while the non-communicating substrate holding spaces allow the batch or individual processing of substrates.

Heating and cooling apparatus, and vacuum processing apparatus equipped with this apparatus

A heating and cooling apparatus with which batch processing is possible and throughput can be increased, and furthermore which is more compact and uses less energy. A substrate heating chamber and a substrate cooling chamber each capable of simultaneously holding a plurality of substrates are provided in a thermally separated state in a heating and cooling apparatus with a single vacuum processing chamber. The substrate heating chamber is equipped with a plurality of communicating or non-communicating substrate holding spaces. The substrate cooling chamber is also equipped with a plurality of communicating or non-communicating substrate holding spaces. The communicating substrate holding spaces allow the batch heat treatment of substrates, while the non-communicating substrate holding spaces allow the batch or individual processing of substrates.

A substrate holder and an electrode are arranged facing each other in a vacuum chamber. The electrode is provided with a process gas introduction mechanism and a gas blowoff plate. A substrate is loaded on the substrate holder, the process gas is introduced, and electric power is supplied between the substrate holder and the electrode to generate plasma for etching the substrate surface. At the rear side of the gas blowoff plate in the vacuum chamber, a plurality of magnets is provided at concentric positions. The magnetic field strength resulting from the magnets on the surface of the substrate is made 0 Gauss. By using the magnets in this way and improving the magnets, it is possible to establish a better etching process for various materials to be etched.

Plasma etching system

To be able to reduce the size of a drive part and, as a result, to achieve the reduction in size and the lowering of manufacturing cots of a gate valve. An open/close mechanism is configured from a turning pair only. This open/close mechanism is configured from a first swing link, second swing link and coupling link. The first swing link is driven by a rotation cylinder to perform a swinging motion. The second swing link is connected to a drive shaft and performs a swinging motion with the drive shaft as its axis. The first swing link and second swing link are coupled by the coupling link. When the rotation cylinder is driven, whereby the first swing link is caused to swing, the coupling link is vertically driven whereby the second swing link is caused to swing. As a result, a valve, connected to the second swing link, swings and the opening and closing operation of the flow path port is performed.

Gate valve apparatus

The present invention provides a substrate processing apparatus having improved temperature distribution on a block heater and improved productivity. The substrate processing apparatus includes a reactor having an exhaust unit to form a vacuum environment therein for processing a surface of a substrate, a support member provided in the reactor, and gas introduction units for introducing reactive gases into the reactor, the substrate support member including a block heater. The block heater has upper, intermediate and lower members, which are placed one over another, the faying surfaces of the respective members being joined by diffusion bonding. A heating member is provided between the intermediate and lower members, and purge gas passages are formed between the intermediate and upper members.

Substrate processing apparatus

A heater is used in a CVD apparatus. In the CVD apparatus, reactive gas is supplied through a reactive gas supply plate to a substrate on a substrate holder to deposit a film on the substrate, and a purge gas supply passage is formed by placing a shield mechanism around the substrate holder, the shield mechanism including a ring plate disposed close to the outer periphery of the substrate. During film deposition, purge gas supplied through the purge gas supply passage is blown off from a clearance between the substrate and the ring plate, thereby preventing a film from being deposited on the rear surface of the substrate or the like. A heating element is arranged in a space in the purge gas supply passage close to but not contacting the substrate holder. The heating element is preferably a ceramic heater.

Heater for CVD apparatus

A CVD mechanism includes a reactor, a substrate holder, a heating apparatus for heating the substrate holder, a reaction gas supply plate for supplying reaction gas into the reactor, and at least two cylinders disposed in a concentric form on the substrate-facing surface of the reaction gas supply plate so that reaction gas is supplied from an inward portion of each cylinder in the reaction gas supply plate. A power supply mechanism for supplying power to the reaction gas supply plate and the substrate holder, and ring magnets disposed in the upper and lower portions of the reactor are provided so that magnetic lines of force passing through a plasma space are generated by the facing magnetic pole parts of the respective magnets.

Growing community of inventors

Tama, Japan

Kazuhito Watanabe