Sharp Kabushiki Kaisha Corporation

Kazuhito Ozawa

Shigeki Komaki

Yoshinori Oogita

Katsuhide Shino

Kazuhiro Nakao

Yukihiro Inoue

Yoshitomo Kitanishi

Yoshitugu Imano

Ichirou Kohara

An LSI chip has Al bumps transferred from an Al-containing foil and formed thereon by ultrasonic bonding. The LSI chip is thereafter mounted on a circuit board by an adhesive containing fine metallic particles dispersed or arranged uniformly, an insulative adhesive with high fluidity or ultrasonic bonding.

LSI chip and method of producing same

A method for mounting a semiconductor chip on a circuit board is provided that comprises forming a wiring pattern, which is to be connected with electrodes of the semiconductor chip, on the circuit board; attaching an insulating film, which has at least one hole that fits the shape of the electrodes of the semiconductor chip, to the top of the wiring pattern and the exposed portion of the circuit board; filling the hole formed in the insulating film with a conductor; and placing the semiconductor chip on the insulating film, so that the electrodes of the semiconductor chip are connected electrically with the wiring pattern on the circuit board through the conductor.

Method for mounting a semiconductor chip

An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.

Method of connecting electronic element to base plate

A method of mounting an LSI or IC on a wiring circuit substrate by hot-pressing which comprises the steps of placing the pins of the LSI or IC on a heat sealant printed over the circuit pattern of the substrate, placing a film sheet on the entire or partial surface of the LSI chip or IC chip including the pins of the chip, and carrying out a hot-pressing operation on the film sheet.

Method of mounting LSI

An electronic apparatus comprising a plurality of assembly elements and a heat-sensitive adhesive synthetic resin film tape inserted between the plurality of assembly elements and the heat adhesive synthetic resin tape to integrally bond the elements together into a composite structure which is thin in size and sufficiently elastic to resist bending and twisting.

Thin electronic apparatus

A card-type thin electronic device in which the upper and lower panels are bonded to flanges projecting from a side-wall forming frame between the two panels, while a number of grooves are formed by a half-etching process on the surfaces of both panels bonded against the side-wall forming frame.

Card-type thin electronic device

A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.

Growing community of inventors

Nara, Japan

Kazuhito Ozawa