Hitachi Chemical Company, Ltd.

Kazuhito Obata

Yoshitsugu Matsuura

Katsuyuki Masuda

Masaki Takeuchi

Nozomu Takano

Yuta Nakano

Kazumasa Takeuchi

Kenichi Tomioka

Masashi Tanaka

Sumio Yoshida

Hirokazu Suzuki

Yuuji Ooyama

Katsuhiko Yasu

Masahiko Suzuki

The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.

Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board

A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

Flexible laminate board, process for manufacturing of the board, and flexible print wiring board

A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90&#xb0;, cracks do not occur in the base material.

Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board

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Chikusei, Japan

Kazuhito Obata