Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Showa Denko Materials Co., Ltd.

Kazuhito Kobayashi

Nozomu Takano

Daisuke Fujimoto

Akishi Nakaso

Yasuyuki Mizuno

Shinji Tsuchikawa

Katsuji Shibata

Ikuo Hoshi

Masami Arai

Akira Shimizu

Hiroshi Shimizu

Naoyuki Urasaki

Shigeharu Arike

Michitoshi Arata

Kazuhisa Otsuka

Norio Okano

Kouichi Aoyagi

Akira Ito

Norihiro Hara

Atsushi Takahashi

Kazunori Yamamoto

Yoshiyuki Tsuru

Yasushi Kumashiro

Nobuyuki Ogawa

Kouichi Tsuyama

Koji Morita

Kenichi Tomioka

Takayuki Sueyoshi

Masaaki Narita

Takahiro Tanabe

Keiichi Kasuga

Toyoki Ito

Kanako Ishihara

Shinichi Kawasumi

Sansei Ooshima

A method of recovering a decomposition product of a thermosetting resin cured product, the method includes a step of contacting an object to be treated, that contains a thermosetting resin cured product, with a treatment liquid containing an alkali metal compound and an alcohol solvent, to decompose and dissolve the thermosetting resin cured product; a step of mixing the treatment liquid, in which a decomposition product of the thermosetting resin cured product is dissolved, and an acidic aqueous solution to separate the mixture into an aqueous layer and an organic layer containing the decomposition product; and a step of recovering the organic layer.

Method of recovering decomposition product of thermosetting resin cured product and method of producing recycled material

A method of separating an inorganic material, the method comprising in the following order: a contact process of contacting a processing solution with a composite material, the composite material including a first organic substance that is decomposable by the processing solution, a second organic substance that is not decomposable by the processing solution, and an inorganic material; and a separation process of separating the inorganic material from the processing solution including a decomposition product of the first organic substance and the second organic substance, the contact process and the separation process including adjusting the processing solution to have a temperature that is equal to or greater than a softening point of the second organic substance.

Method of separating inorganic material, method of producing reprocessed material and method of removing organic substance

A method of separating an inorganic material, the method comprising in the following order: a contact process of contacting a processing solution with a composite material, the composite material including a first organic substance that is decomposable by the processing solution, a second organic substance that is not decomposable by the processing solution, and an inorganic material; a separation process of separating the processing solution including a decomposition product of the first organic substance, from a recovered product including the inorganic material and the second organic substance; and a thermal treatment process of subjecting the recovered product to a thermal treatment at a temperature that is equal to or greater than a temperature at which the second organic substance is eliminated.

An organic material removing device includes: a container for storing a composite material containing an inorganic material and an organic material decomposable by a treatment liquid; a treatment tank including an accommodation portion for accommodating the container, a treatment liquid inflow portion for allowing the treatment liquid to flow in, and a treatment liquid outflow portion for allowing the treatment liquid to flow out; temperature control means for heating or cooling the treatment liquid; and a treatment liquid circulation means for allowing the treatment liquid to flow in from the treatment liquid inflow portion into the treatment tank and allowing the treatment liquid in the treatment tank to flow out from the treatment liquid outflow portion.

Organic material removing device

A resource allocation method, a resource allocation program, and a resource allocation apparatus in which a request reception server subjects an inputted SQL to a syntax analysis. At least one SQL process is extracted from the input SQL, and a resource cost of a database required by a BES (Back End Server) to perform the SQL process for each of one or more process types contained in the SQL process is calculated. Further, an allocation ratio is determined for allocating the resource of a request executing server to a virtualized server in accordance with a resource cost ratio required by each of the BES to execute the SQL process. Additionally, requests are made for execution of the respective BES on the virtualized server to which the resource has been allocated so as to execute the SQL process.

Resource allocation method for a physical computer used by a back end server including calculating database resource cost based on SQL process type

The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.

Composition of polycyanate ester and biphenyl epoxy resin

The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.

Thermosetting resin composition, and prepreg and laminated board using the same

A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein Rrepresents hydrogen, a halogen, or a C&#x2013;Chydrocarbon group; Rrepresents a halogen or a C&#x2013;Chydrocarbon group; x istoand each of m and n is a natural number; and () a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Thermosetting resin composition and use thereof

An adhesive-coated copper foil which comprises a copper foil and disposed on one side thereof a layer of an adhesive composition comprising (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as an optional ingredient, and (d) a compound having a triazine ring or isocyanuric ring. The adhesive layer has low hygroscopicity, excellent heat resistance, and satisfactory adhesion to copper foils. By using the adhesive-coated copper foil, a copper-clad laminate and a printed circuit board both having excellent properties can be obtained.

Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same

An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Production of insulating varnishes and multilayer printed circuit boards using these varnishes

A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or short fibers dispersed in said semi-cured thermosetting resin, and if necessary, a carrier film attached or bound to said prepreg is suitable for producing multilayer printed circuit boards of reduced thinness, high wiring density and high connection reliability with high productivity and low production cost.

Prepreg for printed circuit board

A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Process for producing multilayer printed circuit board for wire bonding

Ultra high molecular weight epoxy resins are produced in a short time by polymerizing a difunctional epoxy resin having two epoxy group per molecule and a dihydric phenol by heating the difunctional epoxy resin and the dihydric phenol which are present in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1, in an amide solvent, in the presence of a polymerization catalyst, and the ultra high molecular weight epoxy resins are linearly polymerized so highly as to have the capability of being formed into films having high strength.

Method of producing high molecular weight epoxy resin using an amide

An epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80.degree. to 130.degree. C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.

Growing community of inventors

Tokyo, Japan

Kazuhito Kobayashi