Nippon Soda Co., Ltd.

Kazuhisa Kumazawa

Tomoya Hidaka

Yoshitaka Fujita

Norifumi Nakamoto

Eiji Hoshi

Hiromoto Shibata

Toshiaki Takahashi

The present invention provides a method for producing a replica mold for imprinting use which is inexpensive and has good properties including strength and flexibility. The method for producing a replica mold according to the present invention comprises the steps of: (A) coating a substrate with an organic-inorganic hybrid material; (B) semi-curing the coated surface with heat and/or an electromagnetic ray to produce a substrate for fine raised and depressed pattern formation; (C) pressing a master mold having a predetermined fine raised and depressed pattern formed thereon against the substrate for fine raised and depressed pattern formation by an imprinting method to transfer the fine raised and depressed pattern onto the substrate; and (D) irradiating the substrate for fine raised and depressed pattern formation onto which the fine raised and depressed pattern is transferred with an electromagnetic ray to cure the substrate.

Process for production of replica mold for imprinting use

A solution for forming an organic thin film wherein the total starting amount of metal surfactants (A) and (B) is 0.05 to 50 wt %, the amount of a hydroxyl group-containing compound generated with the progress of the hydrolysis reaction is 20 ppm to 6 wt %, and the amount of a compound (C) that can interact with the metal surfactant is 0.01 ppm to 8 ppm in terms of metal, relative to the total amount of the solution for forming an organic thin film.

Method for forming organic thin film

It is to provide a solution for forming an organic metal thin film that can form rapidly a dense monomolecular film with less impurity. A solution for forming an organic thin film comprising 

Solution for formation of organic thin film, and method for production thereof

A method is provided for forming an organic thin film comprising:

A method is provided for producing an organic thin film on a substrate surface comprising improved heat resistance or durability; said method comprising at least a step (B) of allowing the substrate to contact with an organic solvent solution comprising a metal surfactant having at least one or more hydrolysable group or hydroxyl group, and a catalyst that can interact with the metal surfactant, wherein the method further comprises after step (B), step (E1) of heating the substrate which has been in contact with the organic solvent solution at 100&#xb0; C. to 150&#xb0; C.; step (E2) of immersing the substrate which has been in contact with the organic solvent solution in a warm water of 40&#xb0; C. or more and less than the boiling point; or step (E3) of allowing the substrate which has been in contact with the organic solvent solution to contact with a moisture vapor of 60&#xb0; C. to 150&#xb0; C.

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Ichihara, Japan

Kazuhisa Kumazawa