Ibiden Company Limited

Other

Kazuhisa Kitajima

Ayao Niki

Hiroshi Tanaka

Susumu Kagohashi

Ayumi Suzuki

Yukari Kajiyama

Ryo Aoki

A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.

Printed wiring board and method for manufacturing same

A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component.

A roll coater with which an interlaminar resin insulating layer and/or a solder resist layer can be formed with good thickness uniformity to enable the manufacture of a printed circuit board free from the no-hole defect and anomalies in the diameter and geometry of the holes for via-hole and/or solder bump which is due to uneven layer thickness, thus having high electrical integrity and reliability. This roll coater is used for forming an interlaminar resin insulating layer and/or a solder resist layer in the manufacture of a printed circuit board including a substrate and, as serially built up thereon, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition, with a solder resist layer formed on top of the resulting multilayer structure, which comprises rolls each having a surface formed with a multiplicity of grooves running in the direction of roll rotation, with the grooves in the roll-end or marginal areas of the surface being relatively reduced in depth as compared with the remaining area.

Growing community of inventors

Ogaki, Japan

Kazuhisa Kitajima