Tdk Corporation

Fujikin Inc.

Akebono Brake Industry Co., Ltd.

Sekisui Plastics Co., Ltd.

Other

Tohoku University

Ckd Corporation

Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Tokyo Electron Limited

Atom Medical Corporation

Sekisui Kasei Co., Ltd.

Kazuhiro Yoshikawa

Kenichi Yoshida

Michio Yamaji

Mitsuhiro Tomikawa

Koichi Tsunoda

Nobukazu Ikeda

Tetsuya Kojima

Hitoshi Saita

Tadahiro Ohmi

Tsutomu Shinohara

Toshifumi Maehara

Tatsuo Namikawa

Takashi Ohtsuka

Yuuki Aburakawa

Kouji Nishino

Ryousuke Dohi

Takashi Hirose

Yukio Minami

Eiji Ideta

Satoshi Kagatsume

Mutsunori Koyomogi

Takeshi Oohashi

Shigetoshi Sugawa

Jun Hirose

Tsuneyuki Okabe

Hajime Kuwajima

Kenji Yamamoto

Akifumi Kamijima

Yukio Murata

Tomio Uno

Daiki Ishii

Masahiko Nakazawa

Yuichiro Okuyama

Yuji Kawano

Kunihiko Daido

Akihiro Morimoto

Shigeaki Tanaka

Keiji Hirao

Shigeru Itoi

Hiroshi Koizumi

Ichiro Matsubara

Toshiaki Ishii

Yoshinao Takahashi

Hideki Nagaoka

Naoki Hashiguchi

Michihiro Kumagae

Junki Nakamoto

Takaaki Hatori

Norihiko Matsuzaka

Takahiko Fujita

Shuhei Ogawa

Kenichi Goshima

George Hoshi

Kazuki Soeda

Kazuo Fukasawa

Shuichi Sasahara

Yoshihiko Koizumi

Akiyasu Iioka

Tatsuro Yoshida

Akinori Nagaya

Tomotsugu Ohashi

Teppei Uchimura

Hideo Kobayashi

Kunio Kato

Shinichi Yamadera

Shinichiro Toda

Masahiko Sogao

Takeshi Sakai

Ryo Iizuka

Seiichi Iida

Shogo Mashimo

Atsuo Matsutani

Kohei Noma

Kazuki Kato

Yoshiki Nakayama

Kunio Katou

Yuta Minoshima

Kazunari Oowada

Hideki Miyahara

Takashi Motomura

Tetsuro Yoshida

Naoko Odagiri

Daiki Kusunoki

Kazuhiko Sudo

Yasuaki Shioyama

Kazuhiro Sasaki

Hidetoshi Ninomiya

Takashi Natsume

Mikio Iryo

Takayuki Sindo

An electronic component includes: a conductive pattern provided on the main surface of a substrate and constituting a lower electrode; a dielectric film that covers top and side surfaces of the conductive pattern; and a conductive pattern stacked on the top surface of the conductive pattern through the dielectric film and constituting an upper electrode. A part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly. Partially removing a part of the dielectric film that is parallel to the main surface of the substrate allows stress relaxation. This prevents peeling at the interface between the lower electrode and the dielectric film.

Electronic component having the dielectric film not covers a corner part of the lower electrode

Provided is a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, wherein the capacitance portion has an opening which extends in a lamination direction in which the plurality of electrode layers and the dielectric layer are laminated and through which one electrode layer of the plurality of electrode layers is exposed, the one electrode layer has an exposed portion exposed at a bottom surface of the opening, the exposed portion is in contact with a wiring layer connecting the one electrode layer and an electrode terminal, and a thickness of the exposed portion of the one electrode layer is smaller than a thickness of other portions of the one electrode layer and is 50% or more of the thickness of the other portions of the one electrode layer.

Thin film capacitor

Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.

Thin film capacitor having a dielectric layer having a through hole whose inner surface has first and second tapered surfaces, circuit board incorporating the same, and thin film capacitor manufacturing method

Provided is a biological information detection device capable of restraining noise from being mixed with a signal relating to biological information. A biological information detection device includes an electrode pad that is able to detect a signal (bioelectric signal) relating to biological information of a subject (for example, a fetus in a mother's body), a connector that is connectable to the electrode pad, and a cable that is connected to the connector and is able to transmit the signal. The electrode pad and the connector are provided with fixing members and that are attachable to and detachable from each other, respectively.

Biological information detection device

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Electronic component and its manufacturing method

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. The upper electrode layer has a connection part connected to the lower electrode layer through the through hole and an electrode part insulated from the connection part by a slit. A surface of the lower electrode layer that contacts the connection part through the through hole includes an annular area positioned along an inner wall surface of the through hole and a center area surrounded by the annular area. The annular area is lower in surface roughness than the center area.

Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method

An adhesive hydrogel has low contact resistance against the body surface and excellent conformability and adhesiveness to the body surface, so that noise generation can be reduced. Such adhesive hydrogel enables measurements of weak fetal heart rate signals. The adhesive hydrogel includes a polymer matrix prepared by crosslinking-copolymerization of an acrylamide derivative, which is a nonionic polymerizable monomer including a polymerizable carbon-carbon double bond in a molecule, and polyfunctional (meth)acrylamide, which is a crosslinkable monomer comprising 2 or more polymerizable carbon-carbon double bonds in a molecule, water, a polyvalent alcohol, and an electrolyte salt, wherein a laminate of the adhesive hydrogel with an Ag/AgCl sheet exhibits the impedance of 1&#x3a9; to 100&#x3a9; at the frequency of 0.1 Hz measured in accordance with the method of ANSI/AAMI EC12:2000, and the dynamic elastic modulus G' at the frequency of 1 Hz measured at 25&#xb0; C. and dispersed frequencies is 1.0&#xd7;10Pa to 1.0&#xd7;10Pa.

Adhesive hydrogel and medical electrode using the same

A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.

Electronic component-incorporating substrate

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Electronic component

A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

Thin-film capacitor and method for manufacturing thin-film capacitor

Disclosed herein is a thin film capacitor that includes a capacitive insulating film, a first metal film formed on one surface of the capacitive insulating film, and a second metal film formed on other surface of the capacitive insulating film and made of a metal material different from that of the first metal film. The thin film capacitor has an opening penetrating the capacitive insulating film, first metal film, and second metal film. The second metal film is thicker than the first metal film. A first size of a part of the opening that penetrates the first metal film is larger than a second size of a part of the opening that penetrates the second metal film.

Thin film capacitor and circuit board incorporating the same

An object of the present invention is to provide a gel sheet comprising an intermediate base, having no variation in adhesiveness. A gel sheetcomprising a gel materialand an intermediate baseembedded in the gel material, wherein when T represents the thickness of the gel sheet, and S represents the amplitude of the intermediate base, a relation represented by the following expression (1) is satisfied:&#x2264;0.4&#x2003;&#x2003;(1)

Gel sheet

Provided is a manufacturing method of a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, the manufacturing method including a lamination process of alternately laminating the plurality of electrode layers and a dielectric film and forming a laminated body which will be the capacitance portion, a first etching process of forming an opening extending in a laminating direction with respect to the laminated body and exposing the dielectric film laminated directly on one of the plurality of electrode layers on a bottom surface of the opening, and a second etching process of exposing the one electrode layer at the bottom surface of the opening. In the second etching process, an etching rate of the one electrode layer is lower than an etching rate of the dielectric film.

Etching manufacturing method of thin film capacitor

A thin film capacitor includes a capacitance portion in which a plurality of electrode layers and dielectric layers are alternately laminated, a cover layer, an insulating layer, a via hole in which one electrode layer different from an uppermost electrode layer among the plurality of electrode layers is exposed at a bottom surface thereof, and an opening which is provided inside the via hole and in which the one electrode layer is exposed at a bottom surface thereof, and in which the cover layer and the insulating layer are exposed at a side surface. The opening includes a first opening portion which passes through the insulating layer and a second opening portion which is provided below the first opening portion and passes through the cover layer, and when an inner diameter of the first opening portion is D1 and an inner diameter of the second opening portion is D2, D1&#x3e;D2.

Thin film capacitor and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Kazuhiro Yoshikawa