Murata Manufacturing Co., Ltd.

Kazuhiro Yoshida

Nobushige Moriwaki

Shigeki Nishiyama

Kenichi Watanabe

Yasuhiko Kubota

Hideki Otsuka

Mitsuru Nagashima

Kazuyuki Kubota

Yukio Tanaka

Yuji Kimura

Hiroki Horiguchi

Yoji Itagaki

Makoto Murata

Masahiro Nishio

Akio Shobu

Jun Sonoyama

Masanobu Kishi

Akihiko Nakata

Akira Kumada

Osamu Yamaoka

Takeshi Azumi

Teiji Yamamoto

Hiroshi Hamamura

Yoshihiro Omura

Junichi Oda

Shikou Miyazaki

Mitsugu Suyama

Hiromasa Fujii

A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

Ceramic electronic component and method for manufacturing the same

Banks, as well as a plurality of recess-shaped cells defined by the banks, are provided in an image section formed in a gravure printing plate. A projecting portion is provided in each of the cells so as to protrude from a part of the base surface of that cell. The projecting portions are in positions distanced from the banks. Like the banks, the projecting portions can serve as starting points for the transfer of a printing paste. Accordingly, printing paste that would, in the case where the projecting portions are not provided, remain in the bases of the cells is transferred to the printing target material via the projecting portions, which increases the transfer efficiency. As a result, a paste film that is smooth and has the required thickness can be printed.

Gravure printing plate and manufacturing method thereof, gravure printing machine, and manufacturing method for laminated ceramic electronic component

A light-emitting-element mount substrate formed by relatively simple manufacturing steps, having a good heat release property, and having a high mechanical strength; and an LED device including the light-emitting-element mount substrate are provided. A substrate body of a light-emitting-element mount substrate is made of a low-resistance semiconductor (e.g., n-type silicon) substrate, and is divided into a first and second individual substrate bodies by an insulating layer. A first front-surface mounting electrode and a first external-connection electrode are formed on respective first and second major surfaces (e.g., front and back surfaces) of the first individual substrate body. A second front-surface mounting electrode and a second external-connection electrode are formed respective first and second major surfaces (e.g., front and back surfaces) of the second individual substrate body. The insulating layer has a shape different from a straight-line shape in plan view.

Light-emitting-element mount substrate and LED device

Banks, as well as a plurality of substantially recess-shaped cells defined by the banks, are provided in an image section formed in a gravure printing plate. Each of edge cells located along an outer edge of the image section is provided with a projecting portion that projects from a part of a base surface of that edge cell, and each projecting portion is distanced from the banks and located closer to the outer edge than the center of the corresponding edge cell. Preferably, the projecting portions and the banks that face the outer edge are positioned at a predetermined interval from the outer edge, and substantially frame-shaped recess portions that extend continuously along the outer edge are provided in the image section.

A dynamic sensor includes a weight having an H shape in a plan view. The weight includes a first weight portion and a second weight portion which have substantially rectangular parallelepiped shapes and are aligned in a short side direction at an interval and a bridge portion which connects the first and second weight portions and extends in the aligned direction. The bridge portion connects the first and second weight portions at an approximate center thereof in a long side direction. Supports are located in a region between the first and second weight portions where the bridge portion is not provided. The first weight portion is connected to a first support via a first beam and to a second support via a second beam. The second weight portion is connected to the first support via a third beam and to the second support via a fourth beam.

Dynamic sensor

In a ceramic capacitor, first and second electrode terminals each include a bonded-to-substrate portion, a first bonded-to-electrode portion bonded to a first edge of one of first and second external electrodes, a second bonded-to-electrode portion bonded to a second edge of the one of first and second external electrodes and disposed at a distance from the first bonded-to-electrode portion in the first directions, and a connecting portion connecting the first and second bonded-to-electrode portions and the bonded-to-substrate portion. W/Wis about 0.3 or more, and h/L is about 0.1 or more.

Ceramic capacitor and electronic component including the same

A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50&#xb0; C. to about 150&#xb0; C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other. In this case, a recess is formed in the vicinity of a portion of the sealing layer to be brought into contact with the sealing frame so that a bump, generated from the sealing layer which is deformed in the joining step, is prevented from protruding toward the functional unit.

Method for manufacturing electronic component

An element structure has a polyimide resin applied on a surface of a first substrate to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured first polyimide layer. A polyimide resin is applied on a surface of a second substrate to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured second polyimide layer. The cured first and second polyimide layers are pressed on each other and heated to a bonding temperature, thereby joining the polyimide layers together. Thus, the first substrate and the second substrate are combined with the polyimide layer being the bonded structure of the polyimide layers therebetween.

Element structure and method for producing the same

A method for efficiently manufacturing a semiconductor device, the semiconductor device having an FET and a pn junction diode provided on the same semiconductor substrate, the FET having a Schottky junction for a gate electrode and a gate recess, includes the steps of forming a channel layer, a first etching stopper layer, an n-type common layer, a second etching stopper layer, a p-type layer, and a third etching stopper layer on the semiconductor substrate in that order; etching away the p-type layer and the third etching stopper layer in specific regions; simultaneously forming a source electrode, a drain electrode, a cathode; forming a mask having an opening for forming a gate recess and a gate electrode and an opening for forming an anode; forming the gate recess by etching while the third etching stopper layer prevents the p-type layer from being etched; and simultaneously forming the gate electrode and the anode.

Semiconductor device and manufacturing method thereof

In a terminal member, a protuberance is formed so as to protrude toward an external electrode, and thereby, a bonding portion where the terminal member is bonded to the external electrode, the bonding portion being formed with solder, is extended substantially linearly across a part of the external electrode. Preferably, the direction in which the bonding portion is elongated linearly is in parallel to that in which internal electrodes are extended. Further, it is preferable that the bonding portion is as wide as possible, and the center of the bonding portion in the width direction is as near to the center of the end-face of the capacitor body as possible.

Monolithic ceramic capacitor

A ceramic condenser module includes at least one first multi-layered ceramic condenser and at least one second multi-layered ceramic condenser, which are mounted to a front surface and a back surface of a substrate, respectively. When a total surface area of the outside surfaces of the mounted first and second multi-layered ceramic condensers excluding surfaces thereof opposing the substrate is defined as S , and a total equal to S and a surface area of the outside surface of the substrate excluding the area covered by the first and second multi-layered ceramic condensers is defined as S , S is equal to or greater than about 1.3 times S . With this arrangement, the ceramic condenser module is suitable for use with large amounts of current, has excellent heat-dissipation effect, is much smaller and much less expensive.

Ceramic condenser module

An inverter capacitor module includes a plurality of substrates having a plurality of ceramic capacitors provided on the top surfaces thereof, and first and second feeding unit lands having conductive films provided on both surfaces thereof and arranged to feed the plurality of ceramic capacitors, the first and second feeding unit lands on both surfaces thereof being electrically connected to each other, a conductive spacer inserted between the plurality of substrates for establishing one of an electrical connection between the first feeding unit lands of an underlying substrate and its overlying substrate and an electrical connection between the second feeding unit lands of an underlying substrate and its overlying substrate, a fixing member arranged to fix the plurality of substrates laminated via the conductive spacer, and a switching module fixed below the bottom substrate among the plurality of substrates that are laminated. In the inverter capacitance module, the switching module is fixed to the plurality of substrates by the fixing element.

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Shimane-ken, Japan

Kazuhiro Yoshida