Olympus Corporation

Konica Minolta, Inc.

Konica Corporation

Micron Technology Incorporated

Mitsubishi Heavy Industries Limited

Other

Shinko Electric Industries Co., Ltd.

Subaru Corporation

Elpida Memory, Inc.

Olympus Optical Company, Ltd.

Nippon Telegraph and Telephone Corporation

Komatsu Corporation

Konishiroku Photo Industry Co., Ltd.

Konami Digital Entertainment Co., Ltd.

Ricoh Company, Ltd.

Kazuhiro Yoshida

Takeshi Hakii

Toshiyuki Kinoshita

Hiroshi Ishidai

Takatoshi Igarashi

Noriyuki Fujimori

Takatoshi Tsujimura

Ken Fujisaki

Yasuo Tanigami

Chie Onuma

Yoshinao Komatsu

Satoshi Inoue

Masahiko Shimizu

Hisayuki Nagamine

Tomohiro Yamada

Hiroki Moriyama

Hirokazu Takenaka

Yasushi Okubo

Takayuki Hara

Shigeru Kojima

Yasuhiro Ueda

Yoshikazu Watanabe

Takamitsu Sakamoto

Satoshi Takekoshi

Sohei Ueda

Yasuhiko Takamuki

Saneyuki Goya

Akiko Inoue

Yasuyuki Fujiya

Kenji Yoshino

Toshiyuki Takabayashi

Sakae Takehana

Takeo Arai

Nobuaki Kagawa

Ryota Ozaki

Shinichiro Tajiri

Tomoki Funakubo

Keiichi Arai

Tomoyuki Nakayama

Yuji Kasuya

Takeshi Sampei

Tatsuya Yamaguchi

Yasushi Usagawa

Kazuhiko Hirabayashi

Takuro Suyama

Yasunori Ono

Keiichi Kawaguchi

Tatsuya Inoue

Satoshi Komoriya

Toshiharu Nagashima

Akira Kataoka

Shun Furukawa

Kiichiro Sawada

Kumiko Ishii

Tomonobu Moriya

Ryuichi Narita

Kenji Yano

Takuya Machida

Takanao Komaki

Syoji Nishio

Takeo Sugimoto

Kei Higashi

Hiroaki Itoh

Yutaka Tatsuno

Ryosuke Aoki

Ken Yamamoto

Ayako Wachi

Hiroyuki Araki

Masami Hamada

Yasuhiro Nakagami

Koichi Umeyama

Yuki Kani

Hiroshi Tomaru

Chikara Kurimura

Takeyoshi Nishimura

Kana Eguchi

Emiko Hatano

Takahiro Minowa

Kayoko Masuda

Mayumi Iizuka

Takashi Ohnuki

Minako Ono

Ichiro Takahashi

Kensuke Suga

Hiroyuki Ushiroyama

Shuichi Yada

Hideki Yano

Hidekane Ozeki

Atsunobu Sakamoto

Yutaka Fujisawa

Sachiko Fukui

Yaku Hiranabe

Yoko Murakami

Masaru Iwasaki

Masako Minami

Hiromi Yoshikawa

Taro Kanamaru

Toshiyuki Takemoto

Takuya Ando

Akira Uchiyama

Devices are disclosed. A device may include a command and address (CA) interface including a first pair of input circuits arranged in a first direction. The CA interface further including at least one additional pair of input circuits arranged in a second direction relative to the first pair of input circuits. Associated systems are also disclosed.

Centralized placement of command and address signals in devices and systems

A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser machining the workpiece; and a nozzle unit that sprays a gas across an irradiation zone of the workpiece surface created by the laser irradiation unit. The nozzle unit is configured so as to increase the flowrate of the gas supplied to the irradiation zone, from one end to the other end of the machining groove.

Laser machining device

This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.

Laser processing device

A circuit board includes a magnetic shielding member having a first principal surface, and a second principal surface on an opposite side from the first principal surface, and a flexible wiring board having a first surface, and a second surface on an opposite side from the first surface. The second surface of the flexible wiring board is fixed to the first principal surface and the second principal surface of the magnetic shielding member. The first surface of the flexible wiring board includes a circuit area mounted with an electronic component, and one or more terminal areas where connection terminals are disposed. The circuit area is disposed above the first principal surface of the magnetic shielding member. The circuit board has a bent shape bent along the magnetic shielding member, so that the one or more terminal areas are disposed below the second principal surface of the magnetic shielding member.

Circuit board and circuit module

An additive manufacturing device comprises a lower nozzle that blows out inert gas into a chamber in a horizontal direction through a lower opening portion formed in a lower part of a first side wall constituting the chamber, and an upper nozzle that blows out the inert gas into the chamber through an upper opening portion formed in an upper part of the first side wall, wherein the upper nozzle includes a window nozzle that blows out the inert gas along an inner surface of a window portion of a top board constituting the chamber, and an oblique nozzle that blows out the inert gas obliquely downward from the upper portion of the first side wall.

Additive manufacturing device

An additive manufacturing nozzles includes a header () extending in a width direction of the chamber and which is configured to be supplied with inert gas from the outside, and a nozzle body () connecting with the header () in the width direction and is configured to horizontally blow out the inert gas, which is supplied from the header, to a molding area. The nozzle body has a honeycomb part () which defines an inside of the nozzle body into flow channels through which the inert gas flows, a blowout part () disposed downstream of the honeycomb part and which is connected with the honeycomb part in the width direction. The inert gas passed through the plurality of flow channels is led from the honeycomb part to the blowout part, and a porous part (), which has openings, is disposed between the honeycomb part and the blowout part.

Additive manufacturing nozzle and additive manufacturing device

A circuit board includes a support member having a first major surface and a second major surface opposite the first major surface, and an elastic interconnect substrate having a first surface and a second surface opposite the first surface, at least part of the second surface being fixed to the first major surface and the second major surface of the support member, wherein the first surface of the interconnect substrate includes a circuit region where an electronic component is mounted and at least one electrode region where at least one external electrode is arranged, wherein the circuit region is disposed indirectly on the first major surface of the support member, and wherein the interconnect substrate is bent around the support member, and at least part of the electrode region is disposed indirectly on the second major surface of the support member.

Circuit board

A semiconductor apparatus includes an interconnect substrate having a first major surface, a first semiconductor device having a second major surface and mounted to the interconnect substrate, the second major surface opposing the first major surface, a second semiconductor device having a third major surface and a fourth major surface and mounted to the first semiconductor device, the third major surface opposing the first major surface, the fourth major surface opposing the second major surface, a through hole formed through the interconnect substrate at a position overlapping the second semiconductor device in a plan view taken in a thickness direction of the interconnect substrate, and a heatsink member disposed in contact with part of the third major surface, at least a part of the first major surface, and at least a part of a sidewall surface of the through hole.

Semiconductor apparatus and method of making the same

Devices are disclosed. A device may include an interface region including two or more input circuits operably coupled to the number of input signals, wherein one of the two or more input circuits for each input signal is adjacent at least two other input circuits coupled to different input. Associated systems are also disclosed.

Centralized placement of command and address in memory devices

An endoscope includes an image pickup apparatus, and the image pickup apparatus includes an imager includes an external electrode, a stacked device, a top electrode on a top surface, and a bottom electrode on a bottom surface, a three-dimensional wiring board having a first zone to which the external electrode is bonded, a second zone to which the top electrode or the bottom electrode is bonded, a third zone to which the top electrode or the bottom electrode is bonded, and a fifth zone arranged on a side surface of the stacked device, wherein the top surface, the bottom surface, and at least two side surfaces of the stacked device are covered with the wiring board.

Endoscope and image pickup apparatus

An instantaneous heartbeat reliability evaluation apparatus includes: extraction means which extracts waveforms having a maximum value corresponding to depolarization of a heart in a biosignal of an examinee; first calculation means which calculates an interval between two waveforms neighboring in a time series; dividing means which divides a signal output from measurement means into signals of predetermined periods; second calculation means which calculates feature quantities of a potential of each divided signal; first evaluation means which evaluates whether a measurement state of each divided signal is normal or abnormal on the basis of feature quantities; and second evaluation means which evaluates measurement states of two neighboring extracted waveforms on the basis of an evaluation result obtained by the first evaluation means and evaluates reliability of a measurement state of the interval between the waveforms depending on a type of the evaluated measurement states of the waveforms.

Instantaneous heartbeat reliability evaluation device, method, and program

A vehicle includes a motor, a second drive source, and a drive controller. The motor is a first drive source configured to drive wheels. The motor has a plurality of switchable modes that differ in at least one of a number of poles or a type of torque for rotating a rotor. The second drive source is configured to drive the wheels in parallel with the motor. The drive controller is configured to set, during switching of the modes, a target driving force of the second drive source to be larger than a target driving force of the second drive source before the switching of the modes.

Vehicle

An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

Image pickup apparatus, method of manufacturing image pickup apparatus, and endoscope

A vehicle includes an engine; a continuously variable transmission; an output clutch disposed between the continuously variable transmission and the drive wheel; a drive motor coupled between the output clutch and the drive wheel; a traveling mode controller; and a speed ratio controller. In a case where required driving power based on an accelerator position is less than a first threshold, the traveling mode controller switches a traveling mode to a first traveling mode. In a case where the required driving power is equal to or greater than the first threshold, the traveling mode controller switches the traveling mode to a second traveling mode. In a case where the required driving power is less than the first threshold and equal to or greater than a second threshold, the speed ratio controller causes a speed ratio of the continuously variable transmission to change depending on a vehicle speed.

Memory devices, memory systems, and systems, include memory devices with a bonding pad region for coupling command-and-address (CA) input signals and a memory cell region for storing information in memory cells. A centralized CA interface region includes input circuits coupled to the CA input signals. At least two of the input circuits are configured in pairs. Each pair includes a first input circuit coupled to a first input and configured to generate a first output and a second input circuit coupled to a second input and configured to generate a second output. Each pair also includes a swap circuit disposed between the first input circuit and the second input circuit. The swap circuit selects one of the first output or the second output for a first internal signal and selects the other of the first output and the second output for a second internal signal responsive to a control signal.

Centralized placement of command and address swapping in memory devices

Growing community of inventors

Tokyo, Japan

Kazuhiro Yoshida