Mitsui Minings & Melting Co., Ltd.

Oak-mitsui Inc.

Kazuhiro Yamazaki

Toshifumi Matsushima

Fujio Kuwako

Takashi Syoujiguchi

Tetsuro Sato

Pranabes K Pramanik

Kensuke Nakamura

Akira Ichiryu

Hideaki Miwa

Jaclyn Radewitz

An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, 'a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted' is adopted. Then as a process for manufacturing a capacitor circuit forming piece, the dielectric layer constituting material obtained above is used and a process for forming a second electrode at a position facing the first electrode is conducted.

Method for manufacturing dielectric layer constituting material, dielectric layer constituting material obtained thereby; method for manufacturing capacitor circuit forming piece using dielectric layer constituting material, capacitor circuit forming piece obtained thereby; and multi-layer printed wiring board obtained by using dielectric layer constituting material and/or capacitor circuit forming piece

Polymer-ceramic composite materials for use in the formation of capacitors, which materials exhibit very low changes in temperature coefficient of capacitance (TCC) in response to changes in temperature within the range of from about &#x2212;55&#xb0; C. to about 125&#xb0; C. Specifically, these capacitor materials have a change in TCC ranging from about &#x2212;5% to about +5%, in response to changes in temperature within the desired temperature range. The inventive composite materials comprise a blend of a polymer component and ferroelectric ceramic particles, wherein the polymer component includes at least one epoxy-containing polymer, and at least one polymer having epoxy-reactive groups. The inventive polymer-ceramic composite materials have excellent mechanical properties such as improved peel strength and lack of brittleness, electrical properties such as high dielectric constant, and improved processing characteristics.

Polymer-ceramic composites with excellent TCC

The present invention relates to a double-sided copper-clad laminate for forming a capacitor layer, formed by adhering electrodeposited copper foils on the both sides of a dielectric layer of a thickness of 10 &#x3bc;m or less, and the object of the present invention is to secure good voltage resistant proprieties. For the double-sided copper-clad laminate of the present invention uses an electrodeposited copper foil provided with a matte side to be joined to the dielectric layer prepared by physically polishing the rough surface of an untreated electrodeposited copper foil obtained by an electrolysis method to a surface roughness (Rz) of 0.5 &#x3bc;m to 3.0 &#x3bc;m, and nodular treatment, and as required, passivation, silane coupling agent treatment, or the like are performed thereon. As the manufacturing method thereof, a manufacturing method wherein the surfaces of the resin layers of two electrodeposited copper foils having resin layers facing to each other are adhered, or the like.

Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer

An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, 'a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 &#x3bc;m in the average particle size D, 0.2 to 2.0 &#x3bc;m in the weight cumulative particle size Dbased on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D/Dwhere the weight cumulative particle size Dand the average particle size Dobtained by the image analysis'; and the like are used.

DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE

The present invention provides a technique which permits the withstand voltage measurement of a laminate web for capacitor layer manufactured by a continuous laminating method in a roll state wound around a core tube. The invention provides a roll of laminate for capacitor layer which is obtained by manufacturing a laminate web for capacitor layer by laminating a first electrically conductive layer, a dielectric layer and a second electrically conductive layer and winding this laminate web for capacitor layer from a start end side to a terminal end side thereof around a core tube. In the laminate web for capacitor layerto be wound around the core tube, the in-plane laminating arrangement of the first electrically conductive layer, the second electrically conductive layerand the dielectric layeris contrived, and by superposing an insulating resin film F on one side of this laminate web for capacitor layer and simultaneously winding this insulating resin film to make the laminate web for capacitor layer in a roll state, whereby a roll of laminate web for capacitor layer for withstand voltage inspection in which electrical insulation between layers overlapping each other is formed. The invention also provides a method of performing withstand voltage inspection which involves partially removing interlayer dielectric means of the laminate web for capacitor layerpositioned in the periphery of the roll of laminate web for withstand voltage inspection and performing the inspection using the exposed first and second electrically conductive layers.

Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection

The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The capacitor comprises a pair of parallel conductive foils separated by a pair of dielectric layers. The dielectric layers are further separated by a heat resistant film layer such that the capacitor exhibits excellent short circuit resistance. The resulting capacitor exhibits excellent void and electrical short resistance.

Growing community of inventors

Ageo, Japan

Kazuhiro Yamazaki