Fujitsu Corporation

Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Kazuhiro Tashiro

Shigeyuki Maruyama

Daisuke Koizumi

Naoyuki Watanabe

Makoto Haseyama

Naohito Kohashi

Keisuke Fukuda

Hirohisa Matsuki

Yoshiyuki Yoneda

Kenichi Nagashige

Takafumi Hashitani

Tetsurou Honda

Takumi Kumatabara

Yasuyuki Itoh

Ei Yano

Tetsushi Wakabayashi

Futoshi Fukaya

Yoshikazu Arisaka

Hitoshi Izuru

Tetsuya Fujisawa

Toru Nishino

Osamu Igawa

Takayuki Nakashiro

Susumu Koshinuma

Kazuhiko Shimabayashi

Yuushin Kimura

Shigeru Goto

Takayuki Katayama

Yuji Maruyama

Masayoshi Shirakawa

Tetsu Ozawa

Yasuyuki Itou

A prober includes a probe card provided with a support board and a probe attached to the support board, a stage on which a measurement wafer is mounted, a camera provided over the probe card to observe an electrode pad of a first semiconductor chip formed on the measurement wafer, and a stage moving unit for moving the position of the stage relative to the probe card.

Prober and method of inspecting semiconductor chip

A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state

A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

Tray in combination with electronic component attaching tool attached to the tray

A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Method of semiconductor device protection

A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

Semiconductor device packaging structure

A testing device of a semiconductor device includes a first board having a plurality of openings; a frame body provided in the openings, the frame body having a frame in which a plurality of probe needles is provided; and a plurality of second boards provided perpendicular to the first board in the periphery of the openings, the second boards being connected to the first board; wherein the probe needles pierce the frame so as to be connected to the second boards from the periphery of the frame body via the openings.

Testing device for testing a semiconductor device

An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.

IC socket with attached electronic component

The present invention provides a high-quality semiconductor integrated circuit device, where the semiconductor integrated circuit device, a SiP or especially PoP semiconductor integrated circuit device, enables a simultaneous testing of the reliability of multiple upper and lower semiconductor integrated circuit elements; it also enables a testing of only the non-defective element in case the other is determined defective; moreover, only the defective unit is exchangeable with a non-defective unit. The semiconductor integrated circuit device of the present invention contains multiple semiconductor integrated circuit elements, e.g. semiconductor integrated circuit devicesand, and a circuit boardwhich relays the respective semiconductor integrated circuit elementsand, and at least a part of the circuit board, e.g. test pads, can be electrically connected to an external test apparatus when the semiconductor integrated circuit devicesandare electrically connected to the circuit board

Semiconductor integrated circuit device and test method thereof

A contact terminal formed of an electrically conductive material is arranged in each of a plurality of holed of a contactor substrate. An electrically conductive part is formed on an inner surface of each hole. The contact terminal has a first contact part that contacts a terminal of an electronic part and a second contact part that contacts the electrically conductive part in a middle portion. When the contact terminal bends by the first contact part being pressed, the second contact part contacts the electrically conductive part of the contactor substrate and an appropriate degree of contact pressure is obtained.

Contactor and test method using contactor

Method of semiconductor device protection, package of semiconductor device

A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.

Contactor for electronic components and test method using the same

An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Electronic component attaching tool

A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.

Contactor having contact electrodes of metal springs embedded in a plate-like structure

Semiconductor device protection cover, and semiconductor device unit including the cover

Growing community of inventors

Kawasaki, Japan

Kazuhiro Tashiro