Kabushiki Kaisha Toshiba

Toyoda Gosei Co., Ltd.

Alpad Corporation

Kazuhiro Tamura

Hiroaki Oshio

Hidenori Egoshi

Kazuhiro Inoue

Yukio Watanabe

Takanobu Kamakura

Tetsuro Komatsu

Satoshi Shimizu

Teruo Takeuchi

Takafumi Nakamura

Masakata Koseki

Iwao Matsumoto

Toshihiro Kuroki

Mitsuhiro Kobayashi

Masahiro Ogushi

Yoshio Ariizumi

Hiroko Tsukamoto

Takumi Komoto

Shinichi Sanda

Makoto Yamamura

Naoya Ushiyama

Tatsuichiro Maki

A semiconductor light emitting device includes a light emitting chip that includes a semiconductor layer at a first surface. A transparent film is provided on the semiconductor layer and forms an interface therewith. A phosphor resin layer, including a resin and a phosphor, is provided on the transparent film. A refractive index of the transparent film is greater than a refractive index of the semiconductor layer.

Semiconductor light emitting device

Light-emitting diode

According to one embodiment, an LED package includes (2&#xd7;n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2&#xd7;n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2&#xd7;n) lead frames and another terminal connected to each of lead frames of the (2&#xd7;n) lead frames other than the n lead frames. The resin body covers the (2&#xd7;n) lead frames and the n LED chips.

LED package

A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.

Light emitting device including bleed-out preventing notches

A semiconductor light emitting element exhibiting a characteristic of deflected luminous intensity distribution, a semiconductor light emitting device capable of making, even when the element is off the center, a luminous center close to the center, and an element scribing method having a high element separation rate without causing a crack and chipping of pellet edges. The semiconductor light emitting element involves the use of a scribed pellet 10 into which a wafer including a semiconductor layer such as a luminous layer that is stacked on a compound semiconductor substrate inclined at 5.degree. through 20.degree. to a surface (100) in a orientation [011], is subjected to an element separation process by a scribing method.

Semiconductor light emitting element, semiconductor light emitting

Growing community of inventors

Fukuoka, Japan

Kazuhiro Tamura