Tokyo Shibaura Denki Kabushiki Kaisha

Kazuhiro Takeda

Kunihiro Ikari

Hideo Honma

Osamu Sasaki

Tsutomu Takamura

Katsuhiro Takahashi

Toshiki Sasabe

There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: ##STR1## Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.

Chemical copper-plating bath

A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer to provide the non-masked region as a circuit-forming region. Further, the circuit-forming region is treated with a solution of an oxidizing agent and, then, subjected to an activation treatment. Finally, the mask is removed and a desired conductive layer pattern is formed on the activated surface region by means of electroless plating.

Method of forming printed circuit

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Yokohama, Japan

Kazuhiro Takeda