Neomax Materials Co., Ltd.

Daishinku Corporation

Neomax Co., Ltd.

Kazuhiro Shiomi

Masaaki Ishio

Minoru Iizuka

Yoshikiyo Ogasawara

Fumiaki Kikui

Masayuki Yokota

Tsuyoshi Hasegawa

Toshiaki Fujita

A Cu&#x2014;Mo substrateaccording to the present invention includes: a Cu basecontaining Cu as a main component; an Mo base having opposing first and second principal facesand containing Mo as a main component, the second principal faceof the Mo basebeing positioned on at least a portion of a principal faceof the Cu base; and a first Sn&#x2014;Cu-type alloy layercovering the first principal faceand side facesandof the Mo base, the first Sn&#x2014;Cu-type alloy layercontaining no less than 1 mass % and no more than 13 mass % of Sn.

Cu-Mo substrate and method for producing same

A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member () mainly composed of Cu, a substrate () mainly composed of Mo and a brazing layer () consisting of an Sn&#x2014;Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.

Heat sink member and method of manufacturing the same

A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 &#x3bc;&#x3a9;&#xb7;cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.

Electrode wire for solar cell

An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.

Electronic component package and method of manufacturing same

A lid material () according to the present invention comprises: a base layer () composed of a low thermal expansion metal; an intermediate metal layer () provided on one surface of the base layer () and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm; and a brazing material layer () provided on the intermediate metal layer () and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer () and the brazing material layer () are press- and diffusion-bonded to each other, and the brazing material layer () has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material () exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package. Further, the lid suppresses the breakage of the case, and ensures excellent brazing workability.

Growing community of inventors

Ibaraki, Japan

Kazuhiro Shiomi