Sony Corporation

Other

Sony Chemical & Information Device Corporation

Tessera Interconnect Materials, Inc.

Kazuhiro Shimizu

Takashi Yokokawa

Hidetoshi Kawauchi

Lachlan Bruce Michael

Tamotsu Ikeda

Toshiyuki Miyauchi

Koji Naniwada

Soichiro Kishimoto

Nobuo Komatsu

Tadaaki Yuba

Mitsuyuki Takayasu

Kiyoe Nagai

Samuel Asangbeng Atungsiri

Takuya Okamoto

Masayuki Hattori

John Nicholas Wilson

Tomoo Iijima

Kazuhisa Funamoto

Masanobu Yagi

Kenichiro Hanamura

Kazuki Takizawa

Shuji Ishihara

Masaru Fujinami

Kouichi Takemoto

Hirofumi Himei

Tsukasa Suzuki

An annular valve in which the shape of a sealing surface of a valve body is optimized thus suppressing the occurrence of pressure loss in gas on the periphery of the sealing surface and extending the service life of the annular valve. The annular valve comprises: a valve seatformed in a plate-like shape and including passage flow channelseach having an opening cross section formed in an arcuate shape; a receiving plateformed in a plate-like shape and having discharge flow channels, the receiving platebeing arranged to face the valve seatby way of an intermediate chamber; a valve bodyformed in an annular shape corresponding to the arcuate shape of the opening cross section of the passage flow channeland being arranged in the intermediate chamber, the valve bodybeing brought into contact with/separated from the valve seatso as to open/close the passage flow channel; and a plurality of spring memberssupported by the receiving plate, the spring memberseach biasing elastically the valve bodytoward the valve seat. A sealing surfaceof the valve bodythat faces the passage flow channelis formed in a shape where at least one of pressure loss elements with respect to gas flowing towards the valve bodyfrom the passage flow channelis eliminated.

Annular valve and valve body for annular valve

Disclosed herein is a signal processing apparatus including a first detection block; a second detection block; a duration detection block; a duration information output block; and a demodulation block.

Signal processing apparatus, signal processing method, and reception system

Disclosed herein is a receiving apparatus including: first to third position determination sections configured to determine the start position of an FFT interval which serves as a signal interval targeted for FFT by an FFT section; a selection section configured to select one of those start positions of the FFT interval which are determined by the first through the third position determination section; and the FFT section configured to perform FFT on the OFDM time domain signal by regarding the start position selected by the selection section as the start position of the FFT interval in order to generate the first OFDM frequency domain signal.

Receiving apparatus, receiving method, and program

A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.

Method for manufacturing multilayer wiring board

A reception apparatus includes: an extraction section; a transmission line characteristic estimation section; an estimation section; a frequency shift amount production section; a control section; an addition section; a first frequency shifting section; a second frequency shifting section; an interpolation section; a compensation section; a detection section; and an operation section.

Reception apparatus, reception method and program

A reception apparatus including an extraction section; a transmission line characteristic estimation section; an interpolation section; a compensation section; a detection section; and a selection section.

Disclosed is a multilayer wiring board in which a copper foil is bonded by a thermocompression bonding onto an insulating layer having a bump for interlayer connection buried therein, and the copper foil and the bump are electrically connected to each other. The copper foil is provided with an oxide film having a thickness of 50 &#x212b; to 350 &#x212b; on a surface in contact with the bump and an insulating layer. In a manufacturing process, for example, an oxide coating of the copper foil to be subject to the thermocompression bonding is removed by acid cleaning, and then an oxide film having an appropriate thickness is formed by irradiating the copper foil with ultraviolet light. Consequently, reliability in electrical connection between the copper foil and the burn is adequately ensured, while achieving sufficient mechanical connection strength between the copper foil and the insulating layer.

Multilayer printed circuit board and method for manufacturing same

A method for making a printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate, comprised of a core materialat least one side of which carries a land, and flexible substrates, andcomprised of core materialson at least one surface of which a bumpfor electrical connection to the landis formed protuberantly. The rigid substrateand the flexible substratestoare molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.

Method for producing printed wiring board

A printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate , comprised of a core material at least one side of which carries a land , and flexible substrates and comprised of core materials on at least one surface of which a bump for electrical connection to the land is formed protuberantly. The rigid substrate and the flexible substrates to are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.

Printed wiring board and method for producing the same

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Ishikawa, Japan

Kazuhiro Shimizu