Kokusai Electric Co., Ltd.

Kazuhiro Shimeno

Kouji Tometsuka

Yasuhiro Inokuchi

Tetsuaki Inada

Fumihide Ikeda

Hisashi Nomura

Junichi Machida

Hideki Kaihotsu

Masayuki Tomita

Shigeo Ohba

A semiconductor fabricating apparatus having a vertical reaction furnace, a boat for holding plural wafers in a multi-layered fashion and being loaded into the vertical reaction furnace, a storage disposed at a location corresponding to the boat for storing at least one of the wafer cassettes, a wafer transfer device for transferring the wafer between the storage and the boat, a cassette transfer unit for transferring the wafer cassettes between the apparatus and outside thereof, a cassette transfer device for effecting the transfer of the wafer cassettes between the cassette transfer unit and the storage, and a plurality of cassette shelves disposed within a range allowing transfer of the wafer cassettes from the cassette transfer device for receiving the wafer cassettes in upwardly-oriented positions. With the apparatus thus arranged, it becomes possible to modify the positional displacement of the wafer relative to the wafer cassettes since the wafer cassettes can be transported on to the cassette shelves in upwardly-oriented positions.

Semiconductor fabricating apparatus, method for modifying positional displacement of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassette

A substrate processing apparatus includes a substrate supporting pedestal having an upper substrate supporting pedestal and a lower substrate supporting pedestal which are vertically stacked, an upper resistance heater provided above the upper substrate supporting pedestal so as to be opposite to the upper substrate supporting pedestal, and a lower resistance heater provided under the lower substrate supporting pedestal so as to be opposite to the lower substrate supporting pedestal. Each of the upper substrate supporting pedestal and the lower substrate supporting pedestal is capable of mounting a substrate or substrates in a substantially horizontal position, and the lower substrate supporting pedestal including an opening which exposes the substrate in its entirety or openings which expose the substrates in their entireties as viewed from under the lower substrate supporting pedestal.

Heat treatment of semiconductor wafers where upper heater directly heats

A wafer transfer plate adapted to be disposed on a wafer transfer unit for transferring a wafer within a wafer manufacturing system, which comprises at least one wafer contact portion designed to be held in contact with the wafer as the wafer transfer plate is loaded with the wafer, a coated film being formed of a material which does not contain harmful elements and provided at a region including the wafer contact portion.

Wafer transfer plate

Growing community of inventors

Tokyo, Japan

Kazuhiro Shimeno