Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Kazuhiro Noda

Hiroshi Haji

Kiyoshi Arita

Akira Nakagawa

Tadahiko Sakai

Shoji Sakemi

Tetsuhiro Iwai

Mitsuru Ozono

Teruaki Nishinaka

Teruaki Kasai

Siniti Nakazato

In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

In a semiconductor wafer including a plurality of imaginary-divided-regions which are partitioned by imaginary-dividing-lines that are respectively arranged in a grid-like arrangement on the semiconductor wafer and a circumferential line that is the outer periphery outline of the semiconductor wafer, a mask is placed so as to expose an entirety of surfaces of the wafer corresponding to respective removal-regions. The removal-regions are regions in approximately triangular form partitioned by the circumferential line of the wafer and the imaginary-dividing-lines. Then, plasma etching is performed on a mask placement-side surface of the wafer, by which the semiconductor wafer is divided into the individual semiconductor devices along dividing lines while portions corresponding to the removal-regions of the wafer are removed.

Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

With use of a length-dimension of a second-line-segment of a unit-device-formation-region as an arrangement interval, a plurality of parallel lines are disposed in a device-formation-effective-region on a wafer so as to form a plurality of parallel-line-partition-regions, the unit-device-formation-regions are arranged in each of the parallel-line-partition-regions independently of and separately from other parallel-line-partition-regions so that the acquisition number of the unit-device-formation-regions is maximized, and an arrangement of the respective unit-device-formation-regions in the respective parallel-line-partition-regions is determined as an arrangement of the entire device-formation-effective-region.

Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions

A conductive ball mounting equipment for mounting conductive balls on electrodes of a plurality of electronic components formed on a substrate, including a suction tool having a suction face to cover each one of divided blocks on the substrate, a suction part which is formed on the suction face of the suction tool, corresponding to the arrangement pitches of the electronic components and sucks the conductive balls to the positions corresponding to the electrodes, and a suction limiter for sucking the conductive balls only to the specified suction part corresponding to the electronic components in the divided blocks. According to this construction, the conductive balls can be efficiently and stably mounted on the electrodes of the electronic components of the substrate.

Method for mounting conductive balls on a substrate

A vacuum processing apparatus for performing plasma etching in a processing chamber on a base. An actuator, when lowered, forms a closed processing chamber by pressing a lid member onto a work platform, and, when raised, opens the processing chamber by setting the lid member apart from the work platform. The actuator is disposed above the lid member, and frame posts and conveying means, of the work are disposed so as not to block the front side of the lid member, and therefore a free working space for serviceman is kept at the front side of the lid member. Therefore, the serviceman can easily do maintenance work of the lid member or preparation of the processing chamber.

Vacuum processing apparatus with improved maintainability

In a soldering ball mounting apparatus, a pickup head is movable between a soldering ball feeder and a workpiece to be mounted with soldering balls. The pickup head has a bottom formed with a large number of absorber holes for vacuum-absorbing the soldering balls from the soldering ball feeder. On the way to the workpiece, light is irradiated onto the bottom of the pickup head from the exterior. When the light leaks into the pickup head, the leakage light is detected by a light detector provided in the pickup head so that presence of a soldering-ball pickup error is determined. On the other hand, on the way to the soldering ball feeder after mounting the soldering balls onto the workpiece, light is irradiated along the bottom of the pickup head from one side. Accordingly, when the light is not received at the opposite side, at least one soldering ball remains attached to the bottom of the pickup head so that presence of a soldering-ball mounting error is determined.

Growing community of inventors

Fukuoka, Japan

Kazuhiro Noda