Mitsubishi Electric Corporation

Copyer Co., Ltd.

Mitsubishi Denki Kabushiki Kaisha

Renesas Electronics Corporation

Asahi Kasei Microdevices Corporation

Kazuhiro Nishimura

Iwao Kawamura

Naoki Kiyohara

Kensuke Izuma

Kazuhiro Murakami

Ryoma Suzuki

Kiyokazu Namekata

Koji Yamamoto

Naoki Yamada

Yoshiyuki Matsumoto

Kiyotoshi Ueda

Makoto Ueno

Atsunobu Kawamoto

Shinsuke Godo

Satoru Sasame

Kazuki Yamada

Masao Matsubara

Masataka Mametuka

Shinji Motoi

A first clamp circuit () clamps a voltage between a gate and a first terminal of a switching device (Q) to equal to or lower than a first clamp voltage. A control circuit () controls the switching device (Q) and includes a driving unit () driving the switching device (Q), an abnormality detecting unit () stopping the driving unit () upon detection of an abnormality in operation, and a second clamp circuit (). The second clamp circuit () clamps the voltage between the gate and the first terminal to equal to or lower than a second clamp voltage which is lower than the first clamp voltage when the abnormality detecting unit () stops the driving unit ().

Semiconductor device

A semiconductor-product testing device that supplies a test pattern for testing a semiconductor product to the semiconductor product includes a pattern memory that stores a part of the test pattern. The pattern memory is rewritten during a time when the semiconductor product is tested by a part of the test pattern stored in the pattern memory included in the semiconductor-product testing device.

Semiconductor-product testing device, method for testing semiconductor product, and semiconductor product

An additional test pattern acquiring unit acquires a test pattern, which is not yet executed to the semiconductor device serving as a target of executing an additional test among test patterns stored in a test pattern information DB, as an additional test pattern with reference to a semiconductor manufacturing history information DB. Also, an additional test transmitting unit transmits the additional test pattern acquired by the additional test pattern acquiring unit to the semiconductor device serving as the target of the additional test through a network. An additional test result acquiring unit acquires a test execution result together with an ID of the semiconductor device, and a registration unit registers identification information of the executed test pattern, an execution result of the test pattern, and an execution timing of the test in a semiconductor product history information DB so as to be associated with the acquired ID of the semiconductor device.

Semiconductor product quality management server, semiconductor device, and semiconductor product quality management system

In a detector apparatus, a first magnetosensitive unit includes first and third magnetic resistor elements arranged next to each other in a moving direction of the to-be-detected unit and electrically connected in series between a first potential and a second potential, a second magnetosensitive unit includes second and fourth magnetic resistor elements arranged next to each other in the moving direction of the to-be-detected unit and electrically connected in series between the first potential and the second potential, and as for resistances for a same magnetic field, a relation of whether or not a resistance of the third magnetic resistor element is higher than a resistance of the first magnetic resistor element is the same as a relation of whether or not a resistance of the second magnetic resistor element is higher than a resistance of the fourth magnetic resistor element.

Detector apparatus and detector system

An end of a high-voltage electrode () is connected to a high-voltage terminal of a semiconductor device (). An end of a low-voltage electrode () is connected to a low-voltage terminal of the semiconductor device (). A resin () seals the semiconductor device (), the end of the high-voltage electrode (), and the end of the low-voltage electrode (). A first discharge electrode () is provided to a portion of the high-voltage electrode () not covered by the resin (). A second discharge electrode () is provided to a portion of the low-voltage electrode () not covered by the resin (). The first and second discharge electrodes () protrude to face each other.

Semiconductor apparatus, ignition device for internal combustion engine, and internal combustion engine system

A semiconductor device of the present invention achieves improved avoidance of a parasitic operation in a circuit region while achieving miniaturization of the semiconductor device and a reduction in the amount of time for manufacturing the semiconductor device. The semiconductor device according to the present invention includes an IGBT disposed on a first main surface of a semiconductor substrate provided with a drift layer of a first conductivity type; a thyristor disposed on the first main surface of the semiconductor substrate; a circuit region; a hole-current retrieval region separating the IGBT and the circuit region in a plan view; and a diffusion layer of a second conductivity type, the diffusion layer being disposed on a second main surface of the semiconductor substrate. The IGBT has an effective area equal to or less than an effective area of the thyristor in a plan view.

Semiconductor device, manufacturing method therefor and semiconductor module

A power semiconductor device for an igniter comprises: a semiconductor switching device causing a current to flow through a primary side of an ignition coil or shutting off the current; and an integrated circuit driving and controlling the semiconductor switching device, wherein the integrated circuit includes: a first discharge device discharging charge accumulated on a control terminal of the semiconductor switching device and shutting off the semiconductor switching device so as to generate ignition plug spark voltage on a secondary side of the ignition coil during a normal operation; and a second discharge device slower discharging the charge accumulated on the control terminal in comparison with the first discharge device and shutting off the semiconductor switching device so that a voltage on the second side of the ignition coil is equal to or lower than the ignition plug spark voltage during an abnormal state.

Power semiconductor device for igniter

A semiconductor apparatus includes an electroconductive member; a switching device electrically connected to the electroconductive member on the electroconductive member and having a withstand voltage between a front side and a back side as a first withstand voltage; a back-side high-withstand-voltage integrated circuit provided on the electroconductive member separately from the switching device, incorporating a control circuit for controlling turning-on/off of the switching device, and having a withstand voltage between a front side and a back side as a second withstand voltage higher than the first withstand voltage; an insulating substrate provided on the electroconductive member separately from the switching device and the back-side high-withstand-voltage integrated circuit; input/output wiring connected to the insulating substrate; first wiring connecting the insulating substrate and the switching device; and second wiring connecting the insulating substrate and back-side high-withstand-voltage integrated circuit.

Semiconductor apparatus using back-side high-withstand-voltage integrated circuit

An image forming apparatus having a print member for forming an image on a recording sheet while reciprocating in a predetermined direction includes a pair of conveyance rollers and a separating member for separating the of conveyance rollers from one another. A control lever for controlling the separating member is provided as is a changeover element for permitting the control lever to rotate when said print member moves in a predetermined direction and is not located at an interference area in which the print member would collide with the conveyance rollers if they were separated, and for prohibiting the control lever from rotating when the print member is located at the interference area.

Image forming apparatus

An input signal for testing a device is stored in a first storage located on a test board. An expectation value signal output by the device, when it operates normally, in response to the input signal is stored in a second storage located on the same test board. The input signal from the first storage is supplied to the device based on an instruction from a tester body. The device outputs an output signal in response to input of this input signal. This signal is sent to a comparator. The comparator compares the signal output from the device with the expectation value signal stored in and output from the second storage.

Tester, a test system, and a testing method for a semiconductor integrated circuit

To detach a cleaning roller from a fixation unit , an assembly is taken out from the fixation unit , and the cleaning roller is detached from the assembly . Thereby, in the fixation unit , the operation of detaching and attaching the cleaning roller for cleaning a pressure roller is made easier.

Fixation unit having contact and pressure rollers

A cam,is rotated in an arrow F direction. This causes sheet conveyance rollers,and guide elements,to rotate on a lower conveyance shaft,and an upper conveyance shaft,, respectively, so that they are separated from a drive roller,. Thus, a spur plate,faces the upward stream end with respect to the recording sheet conveyance direction and opens in synchronism with the sheet conveyance rollers,and,, etc. Accordingly, it is possible to readily remove a recording sheet subjected to the jam.

Image forming device

Ink-jet image forming device

An IC measuring method including positioning a plurality of ICS, each having a plurality of circuit blocks performing different functions, selecting different circuit blocks in each of the plurality of ICs, measuring the test results from each of the selected circuit blocks, and selecting a different circuit block in each of the plurality of ICs for the next measurement. The circuit block selection is controlled by a matrix circuit or by physically shifting the positions of the ICs.

IC measuring method

A semiconductor integrated circuit device includes individual circuit blocks which are tested according to the method of the invention. Circuit blocks of a semiconductor integrated circuit device may be tested independently of one another until all circuit blocks have been tested, or alternatively may be simultaneously tested. The multi-test method of the invention simultaneously tests plural semiconductor integrated circuit devices by successively testing corresponding circuit blocks on each semiconductor integrated circuit device. The test apparatus of the present invention is of minimal size and complexity, and greatly enhances testability of a semiconductor integrated circuit device.

Growing community of inventors

Tokyo, Japan

Kazuhiro Nishimura