Fujifilm Corporation

Fuji Photo Film Company, Limited

Yamaha Hatsudoki Kabushiki Kaisha

Toyo Seikan Kaisha, Ltd.

Fujinon Corporation

Kazuhiro Nishida

Hiroshi Maeda

Masayuki Hirano

Yasunori Ohta

Tatsuya Suzuki

Hiroyuki Hasegawa

Yasufumi Takahashi

Nobuo Hara

Yoshihisa Negishi

Shunichi Hosaka

Kiyofumi Yamamoto

Eiichirou Tsujii

Kosuke Takasaki

Eiji Watanabe

Yasufumi Tadaki

Masatoshi Yasumatsu

Toshio Takeuchi

Atsushi Imai

Hitoshi Shimamura

Shigehisa Shimizu

Takayuki Fujiwara

Kazuaki Takahashi

Toshiaki Kuniyasu

Azuchi Endo

Yosuke Hirayama

Hirokazu Saito

Takashi Kido

Satoshi Mino

Toshio Sue

Seitaro Kanazawa

Masaki Takamatsu

Kiyohumi Yamamoto

Hirokatsu Ogawa

Tomohito Maeda

Satoshi Fujita

Naoyuki Takagi

Yu Kitamura

Kenichi Watanabe

Yoshiaki Yamamoto

Mitsutoshi Imamura

Nobuo Tsuchiya

Eiichiro Tsujii

Kiyokazu Fujiwara

Kunihiko Fukawa

Seitarou Kanazawa

A straddle-type vehicle including left and right front wheels effectively prevents deterioration of a travel feeling caused by vibrations occurring in the left and right front wheels. The straddle-type vehicle includes a body frame, left and right front wheels, a link mechanism configured to connect the left and right front wheels with the body frame, a shock absorber configured to damp vibrations in the same phase occurring in the left and right front wheels, and a damper configured to damp vibrations in opposite phases occurring in the left and right front wheels. The damper is configured such that its damping force increases at least in a certain frequency range as the frequency of the vibrations in the opposite phases increases.

Straddle-type vehicle

A saddle riding type vehicle includes a stabilizer arranged to support a pair of wheels arranged at opposite sides of a vehicle body to be movable up and down relative to the vehicle body, and a switching mechanism arranged to switch between a movable state in which the pair of wheels are permitted to move up and down and a locked state in which the pair of wheels are restricted from moving up and down. The switching mechanism includes a coupling pin member arranged to engage with the stabilizer to set the stabilizer to the locked state thereby restricting rotation of the stabilizer relative to the vehicle body, and to disengage from the stabilizer to set the stabilizer to the movable state thereby permitting rotation of the stabilizer relative to the vehicle body, and a solenoid fixed to the vehicle body and arranged to drive the coupling pin member into and out of engagement with the stabilizer. When the switching mechanism switches to the locked state, the vehicle can be parked and stored conveniently with the vehicle body standing unassisted.

Saddle riding type vehicle

A saddle riding type vehicle includes a right wheel and a left wheel, a right lower arm and a left lower arm swingably provided on a vehicle arranged to support the right wheel and the left wheel to be movable up and down, and a right stopper member and a left stopper member arranged to contact the right lower arm and the left lower arm to stop the vehicle body from leaning in excess of a predetermined amount, which do not stop leaning of the vehicle body when the lean amount of the vehicle body is less than the predetermined amount. The vehicle body is arranged to lean freely when the lean amount of the vehicle body is in a range not exceeding the predetermined amount. Therefore, the rider can preferably travel comfortably.

The present invention provides a resin coated seamless aluminum can and a resin coated aluminum can lid having adhesiveness and corrosion resistance by applying a non-chromium chemical conversion coated film to an aluminum alloy sheet and by applying an organic resin layer to the non-chromium chemical conversion coated film. For this end, an organic-inorganic composite surface treated layer containing 2 to 20 mg/mof zirconium compound expressed in terms of zirconium atoms, 1 to 10 mg/mof phosphorus compound expressed in terms of phosphorus atoms, and 5 to 60 mg/mof organic compound expressed in terms of carbon atoms is formed on at least one-side surface of an aluminum alloy sheet, and an organic resin coated layer is formed on the organic-inorganic composite surface treated layer.

Resin-coated seamless aluminum can and resin-coated aluminum alloy lid

A saddle riding type vehicle includes a balancer beam rotatably mounted on a vehicle body to cause a right wheel and a left wheel to move up and down in opposite directions, and is capable of making turns by leaning the vehicle body. The saddle riding type vehicle also includes a headlight, a drive mechanism arranged to rotate the headlight, a front detector arranged to detect a rotation angle of the balancer beam relative to the vehicle body, and a controller programmed to control the drive mechanism based on a result of detection by the front detector. The rotation angle detected by the front detector corresponds to an angle of the vehicle body leaning sideways relative to a traveling surface (relative lean angle). The controller controls the drive mechanism based on such result of detection by the front detector. The headlight can therefore illuminate directions of movement properly.

An electronic endoscope system includes an electronic endoscope having a CMOS image sensor on the tip of an insertion section, a light source device for illuminating the interior of a patient's body, and a processing device for reading out image signals from the CMOS image sensor. The electronic endoscope system can operate with a standard imaging mode and a special imaging mode. When the time taken to read out the image signals from all the pixels in the standard mode is defined as T, the light source device in the special imaging mode emits illumination light in every first half period T/2 while switching a wavelength of the illumination light between two different wavebands. In every second half period T/2, the processing device reads out the image signals from the half of the pixels.

Electronic endoscope system

A plurality of sensor packages () are fixed to a circuit assembly board () and placed on a lower mold die () of a transfer molding apparatus (). Attached inside a cavity () of an upper mold die () is a protection sheet (), which will make contact with the upper face of a cover glass () of each sensor package (). When the upper mold die () meshes with the lower mold die (), the upper face of the cover glass () is tightly covered with the protection sheet (). A plunger () is activated to fill the cavities () with sealing resin (). The upper face of the cover glass () is not stained or damaged when the peripheries of the sensor packages () are sealed.

Solid state imaging device and manufacturing method thereof

A can that features superior resistance against puncture under higher puncture strength, and superior resistance against flange cracking. The resin-coated aluminum seamless can body of the present invention features superior resistance against cracks in the can wall during distribution, and resistance against flange cracking, wherein the inner and/or outer surface of the can of the aluminum seamless canis coated with a layer of thermo-plastic resin, the thickness of the thermoplastic resin layers of the inner surface and the outer surface is a total of 2-50 &#x3bc;m, with a minimum thickness of the aluminum plate of the side wall of the can 0.110 mm or less, and the tensile stress at break measured for the aluminum plate that is removed from the thermo-plastic resin of the side wall of the can in the direction of the circumference of the can, is 450 MPa or less, the product of the minimum thickness of a plate of the side wall of the can including the thermo-plastic resin &#x3c;t&#x3e; (mm), and the tensile stress measured of the side wall of the can including the thermo-plastic resin in the direction of height of the cans (MPa), is &#x3c;t &#xd7;s&#x3e;&#x2267;30. The thermo-plastic resin layer is a thermo-plastic polyester resin layer having oriented crystals, wherein the heat of fusion of the polyester resin layer is not less than 15 J/g.

Resin-coated aluminum seamless can body featuring superior resistance against cracks in the can wall during distribution, and against flange cracking

A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.

Solid-state imaging device and electronic endoscope using the same

A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.

Solid-state imaging device and method for manufacturing the same

A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low &#x3b1;-ray glass.

It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

Solid-state imaging device and method of manufacturing said solid-state imaging device

A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.

There are provided a semiconductor substrateon which solid-state imaging devices are formed, and a translucent memberprovided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrateto a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate

Solid-state imaging device and method of manufacturing the same

Growing community of inventors

Kanagawa, Japan

Kazuhiro Nishida