Sharp Kabushiki Kaisha Corporation

Kazuhiro Nakao

Yoshinori Oogita

Shigeki Komaki

Katsuhide Shino

Kazuhito Ozawa

Yukihiro Inoue

Yoshitomo Kitanishi

Yoshitugu Imano

Yoshiro Itoh

An electronic apparatus comprising a plurality of assembly elements and a heat-sensitive adhesive synthetic resin film tape inserted between the plurality of assembly elements and the heat adhesive synthetic resin tape to integrally bond the elements together into a composite structure which is thin in size and sufficiently elastic to resist bending and twisting.

Thin electronic apparatus

A card-type thin electronic device in which the upper and lower panels are bonded to flanges projecting from a side-wall forming frame between the two panels, while a number of grooves are formed by a half-etching process on the surfaces of both panels bonded against the side-wall forming frame.

Card-type thin electronic device

A paper battery for connection to terminals protruding in same direction has positive and negative electrode plates joined together by a sealing agent therebetween formed with an insulating sheet. A hole penetrating one of the electrode plates and the insulating sheet to reach the other electrode plate and another hole penetrating the other of the electrode plates to reach the insulating sheet are provided such that not only is the battery connected properly to the terminals when it is inserted correctly but also a short circuit will be avoided even if the paper battery is inserted in upside-down direction.

Paper battery

A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.

Method for bonding an LSI chip on a wiring base

A liquid crystal display panel to electrically and mechanically be connected to a substrate of an electronic apparatus comprises a liquid crystal display, a terminal connection member, and a metal plate such as a stainless. The terminal connection member is provided for electrically and mechanically coupling the liquid crystal display with the substrate of the electronic apparatus at a terminal connection portion. The metal plate is positioned at the terminal connection portion to shield a hard and fragile substrate of the liquid crystal display.

Growing community of inventors

Nara, Japan

Kazuhiro Nakao