Dainippon Screen Mfg. Co., Ltd.

Kabushiki Kaisha Toshiba

Kazuhiro Nakai

Kiyoshi Kitamura

Atsushi Ando

Itaru Furukawa

Yoshikazu Ichioka

Shigeaki Shimazu

Nobuaki Usui

Ryo Yamada

Yoshihiko Onogawa

Tetsuo Asano

Ryouichi Inanami

It is an object to generate wiring data while controlling generation of omission of wiring and shortening process time. In order to achieve this object, a device for generating wiring data includes: an error acquiring part that acquires a configuration error of the semiconductor chip relative to a certain reference position and a certain reference angle on the substrate; an area information acquiring part that acquires enclosing area information indicating an enclosing area enclosing the semiconductor chip on the substrate; and a wiring data generating part that generates enclosing area wiring data indicating an enclosing area wiring pattern based on a reference fan-out line established for a reference chip free from a configuration error and being a part of a reference wiring pattern free from faulty wiring. The enclosing area wiring pattern is a part of the connection wiring pattern and covers the enclosing area. The wiring data generating part generates the enclosing area wiring data such that the position and the angle of the reference fan-out line relative to the reference chip, and the position and the angle of a fan-out line for the semiconductor chip on the substrate relative to this semiconductor chip, agree with each other independently of the configuration error.

Device for and method of generating wiring data, and imaging system

Input CAD data and run-length data obtained by performing a RIP process on the input CAD data are acquired. A predetermined conversion process is performed on at least one of the input CAD data and the run-length data to make the data formats of both data comparable and then both data are compared with each other to detect an area having a difference as a defect area in the run-length data. This provides a technique to detect a defect in the run-length data to be used for drawing of a figure before the execution of drawing with a simple structure.

Defect inspection apparatus, defect inspection program, recording medium storing defect inspection program, figure drawing apparatus and figure drawing system

A method for creating charged-particle-beam exposure data containing a description of an exposure sequence of character patterns to perform exposure of a charged-particle-beam according to a character projection technique, comprising selecting first or second values as a parameter to transfer one character pattern and then transferring a subsequent character pattern, the first value regarding performance of a shaping deflector which deflects the charged particle beam so that the charged particle beam is applied to an arbitrarily character aperture formed in a CP aperture mask and a character beam having the shape of the character aperture is thereby created, and the second value regarding performance of an objective deflector which deflects the character beam so that the character beam is applied to an arbitrarily position of the deflection region of the specimen, and determining the exposure sequence of the character patterns in the deflection region in accordance with the selected parameter.

Method for creating charged-particle-beam exposure data, method for manufacturing semiconductor device, and program

In a pattern writing apparatus for writing a plurality of pattern blocks of LSI chips which are arrayed on a substrate, provided are a rasterization part ( ) for rasterizing LSI data , an expansion/contraction rate calculation part for obtaining the expansion/contraction rate of a substrate ( ) on the basis of an image from a camera ( ), a data correction part ( ) for correcting raster data ( ) in accordance with the expansion/contraction rate and a data generation part ( ) for generating writing data on the basis of the corrected data. From the writing data generated by the data generation part ( ), an array of pattern blocks in which the width of a non-pattern region between adjacent ones of the pattern blocks is changed while the width of each pattern block is maintained is written on the substrate.

Pattern writing apparatus, pattern writing method and substrate

A beam direct-writing apparatus for writing a pattern on a semiconductor substrate is provided with a head part for emitting an electron beam for direct writing and a computer for performing a computation. A program is installed in the computer in advance to obtain a path passing through a plurality of writing points on the substrate. The program divides a region ( ) dotted with writing points ( ) into a plurality of divided regions on the basis of the density of the points contained therein and sets a passing order among a plurality of divided regions by using an algorithm for generating the Hilbert Curve. Subsequently, the program sets a path in each of the divided regions by using a path setting algorithm and subsequently connects the path in one divided region to the path in another divided region according to the passing order, to obtain a final path ( ). This allows an efficient beam direct-writing on a substrate ( ).

Beam direct-writing apparatus, imaging apparatus and method of obtaining preferable path passing through points

The present invention provides an improved technique for extracting contours in an image without waiting for processing of all the scanning lines in the image. Run-data on two boundary scanning lines, each representing the boundary coordinates at which the image changes, are stored in a run-data buffer. A contour extraction unit compares two sets of the run-data with one another to extract segment vectors and detect a set of closed-loop vectors defining a contour of a image area. Three registers in a working buffer store specific data representing the relationship between a starting point and a terminal point of each vector sequence and are used in detecting closed-loop vectors. A vector data memory stores vector data including coordinate values of start and end points of closed-loop vectors. The contour extraction unit detects a vector sequence which has a starting point identical with a terminal point as a function of the data registered in the working buffer to identify the vector sequence as a closed-loop.

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Kyoto, Japan

Kazuhiro Nakai