Matsushita Electric Industrial Co., Ltd.

Other

Matsushita Electronics Corporation

Nissho Corporation

Shigematsu Co.

Mori Industrial Engineering Laboratory

Kazuhiro Mori

Yoshihiko Misawa

Eiji Itemadani

Souhei Tanaka

Shigeru Araki

Akira Kabeshita

Yasuo Taki

Kiyoshi Mayahara

Takashi Akiguchi

Hiroshi Nakagawa

Uzo Tomii

Yukihiko Asao

Ichiro Nakayama

Takao Inoue

Junji Ikeda

Yoshifumi Kitayama

Mikio Hasegawa

Keiji Saeki

Masahiro Maruyama

Masuo Tanno

Hidetoshi Kawa

Sohei Tanaka

Yozo Uotsu

Eiji Fujii

Mikiya Nakata

Naomi Nishiki

Hidenori Miyakawa

Daido Komyoji

Yoshio Maruyama

Hiroshi Yamauchi

Katsuhiko Yamamoto

Taketoshi Matsuura

Osamu Hikita

Yoshinori Wada

Naoyuki Hashimoto

Yoshiyuki Kubota

Kazuo Watanabe

Shuichi Murakami

Tatsuki Nogiwa

Toshihide Hane

Shigeru Araki, Deceased

Norihisa Honsho

Teruo Shoji

Kanji Sugio

Noboru Izutani

Yasuyuki Watanabe

Comprising: an IC tagthat is attached to a work in processof a portable telephoneand memorizes information related to a production condition of the portable telephone; a mounting devicethat reads out the information related to the production condition of the portable telephonefrom the IC tagand mounts components of the portable telephone, based on the readout information related to the production condition of the portable telephone, on the work in processwith the IC tagattached; an inspection devicethat reads out the information related to the production condition of the portable telephonefrom the IC tag, and inspects the work in process, which the IC tagis attached and the components of the portable telephoneare mounted, based on the readout information related to the production condition of the portable telephone; and an editing devicethat writes the information related to production of the portable telephoneinto the IC tag

Production system and production method

A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

Method of manufacturing article having electronic circuit

The band,which stores little parts,in many storing dents,arranged along a longitudinal direction and packs the little parts,by covering surfaces of the storing dents,with a cover tape,and is made of a flexible material having a compress-forming nature, and comprises storing dents,which are compress-formed from a surface to a fixed depth in a thickness direction.

Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts

Carrier band of electronic parts

The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.

Packing band, packing method and packing apparatus, of little parts, and

An automatic feeding system includes a tag attached to a body of a pet; and an automatic feeding apparatus for automatically feeding the pet. The tag includes a receiving device for receiving an electromagnetic wave from the automatic feeding apparatus; an information memory device storing information on the feeding of the pet and outputting the information in response to an output from the receiving device; and a sending device for sending the information which is output from the information memory device to the automatic feeding apparatus using an electric wave. The automatic feeding apparatus includes a receiving device for receiving the electric wave from the tag; an information reading device for reading the information on the feeding of the pet in response to an output from the receiving device of the automatic feeding apparatus; a feeding device for supplying feed based on the information; and a sending device for sending an instruction to read the information on the feeding of the pet to the tag using an electric wave.

Automatic feeding system having animal carried transmitter which

It is a object of this invention to provide a graphite cladding sheet having an excellent mechanical strength and applicable to wide use and a graphite device using said sheet. The graphite cladding sheet 10 comprises a flexible thin graphite sheet having a high orientation and a supporting sheet 12 fixedly laminated on one surface of the graphite film 11. If necessary, the graphite film may be sandwiched between the supporting sheet and the interlocking element by binding them with an adhesive filled in the hole which pass through the graphite film.

Graphite cladding laminate structural material and a graphite device

An information transfer system includes an IC card including a communicating section; a passage checking apparatus for checking passage through a gate using the IC card, without being in physical contact with the IC card; and a display device for displaying information of the IC card, wherein the passage checking apparatus includes a communicating section for transmitting passage check information required to check passage through the gate and additional information other than the passage check information to the IC card and for receiving the passage check information from the IC card, the IC card includes a memory for storing the additional information transmitted from the passage checking apparatus, and the display device includes a communication section for obtaining the additional information stored in the memory of the IC card.

Information transfer system

This invention provides a method of molding which can feed the high-viscosity material quickly and accurately as well as with good operability. For achieving quick heating and cooling cycles in a mold, the mold is constructed from a mold material having superior heat-conductivity in such a way that the high-viscosity material can be heated and cooled from outside of the mold. Thereby, this invention comprises:

Method of molding high-viscosity materials

An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the water, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. Such component is packed in a package including a carrier tape having therethrough a space for receiving the component with one end of such space open. A cover is applied to close the open end of the space after the component is inserted therein.

Method of packaging electronic chip component and method of bonding of

An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the wafer, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. A package for packing the component includes a carrier tape having therethrough a space for receiving the component with one end or side of the space opened, and a cover tape for closing the open end of the space after the component is stored in the space. A method for packing the component includes the steps of storing the component in the space of the carrier tape with one end of the space opened, and closing the open end of the space with the cover tape.

Electronic chip component with passivation film and organic protective

A wafer transporting/storing method includes steps of accommodating one wafer in each flat casing, and transporting/storing the casing. A wafer carrier includes a flat casing, one side surface of which is opened as a wafer entrance/exit, a cover for closing the wafer entrance/exit, and a cover urging device, disposed between the casing and the cover, for urging the cover in a closed direction. The flat casing has a space for accommodating one wafer. In the carrier, at both sides of intermediate portions of the upper and lower surfaces of the space are inclined in the directions from each intermediate portion toward both ends of each of the upper and lower surfaces so that an interval between the upper and lower surfaces of the space becomes narrower toward both ends of the space.

Method for transporting/storing a wafer in a wafer carrier

According to the present invention, chamber units are sequentially coupled with each other to thereby provide a volume of clean space, and whereby different environments can be maintained in the different chamber units. An air blowhole or door is provided at an opening section of each chamber unit. Moreover, a space section can be defined at the coupling part of the chamber units, and a suction pump and a suction hose can be provided in the space section, so as to prevent the environments of the different chambers from influencing one another.

Coupling-type clean space apparatus

A wafer transporting/storing method includes steps of accommodating one wafer in each flat casing, and transporting/storing the casing. A wafer carrier includes a flat casing, one side surface of which is opened as a wafer entrance/exit, a cover for closing the wafer entrance/exit, and a cover urging device, disposed between the casing and the cover, for urging the cover in a closed direction. The flat casing has a space for accommodating one wafer. In the carrier, at both sides of intermediate portions of the upper and lower surfaces of the space are end portions inclined in the directions from each intermediate portion toward both ends of each of the upper and lower surfaces so that an interval between the upper and lower surfaces of the space becomes narrower toward both ends of the space.

Method for transporting/storing wafer and wafer carrier

A thick film drawing apparatus includes a substrate holding member (50) for holding a substrate (a), moving coils (60) for holding the substrate holding member (50), a drawing head (20) having a nozzle (30) and a stylus (33) for emitting pastes for drawing on a surface of the substrate (a) moving thereon and pushing the substrate (a) downward, respectively, wherein in the drawing process the drawing head (20) is locked of up/down motions and the substrate holding member (50) is raised/lowered at substantially constant weaker force by the moving coils (60), and thereby a relative-moving response of the up/down directions of the nozzle (30) is improved and a contact force of the stylus (33) on the substrate (a) is kept under a predetermined constant value, therefore a thickness of thick film line (c) is kept uniform and circuit patterns are prevented from being flawed.

Thick film drawing apparatus

Growing community of inventors

Katano, Japan

Kazuhiro Mori