Nissan Motor Company Limited

Renesas Electronics Corporation

Nec Corporation

Nec Electronics Corporation

Kyodo Yushi Co., Ltd.

Sei Optifrontier Co., Ltd.

Kazuhiro Mitamura

Masaaki Yoshitome

Hideto Kanafusa

Kazuto Ueno

Satoru Majima

Takashi Haraoka

Yukihiro Sato

Koji Bando

Akira Muto

Hideyuki Yamada

Shigeru Moribayashi

Hajime Minagawa

Shinji Ooe

Tomoyuki Hirota

Tomoaki Watari

Hiroshi Sato

Keisuke Yamamoto

Isao Watanabe

Masaki Saito

Koichi Goto

Shuuichi Kariyazaki

Yoshinori Murakami

Junichi Shimizu

Akihiko Ikeda

Takamitsu Kanazawa

Kenji Sakai

Shinji Sato

Keita Tsuchiya

Hiroki Itakura

Hidenori Itoh

Takeshi Iwata

Fumiki Kato

Hidekazu Tanisawa

Yui Takahashi

Jun Ikeuchi

Toshiaki Ohrui

Hiroki Matsunae

Ryuta Yaginuma

Shunsuke Okamoto

Masahiko Takeda

Motoo Shimizu

Shigeki Asahi

Kuniyoshi Wakamatsu

Tomoya Baba

Akihiro Shijo

Hitoshi Yokomizo

Syunji Ueda

Toshinori Kawai

Masatoshi Hirofuji

Akihiro Ikeda

A wiring substrate includes: a first insulating layer; a ground plane formed on the first insulating layer; a second insulating layer formed on the first insulating layer such that the ground plane is covered with the second insulating layer; a first signal wiring formed on the second insulating layer; a third insulating layer formed on the second insulating layer such that the first signal wiring is covered with the third insulating layer; and a second signal wiring formed on the third insulating layer and electrically connected with the first signal wiring. The first signal wiring is arranged in a region overlapping with a portion of a heat radiating plate. The second signal wiring is not arranged in the region. The ground plane has an opening portion located at a position overlapping with the first signal wiring. The opening portion is formed so as to extend along the first signal wiring.

Semiconductor device including wiring substrate having multiple signal wirings and multiple insulating layers

A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.

Semiconductor device

Metal foil base material placed on lower blade is first restricted under pressure by lower blade and pad and then cut by a shearing action based on an engagement of lower blade side cutting edge and upper blade side cutting edge. Resin face sheets are fixed to the top surface of lower blade and the pressing surface of pad, the face sheets having a larger friction coefficient than that of these surfaces. By frictional forces imparted by face sheets, metal foil base material is prevented from being dragged and moved by the pressing force of the upper blade prior to cutting. Consequently, the occurrence of 'burr', 'roll-up', and so forth is eliminated thereby ensuring a good cutting quality.

Cutting device for metal foil

A workpiece cutting method basically includes providing a workpiece proximate to a first blade including a first cutting edge. The method further comprises moving a second blade including a second cutting edge in contact with the first blade such that the first and second cutting edges of the first and second blades cooperatively engage to cut the workpiece while maintaining the first and second cutting edges parallel to each other.

Workpiece cutting method

On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

Semiconductor device and manufacturing method thereof

For example, a semiconductor device has a lead connected to a second portion of a chip mounting part on which a semiconductor chip to be a heat source is mounted and a lead connected to a third portion of the chip mounting part on which the semiconductor chip to be the heat source is mounted. Further, each of the leads has a protruding portion protruding from a sealing member. In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device.

A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Photocoupler with protrusion

An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.

Optical module

An optical module includes a lens-containing optically-transmissive member and a receptacle. The receptacle includes: an optical connector-inserting section; a fixing section for fixing the member; and an device-installing section for installing a semiconductor device serving as a light emitting device or a light receiving device. The fixing section communicates with the device-installing section. The member includes a main body and a lens. The main body includes a first section and a second section, the first section having a first outer diameter, which is substantially equal to a internal diameter of said fixing section, and said second section having a second outer diameter, which is smaller than the first outer diameter, and at least containing an end of said main body in a side of the device-installing section.

Optical module and process for manufacturing the same

A preform having edges overlapped and jointed, two outer members for forming outer surfaces of a hydroformed product, and reinforcement members for forming reinforcement ribs that divide a hollow cross section of the hydroformed product, including a joint formed by, when more than three sheet materials for forming the outer members and the reinforcement members are overlapped together, welding a first sheet material on a surface of the overlapped sheet materials to a second sheet material positioned inside the first sheet material, and a space disposed and aligned with a joint plane between the second sheet material and a third sheet material located inside the second sheet material during the welding process.

Preform, hydroforming method, and hydroformed product

A preform with edges overlapped and jointed each other and first and second outer members for forming outer surfaces of a hydroformed product, and reinforcement members that are jointed to the first and second outer members to form reinforcement ribs that divide a hollow cross section of the outer surfaces, the reinforcement members having dimensions capable of suppressing elongation in a tensile direction due to a tensile force that develops during hydroforming.

An optical module with flexible substrate that improves high-frequency characteristics. A flexible substrateis formed with a top wiring layerand a bottom wiring layerformed on both surfaces of a polyimide layer, where the top wiring layerhas a plurality of wiring patternsthat electrically connect the leadsof the optical moduleto the drive circuit of a circuit board, and the bottom wiring layeris located on the entire surface of one side of the polyimide layerso that it is electrically insulated from the wiring patterns, is electrically connected to the ground of the circuit board, and is electrically connected to at least the leadsand, depending on its relationship with the wiring patterns, to the stemof the optical moduleat a specified position of a stub regionhaving stub structure.

Optical module with flexible substrate

Growing community of inventors

Kanagawa, Japan

Kazuhiro Mitamura