Kabushiki Kaisha Toyota Jidoshokki

Kabushiki Kaisha Toyoda Jidoshokki Seisakusho

Kazuhiro Maeno

Eiji Kono

Satoshi Ito

Takamasa Nodo

Kunikazu Sato

A solder includes zinc as a main component and the solder contains 6 to 8 mass percent of indium. A solder includes zinc as a main component, wherein the solder contains only indium. In a die-bonding structure in which a semiconductor chip is connected to a bonded member by a solder, the solder made of zinc as a main component and contains indium.

Solder and die-bonding structure

A main substrate is provided with a wiring pattern on its surface and in the inner layer. A wiring pattern for connecting the signal line or power line of the main substrate to an external circuit is formed on the flexible printed circuit. A connection terminal to which a corresponding wiring pattern is connected is formed at the tip of the flexible printed circuit. A through-hole is formed between the wiring patterns. Potting resin is potted in each through-hole and around it. When the resin hardens, the potting resin joints the main substrate and the flexible printed circuit.

Connection structure for connecting flexible printed circuit to main substrate using a potting resin in a through-hole

An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.

Electronic device

A surface mounting structure for a surface mounting electronic component includes an electronic component, a circuit board and a solder fillet. The electronic component has on a marginal portion thereof a plurality of electrodes, each of which is formed so as to cover at least an under surface, both side faces and an end face of the electronic component. The circuit board has a set of lands, on which the electrodes of the electronic component are joined by soldering. Each land corresponds to one of the electrodes and has a restricting portion, which restricts movement of the electronic component at the time of solder melting during surface mounting, and also has a protrusion on each side of the corresponding electrode. The solder fillet is formed at least on each protrusion so as to correspond to both side faces of the corresponding electrode.

Surface mounting structure for surface mounting an electronic component

A drain electrode wiring conductor through which a main current of a MOS transistor takes the form of a flat board, being inserted into a first side of the frame of a case, and extends along the first side. The source electrode wiring conductor also takes the form of a flat board, being inserted into the first side and a second side, and extends parallel to a drain electrode wiring conductor along the first side. The flow of the current in the drain electrode wiring conductor is opposite in direction to the flow of the current in the source electrode wiring conductor. With the configuration, the parasitic inductance of a semiconductor module including a plurality of MOS transistors can be reduced.

Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore

A board-shaped thermal conductor base board () is arranged on the bottom surface of a power module (). Substrates () and () are arranged on the top surface of the thermal conductor base board (), and semiconductor elements () and () are respectively arranged on the top surfaces of the substrates () and (). The semiconductor elements () are surrounded by a resinous case (). A source electrode () is attached above and apart from the semiconductor elements () by using the resinous case (). The connection between the source electrode () and the sources of the semiconductor elements () are connected by wire bonding.

Semiconductor device

A plurality of semiconductor elements are arranged on the top surface of a heat conductive base plate. A resin case is attached to the heat conductive base plate so as to encompass the plurality of semiconductor elements. A metal member including a bridge electrode is incorporated into the resin case. The bridge electrode is electrically connected to a corresponding semiconductor area through bonding wire. An external terminal is incorporated into the bridge electrode.

Lands formed on the top surface of substrate are covered by a printing screen having a printing pattern, in order to mount chip components on the substrate. A paste bonding agent is supplied to the lands through the printing pattern, and a layer of bonding agent is formed on the lands. In the printing method, a plurality of bonding agent layers that are mutually separated are formed on the land. The chip component is placed on the bonding agent layers of the land. As the chip component is pressed to the land, the bonding agent layers are smashed and spread on the land prior to applying heat to said bonding agent layers.

Growing community of inventors

Kariya, Japan

Kazuhiro Maeno