Tokyo Electron Limited

Kazuhiro Kawamura

Yuichi Takenaga

Takashi Yokota

Koichi Sakamoto

Youngchul Park

The present invention provides precise temperature estimation in a heat treatment apparatus that estimates temperatures of process objects by using a thermal model and performs a heat treatment while performing a temperature control based on the estimated temperatures. The heat treatment apparatus () includes a processing vessel () accommodating plural wafers W, plural heaters (to) and plural temperature sensors (Sto S), and stores the thermal model. The heat treatment apparatus 1 estimates temperatures of the wafers W based on outputs of the temperature sensors (Sto S) by using the thermal model and controls the heaters (to) based on the estimated temperatures, applying a heat treatment to the wafers W. The thermal model for an individual apparatus is made by calibrating a standard thermal model designed for a standard apparatus. The standard model calibration is performed by heating an interior of the processing vessel (), measuring the temperatures of the wafers W in the processing vessel (), estimating the temperatures of the wafers W by using the thermal model, comparing the measured temperature and the estimated temperature, and calibrating the standard thermal model so that the measured temperature substantially coincides with the estimated temperature.

Heat treatment apparatus and method of calibrating the apparatus

A thermal processing method selects a batch size range including the number of workpieces to be processed from a plurality of batch size ranges including batch size ranges in which reference numbers smaller than the holding capacity of a workpiece holder are maximums. The workpieces are distributed in the workpiece holder on the basis of the workpiece distribution pattern determined corresponding to the specified batch size range. Processing conditions of the thermal process are determined according to the workpiece distribution pattern. A thermal processing apparatus comprises a controller capable of carrying out the thermal processing method.

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Tokyo-to, Japan

Kazuhiro Kawamura