Panasonic Intellectual Property Management Co., Ltd.

Kazuhiro Kanda

Masahiko Ohbayashi

Yuki Ohyama

Masataka Tagawa

Hideyuki Tanigawa

Hiroshi Saito

Takashi Morino

Takahiko Izawa

A magnetic sensor according to the present disclosure includes a plurality of magnetoresistance pattern portions that forms a bridge circuit. Each of the plurality of magnetoresistance pattern portions includes a first resistance portion and a second resistance portion that are connected together in series. In each of the plurality of magnetoresistance pattern portions, the first resistance portion and the second resistance portion are spaced from each other in a first direction by a distance that is one half as long as a cycle of magnetization of a detection target. In each of the plurality of magnetoresistance pattern portions, the first resistance portion and the second resistance portion are symmetric to each other with respect to a line when viewed in plan in a third direction.

Magnetic sensor

In a magnetic sensor according to the present disclosure, each of a plurality of magnetoresistance pattern portions includes a first resistance portion and a second resistance portion that are connected together in series. One of two resistance portions connects a first wiring portion and a second wiring portion of a first wiring pattern portion. The other of the two resistance portions connects a first wiring portion and a second wiring portion of a second wiring pattern portion. The two resistance portions are included in the plurality of first resistance portions and the plurality of second resistance portions and located at both ends in a first direction.

The chip resistor according to the present disclosure includes insulating substrate, a pair of upper face electrodes provided on both ends of one face of insulating substrate, and resistor provided on the one face of insulating substrate and connected between the pair of upper face electrodes. The chip resistor includes a pair of end-face electrodes provided on both end faces of insulating substrate to be electrically connected to the pair of upper face electrodes, and plating layer formed on portions of the pair of upper face electrodes and faces of the pair of end-face electrodes. Insulating film formed of a resin is provided on another face opposite to the one face of insulating substrate. Insulating film has a thickness of more than or equal to 30 &#x3bc;m.

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Fukui, Japan

Kazuhiro Kanda