Kabushiki Kaisha Toshiba

Drug Delivery System Institute, Ltd.

Daiichi Pharmaceutical Co., Ltd.

Toshiba Electronic Devices & Storage Corporation

Daiichi Seiyaku Co., Ltd.

Other

Daiichi Sankyo Company, Limited

Samsung Electronics Co., Ltd.

Kazuhiro Inoue

Teruo Takeuchi

Satoshi Shimizu

Kazuhisa Iwashita

Tatsuo Tonedachi

Takafumi Ohishi

Makoto Higaki

Satoshi Okuno

Hiroshi Susaki

Masahiro Ikeda

Hiroaki Oshio

Katsutoshi Aono

Toshiro Yano

Takayuki Kawaguchi

Akihiro Tsujimura

Tetsuro Komatsu

Shuichi Sekine

Gen Watari

Yukako Tsutsumi

Mami Yamamoto

Hiroyuki Kayano

Shuichi Obayashi

Yuzo Hirayama

Keiichi Yamaguchi

Takuji Suzuki

Tetsu Shijo

Tatsuma Hirano

Haruhiko Okazaki

Akiko Yamada

Noritaka Deguchi

Keiji Takaoka

Masaki Tohyama

Noriko G Tanaka

Takashi Arakawa

Yasushi Murakami

Motoyasu Morinaga

Naoko Ono

Yasuhiro Kanekiyo

Takahiro Sekiguchi

Yuji Iseki

Kanako Nakayama

Yoshio Noguchi

Hiroshi Kuga

Teruomi Ito

Hidenori Egoshi

Iwao Matsumoto

Naoya Ushiyama

Hidemasa Ogawa

Koichi Mori

Kazuki Kataoka

Eiji Kumazawa

Yoshinobu Shiose

Akiko Togo

Hiroshi Korenaga

Noriaki Odachi

Mami Fujihara

Toshihiro Kuroki

Kazuhiro Tamura

Masahiro Ogushi

Masahisa Funemizu

Shigeru Noda

Makoto Ohashi

Keiji Yamamoto

Takeshi Biwa

Michiko Kumon

Makoto Miyajima

Hitoshi Ishizuka

Masahiro Kajiki

Hiroshi Hamana

Hideo Nogusa

Shuichi Sugawara

Nobukazu Kashima

Shizuo Kadoya

Morihiro Kohno

Yuki Akamatsu

Teruo Takeguchi

Toshihiro Komeya

Hiroyuki Nakashima

Hirotatsu Shibata

Shu-ichi Sekine

Takayoshi Itoh

Katsuyasu Ishida

A semiconductor device includes a substrate, a light-receiving element, a switching element, a light-emitting element on the switching element, first and second conductive members. The substrate includes first to third metal pads on a front-side thereof. The light-receiving element includes first and second bonding pads on a front-surface thereof. A back-surface of the light-receiving element is connected to the first and second metal pads. The first and second bonding pads each overlap one of the first and second metal pads. The switching element includes front-side and backside electrodes and a control pad. The backside electrode is connected to the third metal pad. The first conductive member is connected to the front-side electrode of the switching element and the first bonding pad of the light-receiving element. The second conductive member is connected to the control pad of the switching element and the second bonding pad of the light-receiving element.

Semiconductor device

According to one embodiment, a detection apparatus includes a pair of conductors configured to detect an electromagnetic wave occurring due to a discharge phenomenon in a target apparatus, wherein the pair of conductors are arranged in a near field region of the target apparatus in which the electromagnetic wave occurs.

Detection apparatus and detection method

Provided is a semiconductor device according to an embodiment including a first electrode terminal containing copper, a second electrode terminal containing copper, a semiconductor chip provide the first electrode terminal and provided inside the first electrode terminal, a metal member provided on the semiconductor chip, protruding to an outside of the semiconductor chip in at least two directions, electrically connected to the second electrode terminal, and containing copper, and a mold resin surrounding the semiconductor chip.

An antenna device includes a finite ground plane that includes a linear side, a first conductor plate that faces the finite ground plane and includes a side corresponding to the side of the finite ground plane and having a length of substantially a &#x215b; wavelength or less, and a conductor line that includes one end connected to the side of the first conductor plate and the other end short-circuited to one end portion of the side of the finite ground plane. The antenna device further includes a second conductor plate that faces the finite ground plane, includes a side corresponding to the side of the finite ground plane and having a length of substantially a &#x215b; wavelength or less, and is arranged to be adjacent to the first conductor plate to perform capacitive coupling with the first conductor plate and a feed line that includes one end connected to the side of the second conductor plate and the other end connected to the other end portion of the side of the finite ground plane.

Antenna device, method of manufacturing antenna device, and wireless device

A wireless communication system includes a first tag installed on a ground outside a track for a running train, the first tag being driven by wirelessly received power, a second tag installed outside a side face of the train and above the first tag, the side face extending in a running direction, the second tag being driven by wirelessly received power, a wireless communicator which is installed in the train and performs wireless communication with the first tag and the second tag, and an antenna which is installed in the train and has a gain in directions of the first tag and the second tag.

Wireless communication system and wireless communication apparatus

A communication device includes a ground unit, a dielectric plate, a communication circuit, a conductor, and a capacitance element. The ground unit has a reference potential applied to the ground unit. The dielectric plate is provided on the ground unit. The communication circuit is provided on the dielectric plate and performs a transmission and a reception of a signal. The conductor is connected to the communication circuit. An end of the capacitance element is connected to the conductor. An another end of the capacitance element is connected to the ground unit. A capacitance of the capacitance element is smaller than a capacitance formed between the conductor and the ground unit. The capacitance of the capacitance element is bigger than a capacitance formed between the conductor and the ground unit being caused by a human body touching or approximating to the conductor.

Communication device and biological signal monitoring device

A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.

Semiconductor light-emitting device and method for producing the same

According to an embodiment, a communication apparatus includes a substrate, a first communication unit, a first signal line, a first terminal, a second signal line, a variable capacitance portion, and an inductor portion. The substrate is provided with a reference potential electrode. The first communication unit transmits and receives. One end of the first signal line is connected to the first communication unit. The first terminal is connected to the other end of the first signal line. The second signal line is connected to the first signal line through the first terminal. One end of the variable capacitance portion is connected to the other end of the second signal line. One end of the inductor portion is connected to the other end of the variable capacitance portion. The communication apparatus executes communication through a living body.

Communication apparatus

According to one embodiment, a communication apparatus includes a substrate, a communication circuit, a first signal line, an insulator, and a first conductor. The substrate includes a ground. The communication circuit is provided on the substrate. The first signal line is connected to the communication circuit and is electrically connected to the outer surface of the first conductor. The insulator surrounds the substrate. The first conductor surrounds the insulator.

There is provided a dry powder pharmaceutical composition for inhalation useful for preventing and/or treating influenza virus infections contains as a medicinal component a compound represented by formula (I): and optionally a compound represented by formula (II): a pharmacologically acceptable salt thereof, or a hydrate thereof.

Dry powder pharmaceutical composition for inhalation

According to an embodiment, a communication apparatus communicates through a living body. One end of a first signal line is connected to the communication unit. A terminal is connected to the other end of the first signal line. One end of a second signal line is connected to the terminal. The second signal line is connected to the first signal line through the terminal. A first signal electrode is connected to the other end of the second signal line. One end of a third signal line is connected to the terminal. The third signal line is connected to the first signal line through the terminal. One end of a magnetic field sensor is connected to the other end of the third signal line. The other end of the magnetic field sensor is connected to a reference potential electrode.

According to an embodiment, a first communication equipment includes a first communication unit configured to transmit and receive a signal, and a first conductor electrically connected to the first communication unit. A second communication equipment includes a second conductor, a third conductor located in parallel with the second conductor and set to first reference potential, a fourth conductor separated from the second conductor and located substantially orthogonal to the second conductor, a fifth conductor located in parallel with the fourth conductor and set to the first reference potential, a first detection unit configured to detect a first differential output between signal outputs respectively observed by the second conductor and the fourth conductor, and a second communication unit configured to receive the first differential output and transmit and receives a signal.

Living body communication apparatus

According to one embodiment, the signal electrode is disposed on the first principal surface side of the substrate and is connected to the other end of the second signal line. The housing covers and accommodates therein the substrate, the communication unit, the first signal line, the terminal, the second signal line, and the signal electrode. The conductive material is arranged on an outer side of the housing so as to be opposite to the signal electrode, and includes an outer peripheral portion extended outward beyond an outer periphery of the signal electrode. The communication apparatus carries out data communication via a living body.

According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.

LED module

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.

LED package and method for manufacturing same

Growing community of inventors

Tokyo, Japan

Kazuhiro Inoue