Murata Manufacturing Co., Ltd.

Kazuhiro Iida

Norio Sakai

Koji Tanaka

Mitsuhiro Matsumoto

Yoshirou Satou

Masamichi Tamura

Harufumi Mandai

Yoshikazu Chigodo

Takehiko Morikawa

A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.

Manufacturing method for multilayer ceramic elements

A high-frequency superposing module for driving a laser diode includes an oscillating circuit and an impedance matching circuit. The impedance matching circuit includes a capacitor connected in series between the emitter of a transistor and the terminal through which a laser-diode drive signal is output; and a capacitor connected in parallel between the drive-signal output terminal and the ground. The oscillating circuit includes an inductor serving as a choke coil connected between the drive-signal output terminal and the collector of the transistor, thus allowing the drive-signal output terminal to serve as a power input terminal for the oscillating circuit.

High-frequency superposing module for driving laser diode

An oscillator includes a transistor, a first bias resistor connected between the base of the transistor and a power input terminal, and a second bias resistor connected between the base of the transistor and a control-voltage input terminal. When the control-voltage input terminal is grounded, the bias voltage at the base of the transistor is below a predetermined threshold, thus causing the oscillator to stop oscillation. When the control-voltage input terminal is open, the bias voltage at the base of the transistor is above the threshold, thus causing the oscillator to start oscillation.

Oscillator and high-frequency superposing module for driving laser diode

A small-sized superimposed circuit module has reduced spurious electromagnetic wave emission and small variations in circuit parameters. A resonance circuit portion of an oscillator and a portion of a noise rejection filter are embedded in a multilayer ceramic substrate, and the remaining circuit components are mounted on the surface of the multilayer substrate. The upper surface of the multilayer substrate is covered with a metal case.

Superimposing circuit module for reducing spurious electromagnetic wave emissions and small variations in circuit parameters

A method for manufacturing an electronic component includes forming an aggregate electronic component including a plurality of electronic components and dividing the aggregate electronic component to separate the plurality of electronic components to form individual electronic components. Through-holes are formed in a laminated body providing an aggregate electronic component wherein via-hole conductors are arranged so as not pass through the aggregate electronic component in a thickness direction thereof, the via-hole conductors are divided by the through-holes, and each divided portion provides an external terminal electrode. Then, by dividing the laminated body along the dividing lines passing through the through-holes, a plurality of individual electronic components are produced.

Method for making a mounting structure for an electronic component having an external terminal electrode

A phase shifter includes a comb-line defined by first and second transmission lines that are electromagnetically coupled with each other and a plurality of variable-capacitance diodes connected to the first and second transmission lines defining the comb-line. In the phase shifter, one end of the first transmission line is connected to an input terminal, one end of the second transmission line is connected to an output terminal, and the variable-capacitance diodes are connected between the other ends of the first and second transmission lines and the corresponding grounds.

Phase shifter and communication device using the same

Multilayer integrated substrate and manufacturing method for multilayer ceramic element

Mounting structure for an electronic component having an external terminal electrode

A high-frequency switch 20 includes a first diode 24. An anode of the first diode 24 is connected to a transmitting circuit TX via a capacitor 22, and is grounded via a first strip line 26 and a capacitor 28. A first control terminal 30 is connected to a connecting point of the first strip line 26 and the capacitor 28, and a control circuit for switching the high-frequency switch is connected to the first control terminal 30. A cathode of the first diode 24 is connected to an antenna ANT via a capacitor 32. One end of a second strip line 40 is connected to the antenna ANT via the capacitor 32. The end of the second strip line 40 is grounded via a capacitor 42. The other end of the second strip line 40 is connected to a receiving circuit RX via a capacitor 44, and is grounded via a second diode 46 and a capacitor 48.

High-frequency switch

A plurality of capacitor elements defined by first and second capacitor electrodes are formed in the interior of a laminated ceramic block, while a plurality of first terminal electrodes to be electrically connected to the first capacitor electrodes and a ground terminal electrode to be connected to the second capacitor electrodes in common are formed on one side surface of the block. A plurality of resistor films are formed on a major surface of the block, to be connected to the first terminal electrodes. A plurality of second terminal electrodes are formed on another side surface of the block, to be electrically connected to the resistor films. Another ground terminal electrode is formed on this side surface, to be connected to the second capacitor electrodes in common. Thus, an RC array being applicable to a high frequency filter array is integrated and miniaturized to cope with high density packaging, as well as to enable surface mounting.

Growing community of inventors

Shiga-ken, Japan

Kazuhiro Iida