Ngk Spark Plug Company, Limited

Kazuhiro Hayashi

Motohiko Sato

Manabu Sato

Jun Otsuka

Kenji Murakami

Motonobu Kurahashi

Akifumi Tosa

Yusuke Kaieda

Hiroshi Yamamoto

Shinji Yuri

Masaki Muramatsu

Toshitake Seki

Tomohide Yamada

Eiji Ozeki

Masayuki Watanabe

Tatsuo Iwata

Kanji Oya

Junichi Ito

A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.

Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate

A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

A capacitor comprising: a plurality of laminated dielectric layers; a plurality of inner electrode layers each disposed between mutually adjacent ones of the dielectric layers; and dummy electrode layers respectively disposed between the dielectric layers, disposed on sides closer to outer peripheral sides of the dielectric layers than to the inner electrode layers and disposed apart from the inner electrode layers.

Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board

An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted and a second surface at which the capacitor main body is mounted on the substrate and a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces and connected to the surface-connecting terminals and the surface-connecting pads.

Assembly of semiconductor device, interposer and substrate

A multilayer ceramic capacitor () having reduced inductance which is separated into a first layer body () and a second layer body (). The first layer body () and the second layer body () are formed by alternately layering inner electrodes (inner electrode, inner electrode) so as to face each other and sandwich ceramic layers (). The ceramic layers () of the second layer body () are thicker than the ceramic layers () of the first layer body (), so as to compensate for electrode height difference. Moreover, in the second layer body (), the inner electrodes () are electrically connected by via electrode () so that the part of the via electrode () extending without connection to an inner electrode () is shortened.

Capacitor and method for manufacturing the same

A laminated ceramic capacitor () divided into a first laminate (), a second laminate (), a third laminate (), and a fourth laminate (). The first laminate () includes a ceramic layer () serving as a dielectric layer. The ceramic layer () is thicker than a ceramic layer () sandwiched between internal electrodes () in the second laminate () or the fourth laminate (), and thinner than 20 times the thickness of the ceramic layer (). The third laminate () includes dielectric layers, which serve as the ceramic layers (), and has a thickness of 5% of the total thickness of the second laminate () and the fourth laminate (). Accordingly, the third laminate () achieves the function of absorbing an electrode-induced thickness differential. Also, by means of regulating the thickness of the first laminate (), portions of via electrodes () that extend without being electrically connected to the internal electrodes () can be shortened.

A laminated ceramic capacitordivided into a first laminatea second laminatea third laminateand a fourth laminateThe first laminateincludes a ceramic layerserving as a dielectric layer. The ceramic layeris thicker than a ceramic layersandwiched between internal electrodesin the second laminateor the fourth laminateand thinner than 20 times the thickness of the ceramic layerThe third laminateincludes dielectric layers, which serve as the ceramic layersand has a thickness of 5% of the total thickness of the second laminateand the fourth laminateAccordingly, the third laminateachieves the function of absorbing an electrode-induced thickness differential. Also, by means of regulating the thickness of the first laminateportions of via electrodesthat extend without being electrically connected to the internal electrodescan be shortened.

A multilayer type piezoelectric filter is provided which includes at least two chambers for receiving therewithin resonators, respectively. The chambers are partly defined by a top printed circuit board and an intermediate printed circuit board. The top printed circuit board and the intermediate printed circuit board are formed with communication holes for communicating the chambers with the outside.

Multilayer piezoelectric filter with an air vent between two resonator chambers

A multielement-type piezoelectric filter capable of facilitating assembly and having a reduced size. The base substrate carries a conduction circuit. An input terminal portion, an output terminal portion and a ground terminal portion are formed on a bottom surface of the base substrate and connected to corresponding connection end portions of the conduction circuit. Furthermore, series resonators and parallel resonators are arranged side by side on the base substrate. The lower electrodes of the resonators are connected to the corresponding connection end portions of the conduction circuit via through-holes. In one embodiment, conductive sheets are attached onto exposed upper electrodes of some of the resonators so as to establish a required connection between the upper electrodes. In another embodiment, a common path layer is formed on the upper surface of the base substrate. The upper electrodes of some of the resonators are connected to the common path layer via bonding wires. A cap is attached to the base substrate which covers the resonators.

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Komaki, Japan

Kazuhiro Hayashi