Kosaku & Co., Ltd.

Kazuhiro Fukuoka

Haruo Konishi

Isao Miyatake

Keiki Kiyohara

Masaji Hamamoto

Saburo Yonekura

Tadayuki Konishi

An electroless plating bath composition is produced by mixing stannous oxide, at least one member selected from the group consisting of lead oxide and lead perchlorate, perchloric acid, and thiourea. The composition thus obtained is ideal for electroless plating of a substrate of copper, particularly a substrate provided with a resist film.

Electroless plating bath composition and method for production thereof

An electroless Pb-Sn alloy plating bath composition is obtained by mixing at least one of methane sulfonic acid, 1-hydroxyethane-1, 1-diphosphoric acid and a salt of 1-hydroxyethane-1, 1-diposphoric acid, compounds for forming Pb-Sn alloy and a reducing agent.

Electroless Pb-Sn alloy plating bath composition

An electroplating bath for the formation of a tin-cobalt, tin-nickel, or tin-lead binary alloy coating is produced by mixing (a) as alloy coating-forming agent a tin salt and one member selected from the group consisting of a cobalt salt, a nickel salt, and a lead salt, (b) 1-hydroxyethane-1,1-diphosphoric acid and/or a salt thereof, (c) methanesulfonic acid and/or an alkali salt thereof, and (d) an electroconductive salt. A coating formed by electroplating using the bath is stable and excellent in gloss.

Growing community of inventors

Matsudo, Japan

Kazuhiro Fukuoka