Shin-Etsu Chemical Co., Ltd.

Other

Kazuhiro Arai

Toshio Shiobara

Kazutoshi Tomiyoshi

Koji Futatsumori

Hideto Kato

Satoshi Asai

Shigeki Ino

Takayuki Aoki

Hidenori Mizushima

Yasuo Kimura

Tadaharu Ikeda

Takaaki Shimizu

Hisashi Shimizu

Kazumi Noda

Toshihiko Fujii

Eiichi Asano

Miyuki Wakao

Nobuhiro Ichiroku

Masatoshi Takita

Koji Tsuchiya

Hironori Sakamoto

Koki Oitori

Masato Kanari

Yuji Kishigami

Kazuo Dobashi

A novel organosiloxane polymer is obtained by addition reaction of an organohydrogenpolysiloxane, an alkenyl-containing organopolysiloxane and an unsaturated compound of formula (3) or (4). Using the organosiloxane polymer, a photo-curable resin composition is prepared which can be exposed to radiation having a wide range of wavelength and developed to form a pattern. 

Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film

An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or imidazole compound as a cure accelerator cures into an elastomeric product having a low elasticity, toughness and low dielectric properties.

Epoxy resin compositions

A photo-curable resin composition comprising (A) an organosiloxane-bearing polymer comprising recurring units of formula (1):wherein Rto Rare monovalent C-Chydrocarbon, n is an integer of 1-1,000, and X isand having a Mw of 500-200,000, (B) a formalin-modified or formalin-alcohol-modified amino condensate, a phenol compound having on the average at least two methylol or alkoxymethylol radicals, or an epoxy compound having on the average at least two epoxy radicals, (C) a photoacid generator, and (D) a silicon compound of the formula: (R)Si(OR)wherein Ris monovalent C-Chydrocarbon, Ris C-Calkyl, m is 0-2, forms cured pattern films having dry etch resistance and improved adhesion to substrates.

Photo-curable resin composition, patterning process, and substrate protecting film

In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Epoxy resin compositions and premolded semiconductor packages

An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

Semiconductor encapsulating epoxy resin composition and semiconductor device

An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30&deg; C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.

Epoxy resin composition and semiconductor device

Epoxy resin compositions comprising (A) a crystalline epoxy resin, (B) a polyfunctional phenolic resin, (C) an organic phosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) at least 88 wt % based on the composition of an inorganic filler are smoothly flowing, fast curing and shelf stable. Due to minimized package warp, minimized wire flow, improved adhesion, and low water absorption, the compositions enable highly reliable encapsulation of semiconductor devices, especially BGA.

Semiconductor encapsulating epoxy resin compositions, and semiconductor devices

Epoxy resin compositions comprising (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin curing agent, (C) an organophosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler have excellent flow properties, shelf stability and curing speed and are thus suitable for semiconductor encapsulation, especially BGA encapsulation. Semiconductor devices encapsulated with the epoxy resin compositions are highly reliable.

Semiconductor encapsulating epoxy resin compositions, and semiconductor

When a semiconductor chip is mounted on a circuit substrate, the space therebetween can be briefly sealed with a resin encapsulant by transfer molding an encapsulating resin composition in molten state and under pressure into the space and heat curing the composition thereat. The composition contains (a) an epoxy resin, (b) a curing agent, and (c) an inorganic filler having a maximum particle size of up to 24 .mu.m and has a melt viscosity of up to 200 poises at the molding temperature. Then encapsulation can be completed within a very short cycle without allowing the filler to settle. Semiconductor devices are manufactured to high reliability.

Method of fabricating a flip chip mold injected package

An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1.times.10.sup.-4 cm.sup.2 /hr. at a thickness of 3 mm under humid conditions at 85.degree. C. and RH 85%, wherein 1-50% by weight of an inorganic water absorbing agent such as molecular sieve, silica gel and porous silica is added to the epoxy resin composition. The composition offers cured products having fully low moisture permeability and is thus suitable as a pre-molded hollow package-forming material.

Naphthalene and or biphenyl skeleton containing epoxy resin composition

A epoxy resin composition comprising (A) an epoxy resin bearing at least one monovalent hydrocarbon group on a benzene ring, (B) a phenolic resin, (C) an inorganic filler, and (D) 2-phenyl-4,5-dihydroxymethylimidazole as a curing accelerator has a low melt viscosity, a long gel time and a high curing rate, and provides cured products having improved properties. Semiconductor devices encapsulated with cured products of the inventive composition are reliable.

Semiconductor encapsulating epoxy resin compositions with

A novel quaternary phosphorus compound is a salt between tetraphenyl borate and a phosphonium having an aromatic group attached to a phosphorus atom through an oxygen atom. It is blended with an epoxy resin as a curing catalyst to form an epoxy resin composition which flows smoothly and quickly cures into a product having improved moisture resistance and adhesion.

Quaternary phosphorus compounds and their preparation

Novel fluorine-modified acid anhydrides of formula (1) are useful curing agents typically in epoxy resin compositions for encapsulating semiconductor devices. ##STR1## R.sup.1 is a hydrogen atom, substituted or unsubstituted monovalent hydrocarbon group, hydroxyl group, alkoxy group or alkenyloxy group. Rf is a divalent perfluoroalkylene or perfluoropolyether group of the general formula (2): ##STR2## wherein l is an integer of 0 to 8, k and m are integers of 0 to 15, j and n are 0 or 1, with the proviso that j, k, l, m and n are not equal to 0 at the same time.

Fluorine - modified acid anhydrides

In a light transmissive epoxy resin composition comprising (A) an epoxy resin and (B) a curing agent are blended (C) an organic phosphorus anti-discoloring agent and (D) silica-titania glass beads surface treated with an organic silicon compound. The composition restrains coloring in composition form and discoloration in cured form while curing into clear low stressed products having high light transmittance. Optical semiconductor devices encapsulated with the cured epoxy resin composition are reliable.

Growing community of inventors

Gunma-ken, Japan

Kazuhiro Arai