Stanley Electric Co., Ltd

Stanley Electric Corporation

Kazuhiko Ueno

Kosaburo Ito

Toshihiro Seko

Yoshihiro Ogawa

Naoto Suzuki

Takashi Ebisutani

Soji Owada

Nobuyuki Kobayashi

Mitsunori Harada

Takaaki Sakai

Hiroshi Kotani

Kenichi Saito

Takeshi Waragaya

Kaori Tachibana

Takahiro Saida

Yasushi Tanida

Masao Aoyama

Kaneo Mouri

Sumihisa Furufuji

Dianqi Song

A light-emitting unit includes a light source and a lens body disposed in front of the light source, and the lens body includes a projection lens part configured to project a graphic pattern toward a road surface by light emission of the light source, and a light emission lens part configured to cause surrounding of the projection lens part emit light by light emitted from the light source.

Light-emitting unit and vehicular lamp

A light-emitting device module can include a plurality of light-emitting devices arranged in line so as to form a luminance distribution for preventing horizontal stripes from being generated in a light distribution pattern. The light-emitting device can include a rectangular light-transmitting substrate, an underlayer semiconductor layer formed on the rectangular light-transmitting substrate, a plurality of first electrodes formed on the underlayer semiconductor layer in an island shape, a light-emitting semiconductor layer including a light-emitting layer formed on the underlayer semiconductor layer, the light-emitting semiconductor layer configured to surround and separate the respective first electrodes, and a second electrode formed on the light-emitting semiconductor layer. The first electrodes can be arranged to form a plurality of electrode rows parallel with one side of the rectangular light-transmitting substrate.

Light-emitting device, light-emitting device module, and vehicle lighting unit

A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

Semiconductor light-emitting device for producing wavelength-converted light and method for manufacturing the same

There is provided a method for producing a light emitting device having a small light emitting area and showing high light extraction efficiency. An uncured resin' is dropped on either one or both of a light emitting elementand a tabular memberin such an amount that the resin is maintained on them by surface tension, the light emitting elementand the tabular memberare piled up with the uncured resin&#x2032; maintained between them and on a side of the light emitting element by surface tension of the uncured resin&#x2032; to form an uncured resin layer&#x2032; having an inclined side, and then the resin layeris cured. The tabular member is constituted with a material having an alkali metal oxide content of 0.2% by weight or lower.

Light-emitting device having fluorescent substance particles and spacer particles, and method for manufacturing the same

An LED can include a pair of electrode members, and an LED chip joined to a chip mount portion disposed at the extremity of one of the pair of electrode members. The LED chip can be electrically connected to the pair of electrode members. A transparent resin portion can include a wavelength conversion material mixed therein, the transparent resin portion formed in such a manner as to surround the LED chip, wherein the LED chip is positioned offset toward one side in the transparent resin portion, and wherein the wavelength conversion material mixed in the transparent resin portion has a higher density around the LED chip within the transparent resin portion.

LED and method of manufacturing the same

A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer in order to emit various colored lights including white light. The device can include a board, a frame located on the board, at least one light-emitting chip mounted on the board, the wavelength converting layer located between an optical plate and an outside surface of the chips so that a density of a peripheral region is lower than that of a middle region, and a reflective material layer disposed at least between the frame and a side surface of the wavelength-converting layer. The device can have the reflective material layer form each reflector and can use a wavelength converting layer having different densities, and therefore can emit a wavelength-converted light having a high light-emitting efficiency and a uniform color tone from various small light-emitting surfaces.

Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing

A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, a transparent material layer located between the wavelength converting layer and a side surface of the chip so as to extend toward the wavelength converting layer, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the reflective material layer as a reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

Semiconductor light emitting device having a reflective material with a side slant surface and method of manufacturing

The disclosed subject matter includes light sources that have high use efficiency and a favorable bright distribution, and includes vehicle lamps that have both a favorable light distribution pattern and a capability of being simply composed by using the LED light sources. The light source can include a base board, at least one die bonding pad and wire bonding pad on the base board, at least one LED chip mounted on the die bonding pad and connected to respective bonding pads, and an encapsulating resin over the LED chip. The at least one LED chip can emit a uniform light with a distribution electrode on a top surface thereof and can form a favorable light distribution using a shield electrode on the top surface. The vehicle lamp can include the light source and an optical lens selected according to a kind and/or design of a vehicle lamp.

Light source and vehicle lamp

A semiconductor light emitting apparatus for emitting a desired colored light by coating the top surface thereof with a wavelength conversion member prevents the color unevenness from occurring due to the unevenness of the coating thickness of the wavelength conversion member. The semiconductor light emitting apparatus can include a semiconductor layer having a light emitting layer with a light emitting surface having at least one corner area, a supporting substrate configured to support the semiconductor layer, and a wavelength conversion material layer formed on top of the semiconductor layer, the wavelength conversion layer having a thickness thinner from a center portion of the semiconductor layer to an outer peripheral portion. The at least one corner area can include a non-emitting portion where light cannot be projected. The non-emitting portion can be a light shielding portion, a non-light emission portion or a current confined portion.

Semiconductor light emitting apparatus having a non-light emitting corner area

In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, and at least one conductive leaf spring adapted to fix the optical semiconductor device to the mounting substrate and supply power to the optical semiconductor device, the leaf spring is formed by a plurality of rectangularly-shaped terminals, and natural frequencies of at least two of the rectangularly-shaped terminals are different from each other.

Optical semiconductor device module having leaf springs with different rectangularly-shaped terminals

A white LED light source device and an LED backlight using the white LED light source can produce, among other features, white light with sufficient luminous intensity, uniform color tone, and high luminous utilization efficiency. A light path for producing white light with favorable color mixture can be shortened. The white LED light source device can be configured to include a bluish green LED lamp which can emit bluish green light by the combination of a blue LED device and a green phosphor material and a purple LED lamp which can emit purple light by the combination of a blue LED device and a red phosphor material. The bluish green light from the bluish green LED lamp and the purple light from the purple LED lamp are subjected to additive color mixture to produce white light with a spectrum containing three primary color wavelength components.

White LED light source device and LED backlight using the same

An LED and a surface mounting LED substrate for use in production of multi-faced surface mounting LEDs can include a resist layer on a conductor pattern that runs from an LED chip-mounted upper surface along a side portion and to a lower surface of the LED substrate. The resist layer is formed at least at a portion that is folded and runs along the lower surface and across a cutting line for separating/dividing at least the multi-faced surface mounting LEDs into discrete surface mounting LEDs. The resist layer is configured to suppress a burr that sometimes develops at a section of the conductor pattern during cutting/dicing of the multi-faced surface mounting LED substrate.

Surface mounting LED substrate and LED

A semiconductor light emitting device and method of manufacturing the same can provide a light source that has less variation in color and brightness and can reduce radiation of light that is possibly harmful to humans. The device can include a casing that has a first cavity having an oblique surface with a reflective surface formed thereon and a second cavity having an almost vertical side. A reflective frame having an oblique surface with a third reflective surface formed thereon can be formed on the casing. A semiconductor light emitting element can be mounted on the bottom in the first cavity. A first resin composed of a light-transmissive resin can be filled in the first cavity and then cured. Further, a second resin containing a fluorescent material dispersed in a light-transmissive resin can be filled in the second cavity and then cured while the casing is turned upside down to form a high-density fluorescent material layer near the surface of the second resin.

Semiconductor light emitting device having first and second resins

A surface mount electronic device manufacturing method can produce surface mount devices at a high yield rate and high productivity by reducing warp of a circuit board. The reduced warp avoids problems in processes for dicing the circuit board. Surface mount LED devices made in accordance with the method can have high reliability and reduced non-uniformity in color tone. The method can include providing an adhesive sheet having window holes at predetermined intervals. The adhesive sheet can be adhered to the circuit board. An attachable board having window holes provided at corresponding positions to the window holes of the adhesive sheet can be adhered to the adhesive sheet. LED chips or other semiconductor devices, laser diodes, etc., can be mounted on the circuit board and located at positions corresponding to bottoms of the window holes. A thermosetting resin can be filled in the window holes for encapsulating the LED chips, etc. The surface mount devices can then be produced by dicing the circuit board.

Growing community of inventors

Tokyo, Japan

Kazuhiko Ueno