National Institute of Advanced Industrial Science and Technology

Pi R&d Co., Ltd.

Kiyota Manufacturing Co.

Shinwa Corp. Ltd.

Kazuhiko Tokoro

Masahiro Aoyagi

Hiroshi Nakagawa

Katsuya Kikuchi

Yoshikuni Okada

Hiroshi Itatani

Sigemasa Segawa

Shigeo Kiyota

Kenichi Kobayashi

Hiroyuki Fujita

H Nakagawa

An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.

Multi-layer fin wiring interposer fabrication process

A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.

System in-package test inspection apparatus and test inspection method

A superconducting integrated circuit includes a substrate, a multilayer structure formed on the substrate and composed of a lower superconducting electrode, a tunnel barrier and an upper superconducting electrode sequentially joined together upward in the order mentioned, and an insulating layer perforated to form via holes to get electrical contacts with the lower and upper electrodes. The insulating layer is formed of a high-resolution, photosensitive, solvent-soluble, organic insulating material. The superconducting integrated circuit is produced by a method that includes the steps of depositing the multiplayer on the substrate, applying the insulating material to the front surface of the substrate inclusive of the multiplayer, forming the via holes in the insulating material by the lithographic technique at the prospective positions to get electrical contacts with the upper and lower electrodes, and laying wirings for connecting the upper and lower electrodes through the via holes.

Superconducting integrated circuit and method for fabrication thereof

There is provided a contact probe that is smaller than 50 &#x3bc;m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrodeand a ground electrodethat are put into contact with an object to be measured; and a coaxial cablehaving a coreelectrically connected to the signal electrodeand an outer covering conductor la electrically connected to the ground electrode, wherein the tip member is formed on a printed wiring board, and wherein the signal electrodeand the ground electrodeare constructed of fine coplanar strip lines formed on an insulating board

Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe

There is provided a contact probe that is smaller than 50 &#x3bc;m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrodeand a ground electrodethat are put into contact with an object to be measured; and a coaxial cablehaving a coreelectrically connected to the signal electrodeand an outer covering conductorelectrically connected to the ground electrode, wherein the tip member is formed on a printed wiring board, and wherein the signal electrodeand the ground electrodeare constructed of fine coplanar strip lines formed on an insulating board

Growing community of inventors

Tsukuba, Japan

Kazuhiko Tokoro