Japan Gore-Tex Inc.

W. L. Gore & Associates, Inc.

Kazuhiko Ohashi

Sunao Fukutake

Takayuki Wani

Hiroshi Kato

Akira Urakami

Osamu Yokomizo

Makoto Ogawa

Kouichi Okino

Koji Yoshida

An IC chip bonding sheet having adhesive resin layers formed on both faces of a porous polytetrafluoroethylene layer comprising a porous polytetrafluoroethylene sheet, the porous polytetrafluoroethylene layer retaining porous voids, and the adhesive resin layers comprising a bromine-free flame retardant resin composition.

Integrated circuit chip bonding sheet and integrated circuit package

A dielectric film for a printed wiring board that has excellent heat resistance, moisture resistance, insulation properties, adhesiveness, ease of handling, ease of processing, and the like, and possesses low elasticity and high elongation as stress relief functions. The dielectric film has drawn porous polytetrafluoroethylene used as the base material; this is impregnated with an adhesive or fusible resin; the post-solidification tensile modulus of elasticity is 0.1 to 1.8 GPa; and the tensile elongation at break (at 25&#xb0; C.) is at least 4.0%. A semiconductor device, comprising a multilayer printed board having a plurality of circuit layers, and a semiconductor element mounted on the multilayer printed board, this semiconductor device having an insulating/adhesive layer with a stress relief function between the outermost circuit layer of the multilayer board on the side of the semiconductor element, and the circuit layer adjacent thereto; and the insulating/adhesive layer is formed from the dielectric film. Also, a printed wiring board therefor.

Dielectric film for printed wiring board, multilayer printed board, and semiconductor device

A liquid crystal-containing precursor for a liquid crystal display device consisting of a porous polytetrafluoroethylene film which has the structure defining the pores treated with a hydrophilic substance. The pores of the treated porous film are substantially filled with liquid crystals. The hydrophilizing treatment increases the transition speed of the liquid crystals from light-scattering orientation to light-transmitting orientation. The liquid crystal-filled film can be covered with transparent non-porous layers of material, having an electrically-conductive film on at least one surface, which can be hermetically sealed at the edges, to permit long-term storage of the liquid crystals in ready-to-use sheet form and easy inclusion into a liquid crystal display device.

LCD article from liquid crystal filled, hydrophilically-coated, porous

A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.

Printed circuit board with a coverlay film

A composite material comprising a porous polymeric material bonded to a silicone resin substrate with a silicone-based adhesive agent, wherein only part of the pores of said porous material in the thickness direction thereof contain said silicone-based adhesive agent.

Composite layered material containing a silicone resin substrate

A carrier sheet for printed circuits and semiconductor chips having enhanced adhesion of conductive metal layers to a fluororesin surface resulting from rendering the fluororesin surface hydrophilic by a hydrophilic macromolecule before plating the metal onto the surface.

Carrier sheet for printed circuits and semiconductor chips

A platinum or platinum-alloy plated porous fluoropolymer membrane where the plated metal adheres to the membrane through a coating of a cation-exchange material on the membrane.

Porous fluorores in material plated with a metal

A metallized porous fluorinated polymer in which at least the inside surfaces are coated with a hydrophilic fluorinated polymer and the surface of the hydrophilic polymer coated with a metal film and a process for its manufacture.

Growing community of inventors

Okayama, Japan

Kazuhiko Ohashi