Sony Corporation

Sony Semiconductor Solutions Corporation

Kazuhiko Nemoto

Masato Doi

Toyoharu Ohata

Masamichi Ogawa

Katsuhiro Seo

Osamu Matsuda

Tamotsu Ishii

Yoshifumi Mori

Toshimasa Kobayashi

Midori Kanaya

The present technology aims to provide a diffraction element that functions like a transmissive hologram, and more particularly, aims to provide a diffraction element suitable for forming an image projection system. The present technology provides a composite diffraction element that includes a stack structure including a first diffraction element, a second diffraction element, and a third diffraction element in this order. The second diffraction element diffractively reflects light that has passed through the first diffraction element and reached the second diffraction element, toward the first diffraction element. The first diffraction element diffractively reflects the light diffractively reflected by the second diffraction element, toward the third diffraction element. The third diffraction element transmits the light diffractively reflected by the first diffraction element, and diffractively reflects zeroth-order light that has passed through the first diffraction element and the second diffraction element.

Composite diffraction element, instrument, and image projection system

An object is to provide an image projection system in which a size and weight of a head-mounted portion are reduced and binocular vision is enabled. The present technology provides an image projection system including an image projection apparatus and an image display light diffraction optical element separated from the image projection apparatus and arranged in front of each of the two eyes, and the image projection apparatus includes: a positional information acquisition unit that acquires three-dimensional positional information of the image display light diffraction optical element provided in front of each of two eyes; an image display light adjustment unit that adjusts projected image display light on the basis of the three-dimensional positional information acquired by the positional information acquisition unit; and one projection optical system that can project the image display light to a region covering the two eyes and projects, toward the image display light diffraction optical elements, the image display light adjusted by the image display light adjustment unit.

Image projection system, image projection apparatus, image display light diffraction optical element, tool, and image projection method

An optical pickup includes a light source emitting a light beam, a diffraction element diffracting the light beam to separate it into a main beam and a sub beam, an objective lens focusing the main and sub beams onto a desired recording layer of an optical disc, a lens moving section moving the objective lens in focusing and tracking directions, a light-separating element separating a reflected light beam, formed by reflecting each of the main and sub beams at the recording layer, into multiple beam components and allowing the reflected light beam to travel without rotating an image thereof, and a light-receiving element having multiple light-receiving regions that optically receive the reflected light beam and generating a light reception signal based on the amount of received light to allow a signal processing section to generate a focus error signal and a tracking error signal based on the light reception signal.

Optical pickup and optical disc apparatus

Provided is an optical pickup including: a light-source emitting a light-beam; an objective lens collecting the light-beam on a desired recording layer among one or two recording layers or more installed in an optical disc and where spirally- or concentrically-shaped tracks are formed; a lens-moving unit moving the objective lens in a tracking direction toward at least an inner-circumference or outer-circumference side; a light splitting device splitting a reflected light-beam into reflected light-beams and propagating the light-beams; a light-detecting device generating central, inner-circumference-side, and outer-circumference-side light-detecting signals according to received light amounts thereof by central, inner-circumference-side, and outer-circumference-side light-detecting areas, receiving central, inner-circumference-side, and outer-circumference-side portions of an image of the reflected light-beam in the radial direction and allowing a signal processing unit to generate a tracking error signal by using the inner-circumference-side and outer-circumference-side-light-detecting signals, being added with a product of a predetermined coefficient and the central-light-detecting signal.

A method of production of semiconductor light emission devices for forming stripes of two multilayers having different emission wavelengths on a substrate, including the steps of: depositing a first multilayer including an active layer on the substrate; selectively etching the first multilayer to form a plurality of adjoining pairs of stripes of the first multilayer; depositing a second multilayer including an active layer on the substrate and the stripes of the first multilayer; selectively etching the second multilayer to form a plurality of adjoining pairs of stripes of the second multilayer on the substrate between the stripes of the first multilayer; and dividing the substrate between adjoining pairs of stripes of the first multilayer and between adjoining pairs of stripes of the second multilayer to divide it into semiconductor light emission devices provided with a stripe of the first multilayer and the second multilayer having different emission wavelengths.

Method of production of semiconductor light emission device and method of production of light emission apparatus

An optical module includes: a base plate; a light emitting element mounted on the base plate; an integrated circuit element of the light receiving element built-in type mounted on the base plate by bonded wires and having a light receiving portion for receiving returning light originating from light emitted from the light emitting element; and a circuit board having a window for allowing light to pass therethrough and connected to the integrated circuit element in a state wherein the light receiving portion is exposed through the window.

Optical module and optical pickup apparatus

To improve reliability in controlling an output of a semiconductor laser. There are provided a prism adhered to the semiconductor substrate, and having a light reflection surface formed with a light reflection film for reflecting a laser beam emitted from the semiconductor laser and a light transmission surface for transmitting a laser beam emitted from the semiconductor laser outside an aperture range of the objective lens; a monitor photoreceptor disposed in an area of the semiconductor substrate where the prism is disposed, and receiving the laser beam transmitted through the light transmission surface of the prism; and a signal detection photoreceptor disposed outside the area of the semiconductor substrate where the prism is disposed, for receiving, as return light, a laser beam reflected at the light reflection surface of the prism and converged upon the record surface of the disk-shaped recording medium via the objective lens.

Semiconductor integrated device

A laser diode capable of improving surge withstand voltage by preventing damage to a rear end surface, and a method of manufacturing the same are provided. A laser diode includes a laser resonator between a first end surface as a main emission end surface and a second end surface facing the first end surface, and the laser diode includes a light absorption inhibition region on the second end surface side of the laser resonator.

Laser diode and method of manufacturing the same

A production method of a semiconductor laser is provided. A number of cavities are constructed corresponding to a number of light emitting units disposed on a substrate. A part of at least one of the number of cavities is removed to set cavity lengths of the number of cavities.

Production method of semiconductor laser apparatus

Heat removal while a semiconductor laser emits a laser beam, and heat insulation with respect to optical devices are sought to be improved. A semiconductor integrated apparatus is so configured to include a base member formed of a metal material or a ceramic material, a housing formed of a resin material or a glass material, and a device arrangement block. A substrate on which are mounted predetermined optical devices including a semiconductor laser is placed on the base member. The housing covers the substrate placed on the base member. The device arrangement block is attached to the housing and has optical devices that are different from those described above.

Semiconductor integrated apparatus

A semiconductor laser capable of emitting a plurality of laser light having different oscillation wavelengths which is formed with dielectric films having little fluctuation in reflectance at ends of a plurality of active layers and a method of production of the same, said semiconductor laser having a plurality of active layers having different compositions on a substrate and emitting in parallel a plurality of laser light having different oscillation wavelengths, wherein a front dielectric film having a predetermined thickness by which a reflectance with respect to light of a predetermined wavelength of an arithmetical mean of oscillation wavelengths becomes the extremal value is formed on an end of the laser emission side, while rear dielectric films having higher reflectances compared with the front dielectric film and having predetermined thicknesses by which reflectances with respect to light having a predetermined wavelength become the extremal values are formed on the end of the rear side, and a method of producing the same.

Semiconductor laser and method of production of the same

There is provided a semiconductor laser apparatus capable of individually optimizing oscillations at a plurality of light emitting units fabricated on the single substrate in accordance with usages of each emitted laser lights. A plurality of cavities (laser diodes A and B), which correspond to the plurality of light emitting units, are fabricated on single substrate. And cavity lengths of the cavities are fabricated to different from one another.

Semiconductor laser apparatus, laser coupler, data reproduction apparatus, data recording apparatus and production method of semiconductor laser apparatus

An optical head comprises a first optical system which irradiates a light of a first wavelength towards the information recording medium and detects a return part of the light reflected by the information recording medium, and a second optical system which irradiates a light of a second wavelength shorter than the first wavelength towards the information recording medium and detects a return part of the light reflected by the information recording medium. When writing or reading information with respect to the information recording medium using the second optical system, a pushpull signal is detected by the second optical system, and an offset component of the pushpull signal is canceled by a signal detected by the first optical system.

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Kanagawa, Japan

Kazuhiko Nemoto