Fuji Photo Film Company, Limited

Fujifilm Corporation

Fujinon Corporation

Fuji Photo Optical Co., Ltd.

Other

Kazuhiko Nagano

Yoji Okazaki

Hiromi Ishikawa

Takeshi Fujii

Hiromitsu Yamakawa

Teruhiko Kuramachi

Fusao Yamanaka

Shinichiro Sonoda

Yuichi Teramura

Hideo Miura

Mitsuru Sawano

Takashi Yoshida

Koichi Kimura

Eiji Suzuki

Akinori Harada

Hiroshi Sunagawa

Hideo Yamanaka

Atsushi Osawa

Hiroaki Hyuga

Masami Hatori

Shinichi Shimotsu

Daisuke Nakaya

Akihiro Hashiguchi

Satoshi Mino

Toshihiko Omori

Hiromatsu Yamakawa

An ultrasonic endoscope in which the temperature rise can be suppressed with a reduced diameter. The ultrasonic endoscope includes: an ultrasonic transducer part including plural ultrasonic transducers; an exterior member for accommodating the ultrasonic transducer part; and a heat conducting part provided inside of the exterior member and respectively connected to the ultrasonic transducer part and an inner surface of the exterior member. It is preferable that the heat conducting part has a coefficient of thermal conductivity equal to or more than 10 W/(m&#xb7;K). Further, it is preferable that one of the heat conducting member and the exterior member has an electric insulation property.

Ultrasonic endoscope

An ultrasonic endoscope having a small size and a slight temperature rise of an insertion part even when the transmission output of an ultrasonic transducer part is increased or an imaging device is attached thereto. The ultrasonic endoscope includes: an ultrasonic transducer part having plural ultrasonic transducers for transmitting and receiving ultrasonic waves; a flexing part for flexibly supporting the ultrasonic transducer part; a coupling part for coupling the flexing part to an operation part; a covering material for covering at least the flexing part and the coupling part; and a heat-conducting member provided inside of the covering material and coupled to the ultrasonic transducer part, for transferring heat generated in the ultrasonic transducer part to the operation part.

Ultrasonic endoscope and ultrasonic endoscopic apparatus

A laser apparatus includes: a plurality of laser diodes respectively having light-emission points and being fixed to a block so that the light-emission points are aligned along a direction; and a collimator-lens array integrally formed to contain a plurality of collimator lenses which are arranged along a direction and respectively collimate laser beams emitted from the plurality of laser diodes. The block has a lens-setting surface which is flat, perpendicular to optical axes of the plurality of laser diodes, and located on the forward side of the plurality of laser diodes at a predetermined distance from the light-emission points, and the collimator-lens array is fixed to the block so that an end surface of the collimator-lens array is in contact with the lens-setting surface.

Laser apparatus in which laser diodes and corresponding collimator lenses are fixed to block, and fiber module in which laser apparatus is coupled to optical fiber

A laser module includes: a chassis having a light-output window from which one or more laser beams are outputted; a hermetically sealed package which is fixed to the chassis; one or more semiconductor laser elements which are arranged in the hermetically sealed package, and emit the one or more laser beams; a transparent member which is arranged to cover the light-output window; an optical fiber which has a light-entrance end face, and is arranged outside the chassis so that the light-entrance end face is in contact with the transparent member; and an optical condensing system which is arranged inside the chassis, and makes the one or more laser beams pass through the transparent member and be condensed on the light-entrance end face. The transparent member and the optical fiber are detachably attached to the chassis.

Laser module having detachable transparent member covering light-output window

In a laser array unit in which a plurality of laser beams emitted from a laser array is received by a lens array, the lens holder for fixedly bonding the lens array is formed such that the length of the surface on which the lens array is bonded in the direction orthogonal to the optical axis direction of the lens is longer than the length of the surface to be bonded to a certain other fixing member in the same direction.

Lens holder and laser array unit using the same

A laser apparatus includes: one or more semiconductor lasers emitting one or more laser beams; an optical fiber; an optical condensing system which makes the one or more laser beams enter the optical fiber from a light-entrance end of the optical fiber; and a package which fixedly contains the optical condensing system and the one or more semiconductor lasers, and fixedly holds the optical fiber in such a manner that the light-entrance end faces the optical condensing system. The one or more semiconductor lasers are directly or indirectly fixed to the package with solder, and the one or more optical components are directly or indirectly fixed to the package with a thin layer of adhesive having a thickness of less than or equal to 1 micrometer, and preferably a thickness within a range of 0.2 micrometers to 1 micrometer after being dried.

Laser apparatus and method for assembling the same

In a method for stabilizing an optical output of a semiconductor laser: the semiconductor laser is heated with a heater when the semiconductor laser is not in operation; and the heating of the semiconductor laser is stopped, or the amount of heat supplied to the semiconductor laser is lowered, almost simultaneously with startup of the semiconductor laser.

Method for stabilizing optical output of semiconductor laser

A method for assembling a laser apparatus which condenses a laser beam and couples the laser beam to an optical fiber. After the optical fiber is fixed to a package, the whole or a part of an optical condensing system is fixed to the package through a fixing structure having at least one guide surface extending in at least one of first and second directions respectively parallel and perpendicular to the core axis of the optical fiber, by moving the whole or the part of the optical condensing system along the at least one guide surface to a predetermined position with respect to the core axis, and fixing the whole or the part of the optical condensing system to the fixing structure at the predetermined position.

Laser apparatus and methods for assembling and installing the same

In a laser apparatus: an adhesion surface and a first reference surface making a first predetermined angle with the adhesion surface are formed on an attachment part, and a mounting surface and a second reference surface making a second predetermined angle with the mounting surface are formed on a fixing member which is directly or indirectly fixed to a main body and arranged to adhesively hold the attachment part. In a method for assembling the laser apparatus: a first angle between the second reference surface and a reference direction is measured; the orientation of the attachment part is adjusted while measuring a second angle between the first reference surface and the reference direction; and the attachment part is adhesively fixed to the fixing member when the second angle is equal to an angle predetermined based on the first angle and the first and second predetermined angles.

Laser apparatus and method for assembling the laser apparatus

In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350&#x2dc;450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350&#x2dc;450 nm, optical components whose organic volatile gas generation measured by GC/MS is 10 &#x3bc;g/g or less at 150&#xb0; C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 100 &#x3bc;g/g or less at 150&#xb0; C.

Laser module

A laser unit containing a laser package, in which a laser element has been hermetically sealed, is connected with a converging optical system unit containing a converging optical system. The laser unit is provided with a laser package holder, which comprises a holder main body for supporting the laser package and a connecting member. The converging optical system unit is provided with a converging optical system holder, which comprises a holder main body for supporting the converging optical system and a connecting member having been welded to the connecting member of the laser package holder. A thermal conductivity of the holder main body of the laser package holder is set to be larger than the thermal conductivities of the connecting member of the laser package holder and the connecting member of the converging optical system holder.

In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350&#x2dc;450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350&#x2dc;450 nm and whose life is 5500 hours or more, optical components whose organic volatile gas generation measured by GC/MS is 10 &#x3bc;g/g or less at 150&#xb0; C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 300 &#x3bc;g/g or less at 15&#xb0; C.

A laser module includes: one or more semiconductor laser elements which emit one or more divergent laser beams; one or more collimator lenses which collimate the one or more divergent laser beams; a condensing lens which condenses the one or more collimated laser beams, and make the one or more collimated laser beams converge at a convergence position; an optical fiber which is arranged in such a manner that the convergence position is located on the light-entrance end face; and a package which contains the one or more semiconductor laser elements and the one or more collimator lenses, does not contain the condensing lens and the light-entrance end face, and is hermetically sealed.

Laser module with sealed package containing limited optical components

In a laser module in which laser beams emitted from semiconductor laser elements are collimated by collimator lenses, and condensed by an optical condensing system so that the laser beams converge at a light-entrance end face of an optical fiber. The semiconductor laser elements and the collimator lenses are contained in a hermetically sealed, first package which includes a front wall having a window arranged for passage of the laser beams, and a portion of the optical condensing system and the light-entrance end face are contained in a hermetically sealed, second package which is fixed to the front wall. The cross section of the second package perpendicular to the optical axis of the optical fiber at the light-entrance end face is smaller than the cross section of the first package parallel to the cross section of the second package.

Laser module with sealed packages having reduced total volume

An optical wiring substrate fabrication method capable of simple formation, by maskless exposure, of an inclined face shape at an end portion of a core layer structuring an optical waveguide. Using an exposure apparatus, image exposure is carried out with a light beam which is modulated by a spatial modulation element in accordance with image information. A predetermined area of a photosensitive material (a photoresist), which is coated on the core layer which is a material of the optical wiring substrate, is exposed by a light beam (UV) and patterned to form an etching mask. A region corresponding to the inclined face, which is to be formed at the end portion of the core layer, is exposed and patterned by the light beam, exposure amounts of which are controlled in accordance with the inclined form of the inclined face, such that an end portion of the etching mask has an inclined face structure. When the core layer is worked by etching using this etching mask, working of the core layer at the end portion of the core layer progresses in proportion to film thickness of the etching mask, and the inclined face is formed.

Growing community of inventors

Kanagawa, Japan

Kazuhiko Nagano