Fujitsu Corporation

Fujitsu Automation Limited

Kazuhiko Mitobe

Junichi Kasai

Michio Sono

Ichiro Yamaguchi

Koki Otake

Masaaki Seki

Masataka Mizukoshi

Yasuo Yamagishi

Mitsutaka Sato

Nobuo Kamehara

Tetsuya Fujisawa

Masayuki Ochiai

Katsuhiro Hayashida

Hidefumi Ueda

Susumu Abe

Toshio Hamano

Yasuhiro Shinma

Masao Sakuma

Seiichi Orimo

Masaki Waki

Yoshimi Suzuki

Lim Cheang Hai

Hiroshi Inoue

Yutaka Yamada

Masanori Yoshimoto

Tadashi Uno

Yoshitsugu Katoh

Kouji Saito

First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate . The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.

Bump-forming method using two plates and electronic device

A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism

A semiconductor device including a semiconductor chip, connection parts arranged along one end of the semiconductor chip, and external connection terminals connected to the connection parts.

Semiconductor device and semiconductor device module

A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.

Method for fabricating solder bumps by forming solder balls with a

A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

Method for producing a semiconductor device, base member for

A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, before the forming process, on a position on the frame base in which the leads are formed, and unnecessary portions of the frame base and the non-conductive adhesive being removed in the forming process so that the leads having a predetermined configuration and provided with the non-conductive adhesive are formed.

Method of fabricating a semiconductor device

Semiconductor device, base member for semiconductor device and

A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a &lt;110&gt; crystallographic plane, and an orientation flat in a &lt;1-11&gt; crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the &lt;1-11&gt; crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

Process for forming solder balls on a plate having apertures using

A semiconductor device includes a semiconductor chip mounted in a resin package body. A plurality of interconnection leads are provided on the resin package body along a lower edge thereof and project outwardly from the lower edge. A heat dissipation lead is connected to the resin package body for dissipating heat generated by the semiconductor chip. The heat dissipation lead includes a plate of a heat conducting material having a stage part and a heat sink part, wherein the stage part is held inside the resin package body and supports the semiconductor chip thereon. The heat sink part projects outwardly from the resin package body and includes a part that extends in a downward direction. The heat sink part has a lower edge that is formed at a level substantially flush with the outer lead part of the interconnection leads such that the semiconductor device is held upright, when placed on a substrate, by the outer lead part of the interconnection leads and by the lower edge of the heat sink part of the heat dissipation lead.

Surface-mounting type semiconductor package having an improved

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Kawasaki, Japan

Kazuhiko Mitobe