Mitsubishi Denki Kabushiki Kaisha

Canon Kabushiki Kaisha

Tdk Corporation

Oki Data Corporation

Tecnisco Limited

Kazuhiko Ito

Masahiro Mizuno

Shiro Ogura

Hitoshi Yamamoto

Hiroshi Baba

Shigeo Yamagata

Nobuyuki Okuzawa

Junichiro Urabe

Munehiro Takaku

Akira Ogawa

Toshio Matsumoto

Takao Kinoshita

Makoto Endo

Koji Urasawa

Kazuo Ito

Hideki Miura

Mitsunori Hiraoka

Masahiro Takei

Masahiko Ogawa

Tsuguhide Sakata

Tokihiko Ogura

Hiroshi Nakanishi

Tadashi Takayama

Yuichi Miyoshi

Hokichi Yoshioka

Kunio Ohtaki

Fumio Korayashi

Eiichi Yamazaki

Yoshihisa Masuda

Kiyozo Suzuki

Disclosed herein is a coil component that includes a resin body having a first resin-based insulating material and a second resin-based insulating material lower in relative permittivity than the first resin-based insulating material, a coil pattern embedded in the resin body and helically wound in a plurality of turns, and first and second terminal electrodes formed on a surface of the resin body and connected respectively to one and other ends of the coil pattern. The coil pattern has a part covered with the first resin-based insulating material and another part covered with the second resin-based insulating material.

Coil component

Disclosed herein is a coil component that includes a coil pattern embedded in an element body and helically wound in a plurality of turns. The element body includes a support body having a cavity formed therein and a first insulating layer stacked on the support body so as to cover the cavity, thereby forming a hollow space inside the element body. The coil pattern includes a plurality of first sections formed along an inner wall of the cavity and a plurality of second sections formed on the first insulating layer. One ends of the plurality of first sections are connected respectively to their corresponding one ends of the plurality of second sections. The other ends of the plurality of first sections are connected respectively to their corresponding other ends of the plurality of second sections.

Coil component and manufacturing method therefor

Disclosed herein is a coil component that includes a coil pattern embedded in a resin body. The resin body includes a winding core area surrounded by the coil pattern and having a first surface and a substantially flat second surface different in the circumferential direction position from the first surface, and a first surrounding area covering the first surface of the winding core area. The coil pattern includes first sections extending along the first surface of the winding core area and second sections extending along the second surface of the winding core area. One ends of the first sections are connected respectively to their corresponding one ends of the second sections. The other ends of the first sections are connected respectively to their corresponding other ends of the second sections.

There is provided a coil component including a coil portion that has at least one layer of planar coil including a coil-wound portion and an insulative layer which covers the periphery of the coil-wound portion, a covering portion that covers the coil portion and is constituted of a mixture including magnetic fillers and resin, and a conductor post that is penetratingly provided inside the covering portion and extends from the coil-wound portion to an upper surface of the covering portion along an axial direction of the planar coil. The conductor post has a post portion which extends from the coil-wound portion in the axial direction of the planar coil, and a lid portion which is exposed from the covering portion and extends from an end portion of the post portion on the upper surface side along a surface direction of the upper surface.

Coil component and method of manufacturing coil component

A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

Substrate with many via contact means disposed therein

An image data adjusting method for increasing/decreasing the number of pixels of input image data in a given direction with a desired magnification to obtain output image data. The method includes deriving an integral magnification for each of all the pixels of the input image data per direction in which the number of pixels of the input image data is increased/decreased, and copying a pixel value of each of the pixels based on the integral magnification to obtain the output image data.

Image data adjusting device and method

An image data adjusting device adjusts the number of pixels of input image data. The device includes a data adjusting table representing magnifications for all the pixels of the input image data per direction in which the number of the pixels of the input image data is adjusted. The device further includes a data adjusting section which refers to the data adjusting table and copies each of the pixels serially inputted in a scan direction as many times as represented by the corresponding magnification of the data adjusting table, thereby to obtain output image data.

A data storage managing system and method in which a HOST system obtains operation information of a storage device from a system connected to a network without the need for a specific device driver are disclosed. When disks shared between systems connected to the network are managed by a disk manager, monitoring and control information for the shared disks may be accessed by a file access command of the operating system on the HOST system. An operation information storage device is formed in a file format which can be accessed by a file access command of the operating system on the HOST system and the HOST system reads the operation information of the storage devices stored in the operation information file according to the file access command. The information to control the operation of the storage devices is written in the operation information file according to the file access command. The disk manager controls the operation of the storage devices according to the operation information of the operation information file.

Method and system including operation information accessible by a system

A data storage system in which system activation is performed in cooperation with two host systems sharing a data storage system. A determination unit determines which of the two host systems makes access to the data storage system. A system access control unit controls access to the data storage system from the host systems to prevent competition between the host systems. Each of the host systems indicates completion of system activation to the other host system.

Shared data storage for two hosts with a storage manager that permits

Embodiments of the present invention provide a data storage system that reduces a load of a data bus for connecting a HOST system with the data storage system. The data storage system includes a disk manager connected to the HOST system by a SCSI BUS, connected to a disk control unit by an RS PORT and connected to disk enclosures and a fan unit by a Serial BUS. The disk manager monitors operation of the disk control unit and disk enclosures and transmits results to the HOST system. In addition, control commands of the HOST system to the disk enclosures are executed via the disk manager.

Data storage system and storage managing method

In case of consecutive transmission of a large amount of data such as dynamic image data, a multi-media storage system of the invention generates and transmits data stored in a faulty disk drive when one of a plurality of disk drives being faulty caused by an internal calibration or an error of the disk drive and the faulty disk drive does not respond within a predetermined length of time set in a timeout table. The multi-media storage system cancels an access to the faulty disk drive, generates data to be read from the faulty disk drive based on data stored in the other disk drives of the plurality of disk drives and the redundant data and continues to transmit data.

Multi-media storage system

A read unit 400 which governs reading of data and a write unit 500 which governs writing of data are located separately in a RAID unit 300 which controls array type magnetic disk units. To read data from magnetic disk units 800, a control circuit 600 uses the read unit 400 to read data through an HDD control unit 700. To write data, the control circuit 600 uses the write unit 500 to write data into the magnetic disk units 800. Since the read unit and write unit are provided separately, processing performance improves.

Recording system having a redundant array of storage devices and having

The present invention relates to an arrayed recording apparatus with reduced writing time. Various devices are used to write data without redundant data and to update the redundant data more efficiently during idle time. In one embodiment, a temporary write track is provided for each cylinder. When data are read, updated and re-written, the data are re-written to the temporary write track. Since the re-writing does not require a full disk rotation, the writing occurs quickly. Data in the temporary write track are relocated into the disk during an idle state, without being synchronized. Additionally, corresponding blocks in data areas can be used for writing data rather than a specified temporary write track. In order to improve re-writing time, the rotation of the disk drives can be synchronized to avoid full rotations between reads and writes, or cache memories for each disk can be used. When data is accessed from a host computer in a first unit size and from the memory devices in a second unit size, a buffer and cache can be used to limit the written data to those portions of the second unit size which have been changed. Each of these devices reduces the total access time for writing to arrayed recording devices.

Recording apparatus and method for an arrayed recording apparatus

A compound semiconductor integrated circuit device has a region implanted with an impurity for forming a carrier capture level in an element isolating region in a semi-insulating compound semiconductor substrate. The region includes at least a first region of relatively low implantation concentration of the impurity and a second region of relatively high implantation concentration of the impurity.

Growing community of inventors

Tokyo, Japan

Kazuhiko Ito