Kabushiki Kaisha Toshiba

Nuflare Technology, Inc.

Fujitsu Corporation

Nuflare Technology America, Inc.

Matsushita Electric Industrial Co., Ltd.

Toagosei Chemical Industry, Co., Ltd.

Kazuhiko Inoue

Munehiro Ogasawara

Atsushi Ando

Yutaka Tomisawa

Toru Suga

Toshikazu Fukuda

John Hartley

Satoshi Kubota

Masahiro Ito

Riki Ogawa

Masataka Shiratsuchi

Takashi Kimura

Hideki Nukada

Steven D Golladay

Kenji Nakajima

Hideaki Hashimoto

Tatsuro Mitani

Hidekazu Takekoshi

Yoshihiro Kishita

Souichi Imamura

Masanori Ochi

Tetsuo Ishii

Shigehiro Hosoi

Yoshihiro Izumi

Tsuyoshi Inokuchi

Yuichi Maekawa

Toshiaki Senda

Nozomi Minami

Yuji Kawada

Motohito Yamanaka

Yoichi Haruta

Masaaki Ohtsuka

Norihiko Iwamura

A multi-electron beam image acquisition apparatus includes a first electromagnetic lens configured to focus multiple primary electron beams to form an image on a substrate, and a second electromagnetic lens configured to be able to variably adjust a peak position of a magnetic field distribution in a direction of a trajectory central axis of multiple secondary electron beams, and to focus the multiple secondary electron beams to form an image on either one of a detection surface of a detector and a position conjugate to the detection surface. The first electromagnetic lens focuses, to form an image, the multiple secondary electron beams before they are separated from the multiple primary electron beams, and the second electromagnetic lens is arranged between a separator which separates the multiple secondary electron beams and an image forming point on which the multiple secondary electron beams are focused by the first electromagnetic lens.

Multi-electron beam image acquisition apparatus, multi-electron beam inspection apparatus, and multi-electron beam image acquisition method

A conduction inspection method for a multipole aberration corrector according to one aspect of the present invention includes applying, in a state where a predetermined potential has been applied to each shield electrode, an inspection charged particle beam to pass through a first opening, a second opening, and a third opening, using a multipole aberration corrector which includes an upper-stage substrate where the first opening is formed and a shield electrode is arranged around the first opening, a middle-stage substrate where the second opening is formed, a plurality of control electrodes are disposed to be opposite each other across the second opening, and a plurality of wirings are arranged to be individually connected to one of the plurality of control electrodes which are different from each other, and a lower-stage substrate where the third opening is formed and a shield electrode is arranged around the third opening, and which corrects aberration of a correction charged particle beam passing through the first opening, the second opening, and the third opening by individually variably applying a potential to each of the plurality of control electrodes; measuring, via a wiring individually connected to each control electrode of the plurality of control electrodes in the plurality of wirings, an inflow electron dose of electrons, into each control electrode of the plurality of control electrodes, which are secondarily emitted because the inspection charged particle beam has passed through the first opening, the second opening, and the third opening and has irradiated an object disposed at the downstream side of the lower-stage substrate; and determining individually, for each control electrode, whether there is conduction between a control electrode concerned and a wiring connected to the control electrode concerned, based on a result of measuring the inflow electron dose into each control electrode.

Conduction inspection method for multipole aberration corrector, and conduction inspection apparatus for multipole aberration corrector

According to one aspect of the present invention, an aberration corrector includes a first electrode substrate provided with first passage holes through which multiple electron beams pass; a second electrode substrate disposed below the first electrode substrate and provided with second passage holes through which the multiple electron beams pass, first electrodes of four or more poles being disposed individually on each top surface region of top surface regions around some second passage holes among the second passage holes; and a third electrode substrate disposed below the second electrode substrate and provided with third passage holes through which the multiple electron beams pass, second electrodes of four or more poles being disposed individually on each of top surface region of top surface regions around some third passage holes corresponding to remaining second passage holes in which the first electrodes are not disposed, among the third passage holes.

Aberration corrector

According to one aspect of the present invention, a multi-beam image acquisition apparatus, includes: an objective lens configured to image multiple primary electron beams on a substrate by using the multiple primary electron beams; a separator configured to have two or more electrodes for forming an electric field and two or more magnetic poles for forming a magnetic field and configured to separate multiple secondary electron beams emitted due to the substrate being irradiated with the multiple primary electron beams from trajectories of the multiple primary electron beams by the electric field and the magnetic field formed; a deflector configured to deflect the multiple secondary electron beams separated; a lens arranged between the objective lens and the deflector and configured to image the multiple secondary electron beams at a deflection point of the deflector; and a detector configured to detect the deflected multiple secondary electron beams.

Multi-beam image acquisition apparatus and multi-beam image acquisition method

Aberration corrector includes a lower electrode substrate to be formed therein with plural first passage holes having a first hole diameter and making multiple electron beams pass therethrough, and to be arranged thereon plural electrode sets each being plural electrodes of four or more poles, surrounding a first passage hole, for each of the plural first passage holes, and an upper electrode substrate above the lower one, to be formed therein with plural second passage holes making multiple electron beams pass therethrough, whose size from the top of the upper electrode substrate to the middle of way to the back side of the upper electrode substrate is a second hole diameter, and whose size from the middle to the back side is a third hole diameter larger than each of the first and second hole diameters, wherein a shield electrode is on inner walls of plural second passage holes.

Aberration corrector and multiple electron beam irradiation apparatus

A multi-charged particle beam irradiation apparatus includes a forming mechanism to form multiple charged particle beams, a multipole deflector array to individually deflect each beam of the multiple charged particle beams so that a center axis trajectory of each beam of the multiple charged particle beams may not converge in a region of the same plane orthogonal to the direction of a central axis of a trajectory of the multiple charged particle beams, and an electron optical system to irradiate a substrate with the multiple charged particle beams while maintaining a state where the multiple charged particle beams are not converged.

Multi-charged particle beam irradiation apparatus and multi-charged particle beam inspection apparatus

A multiple electron beam irradiation apparatus includes a shaping aperture array substrate to form multiple primary electron beams, a plurality of electrode array substrates stacked each to dispose thereon a plurality of electrodes each arranged at a passage position of each of the multiple primary electron beams, each of the multiple primary electron beams surrounded by an electrode of the plurality of electrodes when each of the multiple primary electron beams passes through the passage position, the first wiring and the second wiring applied with one of different electric potentials, and a stage to mount thereon a target object to be irradiated with the multiple primary electron beams having passed through the plurality of electrode array substrates, wherein, in each of the plurality of electrode array substrates, each of the plurality of electrodes is electrically connected to either one of the first wiring and the second wiring.

Multiple electron beams irradiation apparatus

A multiple electron beam irradiation apparatus includes a forming mechanism which forms multiple primary electron beams; a plurality of electrode substrates being stacked in each of which a plurality of openings of various diameter dimensions are formed, the plurality of openings being arranged at passage positions of the multiple primary electron beams, and through each of which a corresponding one of the multiple primary electron beams passes, the plurality of electrode substrates being able to adjust an image plane conjugate position of each of the multiple primary electron beams depending on a corresponding one of the various diameter dimensions; and a stage which is capable of mounting thereon a target object to be irradiated with the multiple primary electron beams having passed through the plurality of electrode substrates.

Provided is a multiple electron beam inspection apparatus including: an irradiation source irradiating a substrate with multiple electron beams; a stage on which is cable of mounting the substrate; an electromagnetic lens provided between the irradiation source and the stage, the electromagnetic lens generating a lens magnetic field, the multiple electron beams being capable of passing through the lens magnetic field; an electrostatic lens provided in the lens magnetic field, the electrostatic lens including a plurality of through-holes and a plurality of electrodes, the plurality of through-holes having wall surfaces respectively, each of the multiple electron beams being capable of passing through the corresponding each of the plurality of through-holes, each of the plurality of electrodes provided on each of the wall surfaces of the plurality of through-holes, at least one of the through-holes provided apart from a central axis of trajectory of the multiple electron beams having a spiral shape; and a power source connected to the electrodes.

Multiple electron beam inspection apparatus with through-hole with spiral shape

A multiple-electron-beam-image acquisition apparatus includes an electromagnetic lens to receive and refract multiple electron beams, an aberration corrector, disposed in a magnetic field of the electromagnetic lens, to correct aberration of the multiple electron beams, an aperture-substrate, disposed movably at the upstream of the aberration corrector with respect to an advancing direction of the multiple electron beams, to selectively make an individual beam of the multiple electron beams pass therethrough independently, a movable stage to dispose thereon the aberration corrector, a stage control circuit, using an image caused by the individual beam selectively made to pass, to move the stage to align the position of the aberration corrector to the multiple electron beams having been relatively aligned with the electromagnetic lens, and a detector to detect multiple secondary electron beams emitted because the target object surface is irradiated with multiple electron beams having passed through the aberration corrector.

Multiple electron beam image acquisition apparatus, and alignment method of multiple electron beam optical system

A multiple-electron-beam irradiation apparatus includes a first electrostatic lens, configured using the substrate used as a bias electrode by being applied with a negative potential, a control electrode to which a control potential is applied and a ground electrode to which a ground potential is applied, configured to provide dynamic focusing of the multiple electron beams onto the substrate, in accordance with change of the height position of the surface of the substrate, by generating an electrostatic field, wherein the control electrode is disposed on an upstream side of a maximum magnetic field of the lens magnetic field of the first electromagnetic lens with respect to a direction of a trajectory central axis of the multiple electron beams, and a ground electrode is disposed on an upstream side of the control electrode with respect to the direction of the trajectory central axis.

Multiple electron beam irradiation apparatus, multiple electron beam irradiation method, and multiple electron beam inspection apparatus

A pattern width deviation measurement method includes measuring width dimensions of a plurality of figure patterns in an optical image from data of gray-scale value profiles of the optical image, using a threshold of a gray-scale value level variably set depending on design dimension information including design width dimension of a corresponding figure pattern of a plurality of figure patterns, and at which influence of a focus position on width dimension becomes smaller, measuring width dimensions of a plurality of corresponding figure patterns in a reference image from data of gray-scale value profiles of the reference image, respectively using the threshold for the corresponding figure pattern of a plurality of figure patterns, and calculating, for each of measured width dimensions of a plurality of figure patterns in the optical image, an amount deviated from a measured width dimension of a corresponding figure pattern in the reference image.

Method for measuring pattern width deviation, and pattern inspection apparatus

An access control apparatus includes an acquisition unit and a changing unit. The acquisition unit divides the data stored in a storage device, which is to be accessed from a plurality of access devices, into a plurality of data groups, and obtains the access frequencies of the individual data groups, which are based on accesses to the data belonging to the data groups. The changing unit changes, on the basis of the access frequencies of the individual data groups, definition of data groups accessible by the individual access devices such as to reduce a difference in total access frequency of accessible data groups among the plurality of access devices.

Method and apparatus for access control

Optical image data is acquired by irradiating a pattern with light emitted from a light source. A threshold value is specified by internally dividing a minimum value and a maximum value of a signal amount of reference image data by a division ratio. A position corresponding to a signal amount of a threshold value is determined as an edge of a pattern of the reference image data. A position of a signal amount equal to the threshold value is determined as an edge of the pattern of the optical image data. A line width error is obtained as a difference between a first line width of the optical image data and a second line width of the reference image data. A new threshold value is specified in the case of fluctuation of a light quantity of the light source or decrease of a contrast value of the optical image data.

Line width error obtaining method, line width error obtaining apparatus, and inspection system

A detachable storage unit is connected to host equipment in a computer system and holds an ejectable storage medium. The storage unit has a connection detector that detects whether or not the storage unit is connected to the host equipment, and a storage medium detector that detects the presence of a storage medium within the storage unit. A medium ejection instructor sends a medium ejection instruction to an automatic medium ejection mechanism upon receiving information that indicates that the storage medium might be moved. The storage medium is then ejected from the storage unit which prevents damage caused by the storage medium colliding with internal components of the storage unit while the storage unit is being moved.

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Yokohama, Japan

Kazuhiko Inoue