Fujitsu Corporation

Sony Corporation

Kazuhiko Iijima

Yasuhiro Yoneda

Toshihiro Kusagaya

Daisuke Mizutani

Yuji Suwa

Kenichiro Abe

Shuichi Oka

Shinji Rokuhara

Yasutomo Maehara

Kei Fukui

Keiji Arai

Kazuya Arai

Koji Komemura

Katsumi Uchikawa

Souichi Obata

Naoto Maezawa

A wiring substrate includes a laminated sheet including a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern. The first conductor pattern, the inorganic dielectric layer, and the second conductor pattern are laminated in this order. Also, the first conductor pattern is divided into a plurality of regions.

Wiring substrate and manufacturing method of wiring substrate

An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board with an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

Multilayer wiring circuit board

An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

A multi-layer wiring board is produced by laminating a plurality of insulating layers having conductor circuits, wherein the conductor circuits of the insulating layers are electrically connected together through via-holes in insulating connection layers having no conductor circuit, and the regions other than the conductor circuits of the insulating layers and the regions other than the via-holes of the connection layers are directly joined together by press-adhering the insulating resins that constitute the respective layers.

Multi-layer wiring board and method of producing same

A multilayer printed circuit board is provided which includes a base member having a surface provided with a base wiring pattern, an inner buildup layer laminated on the base member and having a surface formed with an inner buildup wiring pattern, and an outer buildup layer laminated on the surface of the inner buildup layer and having a surface formed with an outer buildup wiring pattern. The wiring patterns are electrically connected to each other through vias. The inner buildup layer is formed of a resin material which is not reinforced by glass fibers, whereas the outer buildup layer is formed of a resin material reinforced by glass fibers.

Multilayer printed circuit board and method of making the same

Growing community of inventors

Kawasaki, Japan

Kazuhiko Iijima